Abstract: A substrate inspection apparatus according to an embodiment of the present invention comprises a projection unit, an illumination unit, an image acquisition unit and a processing unit. The projection unit irradiates an inspection target with light for obtaining three-dimensional shape information of the inspection target. The illumination unit irradiates the inspection target with at least two lights having different colors. The image acquisition unit acquires a first image by receiving light irradiated by the projection unit and reflected from the inspection target, and a second image by receiving the lights irradiated by the illumination unit and reflected from the inspection target. The processing unit acquires brightness information and color information from the first image and the second image, respectively, which are acquired by the image acquisition unit, and acquires at least a portion of a boundary by using the bright information and the color information.

Abstract: A substrate inspection apparatus according to an embodiment of the present invention comprises a projection unit, an illumination unit, an image acquisition unit and a processing unit. The projection unit irradiates an inspection target with light for obtaining three-dimensional shape information of the inspection target. The illumination unit irradiates the inspection target with at least two lights having different colors. The image acquisition unit acquires a first image by receiving light irradiated by the projection unit and reflected from the inspection target, and a second image by receiving the lights irradiated by the illumination unit and reflected from the inspection target. The processing unit acquires brightness information and color information from the first image and the second image, respectively, which are acquired by the image acquisition unit, and acquires at least a portion of a boundary by using the bright information and the color information.

Abstract: A measurement apparatus for measuring a substrate, on which a measurement object is formed, and a correction method of the same is shown. The correction method includes measuring a reference phase by measuring a phase of a substrate for measuring the reference phase by using an image-capture part, acquiring a tilted pose of a reference plane of the measured reference phase to an image plane of the image-capture part, and calculating a height that is required to correct the reference plane with regard to the image-capture part based on the tilted pose. Therefore, based on a tilted pose of a reference phase in order to correct a reference plane being a reference of measuring a height, a measurement credibility of the measurement object may be improved.

Abstract: A method of discriminating a region and a method of measuring a three dimensional shape are disclosed. The method includes irradiating light onto a substrate having a measurement target formed thereon to capture an image by receiving light reflected by the substrate, setting up an object region in which the measurement target is disposed and a ground region corresponding to a remaining region in an inspection region of the image, irradiating a grating patterned light onto the substrate having the measurement target formed thereon to capture a patterned image by receiving the grating patterned light reflected by the substrate, and obtaining height of each position in the inspection region by using the patterned image to establish a ground height with respect to the measurement target with a height of the ground region.

Abstract: A measurement apparatus for measuring a substrate, on which a measurement object is formed, and a correction method of the same is shown. The correction method includes measuring a reference phase by measuring a phase of a substrate for measuring the reference phase by using an image-capture part, acquiring a tilted pose of a reference plane of the measured reference phase to an image plane of the image-capture part, and calculating a height that is required to correct the reference plane with regard to the image-capture part based on the tilted pose. Therefore, based on a tilted pose of a reference phase in order to correct a reference plane being a reference of measuring a height, a measurement credibility of the measurement object may be improved.

Abstract: A substrate inspection apparatus for inspecting a substrate, on which a measurement object is formed, is shown. The substrate inspection method includes measuring a substrate, on which a measurement object is formed, generating a plane equation of the substrate, and acquiring a region of the measurement object formed on the substrate. After, by considering a height of measurement object a region of the measurement object is converted into a substrate plane by plane equation,. Then, the measurement object is inspected based on a region of the measurement object converted into a substrate plane by plane equation and a region of the measurement object by reference data. Therefore, an offset value of a measurement object is acquired according to a tilted pose of the substrate, and a distortion of measurement data is compensated by using the offset value, to improve a measurement credibility of a measurement object.

Abstract: A method of discriminating a region and a method of measuring a three dimensional shape are disclosed. The method includes irradiating light onto a substrate having a measurement target formed thereon to capture an image by receiving light reflected by the substrate, setting up an object region in which the measurement target is disposed and a ground region corresponding to a remaining region in an inspection region of the image, irradiating a grating patterned light onto the substrate having the measurement target formed thereon to capture a patterned image by receiving the grating patterned light reflected by the substrate, and obtaining height of each position in the inspection region by using the patterned image to establish a ground height with respect to the measurement target with a height of the ground region.