Patents by Inventor Dakai WANG

Dakai WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220385081
    Abstract: Various examples are provided for high voltage isolation. The isolation can be provided for discrete non-isolated devices using an electrically isolating substrate that is thermally conductive. In one example, a module includes a plurality of switching devices connected in series; one or more rubber buffer disposed between switching device pairs of the plurality of switching devices; and thermal interfaces disposed between switching devices of the switching device pairs and cooling surfaces of the module, the thermal interfaces electrically isolating the switching devices from the cooling surface. In another example, an extreme fast charger (EFC) station includes an active front end (AFE) module that includes at least one module, where the module is a half-bridge power module. The EFC station can include a dual-active-bridge (DAB) high voltage (HV) module that includes at least one module, where the module is a half-bridge power module.
    Type: Application
    Filed: May 31, 2022
    Publication date: December 1, 2022
    Inventors: Wensong Yu, Dakai Wang, Srdjan Miodrag Lukic
  • Patent number: 11472157
    Abstract: A bionic flexible actuator with a real-time feedback function and a preparation method thereof. The method includes: preparing stimuli-response layer and bionic flexible strain-sensor film layer, arranging bionic V-shaped groove array structure on bionic flexible strain-sensor film layer, and sticking bionic flexible strain-sensor film layer onto stimuli-response layer through adhesive layer; stimuli-response layer is prepared by adopting following steps: mixing multi-walled carbon nanotubes and polyvinylidene fluoride after being dissolved in a solvent respectively and obtaining a mixed solution; performing a film formation process to mixed solution and embedding a first electrode to obtain stimuli-response layer.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: October 18, 2022
    Assignee: JILIN UNIVERSITY
    Inventors: Zhiwu Han, Linpeng Liu, Junqiu Zhang, Dakai Wang, Tao Sun, Kejun Wang, Shichao Niu, Tao Hou
  • Patent number: 11456409
    Abstract: A micro-vibration sensor and preparation method thereof. The method includes a metal sheet is coated with first curing material, and first curing material is cured into first cured layer; piezoelectric thin film element is attached to edge of first cured layer; one side, attached with piezoelectric thin film element, of first cured layer is vertically placed into second curing material, and second curing material is cured into second cured layer; and metal sheet is removed to obtain micro-vibration sensor. Due to fact that piezoelectric thin film element is arranged at a crack tip, during micro-vibration, stress in stress field of crack tip is rapidly increased due to crack stress deformation, and stress signal is efficiently converted into electric signal; and micro-vibration sensor has characteristics of being low in detection limit and high in accuracy.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: September 27, 2022
    Assignee: JILIN UNIVERSITY
    Inventors: Zhiwu Han, Kejun Wang, Honglie Song, Junqiu Zhang, Daobing Chen, Linpeng Liu, Binjie Zhang, Tao Sun, Dakai Wang, Changchao Zhang
  • Publication number: 20210207939
    Abstract: A bionic flexible actuator with a real-time feedback function and a preparation method thereof. The method includes: preparing stimuli-response layer and bionic flexible strain-sensor film layer, arranging bionic V-shaped groove array structure on bionic flexible strain-sensor film layer, and sticking bionic flexible strain-sensor film layer onto stimuli-response layer through adhesive layer; stimuli-response layer is prepared by adopting following steps: mixing multi-walled carbon nanotubes and polyvinylidene fluoride after being dissolved in a solvent respectively and obtaining a mixed solution; performing a film formation process to mixed solution and embedding a first electrode to obtain stimuli-response layer.
    Type: Application
    Filed: October 30, 2019
    Publication date: July 8, 2021
    Applicant: JILIN UNIVERSITY
    Inventors: Zhiwu HAN, Linpeng LIU, Junqiu ZHANG, Dakai WANG, Tao SUN, Kejun WANG, Shichao NIU, Tao HOU
  • Publication number: 20210175411
    Abstract: A micro-vibration sensor and preparation method thereof. The method includes a metal sheet is coated with first curing material, and first curing material is cured into first cured layer; piezoelectric thin film element is attached to edge of first cured layer; one side, attached with piezoelectric thin film element, of first cured layer is vertically placed into second curing material, and second curing material is cured into second cured layer; and metal sheet is removed to obtain micro-vibration sensor. Due to fact that piezoelectric thin film element is arranged at a crack tip, during micro-vibration, stress in stress field of crack tip is rapidly increased due to crack stress deformation, and stress signal is efficiently converted into electric signal; and micro-vibration sensor has characteristics of being low in detection limit and high in accuracy.
    Type: Application
    Filed: October 31, 2019
    Publication date: June 10, 2021
    Applicant: JILIN UNIVERSITY
    Inventors: Zhiwu HAN, Kejun WANG, Honglie SONG, Junqiu ZHANG, Daobing CHEN, Linpeng LIU, Binjie ZHANG, Tao SUN, Dakai WANG, Changchao ZHANG