Patents by Inventor Daizou Baba

Daizou Baba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • RESIN POWDER, SEALING MATERIAL, ELECTRONIC COMPONENT, AND RESIN POWDER MANUFACTURING METHOD
    Publication number: 20210002434
    Abstract: Resin powder includes aggregates of spherical particles of a resin composition. The resin composition contains: a resin component including a thermosetting resin; and a non-resin component including at least one electrically insulative inorganic particle and/or at least one magnetic particle.
    Type: Application
    Filed: March 18, 2019
    Publication date: January 7, 2021
    Applicant: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Takanori TSUZUKI, Junichi TAKASHIRO, Daizou BABA
  • Wiring board sheet and its manufacturing method, multilayer board and its manufacturing method
    Patent number: 7080446
    Abstract: A wiring board sheet which enables the miniaturization of a wiring board by mounting electric components (10) in an insulation layer (4) to increase the quantity of mounting electric components, has a high reliability, and undergoes a complicated manufacturing process, and a method for manufacturing the wiring board sheet A multilayer board which is mannufactured from this wiring board sheet, eliminates a difference in thermal histories during molding in each layer, simplifies the manufacturing process, and realize miniaturization by the scale-down and high-density of a conductor circuit and an improvement in reliability, and a method for manufacturing the multilayer board.
    Type: Grant
    Filed: October 28, 2002
    Date of Patent: July 25, 2006
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Daizou Baba, Naohito Fukuya, Tatsuo Hirabayashi
  • Wiring board sheet and its manufacturing method,multilayer board and its manufacturing method
    Publication number: 20050118750
    Abstract: A wiring board sheet which enables the miniaturization of a wiring board by mounting electric components (10) in an insulation layer (4) to increase the quantity of mounting electric components, has a high reliability, and undergoes a complicated manufacturing process, and a method for manufacturing the wiring board sheet A multilayer board which is manufactured from this wiring board sheet, eliminates a difference in thermal histories during molding in each layer, simplifies the manufacturing process, and realize miniaturization by the scale-down and high-density of a conductor circuit and an improvement in reliability, and a method for manufacturing the multilayer board.
    Type: Application
    Filed: October 28, 2002
    Publication date: June 2, 2005
    Inventors: Daizou Baba, Naohito Fukuya, Tatsuo Hirabayashi