Patents by Inventor Dal HEO
Dal HEO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250019135Abstract: A sealing structure may include a lid including a first lid face, a second lid face opposite to the first lid face, and a fragile area between the first lid face and the second lid face, a cover including a first cover face facing the second lid face and covering the fragile area and a second cover face opposite to the first cover face, wherein a first distance between the second lid face and the first cover face is substantially equal to or less than a second distance between the first cover face and the second cover face, and a connector configured to connect the lid and the cover.Type: ApplicationFiled: September 30, 2024Publication date: January 16, 2025Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Wooram HONG, Hyun Do CHOI, Dal HEO, Youngchun KWON, Hyukju KWON, Gahee KIM, Bosung KIM, Jeonghun KIM, Jin Woo KM, Min Sik PARK, Youngjin PARK, Hyungtae SEO, Won Seok OH, Dongseon LEE, Sangyoon LEE, Jaejun CHANG, Jun Won JANG, Hyunjeong JEON, Joon-Kee CHO, Byung-Kwon CHOI, Won Je CHOI, Younsuk CHOI, Taesin HA
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Patent number: 12145782Abstract: A sealing structure may include a lid including a first lid face, a second lid face opposite to the first lid face, and a fragile area between the first lid face and the second lid face, a cover including a first cover face facing the second lid face and covering the fragile area and a second cover face opposite to the first cover face, wherein a first distance between the second lid face and the first cover face is substantially equal to or less than a second distance between the first cover face and the second cover face, and a connector configured to connect the lid and the cover.Type: GrantFiled: March 7, 2022Date of Patent: November 19, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Wooram Hong, Hyun Do Choi, Dal Heo, Youngchun Kwon, Hyukju Kwon, Gahee Kim, Bosung Kim, Jeonghun Kim, Jin Woo Kim, Min Sik Park, Youngjin Park, Hyungtae Seo, Won Seok Oh, Dongseon Lee, Sangyoon Lee, Jaejun Chang, Jun-Won Jang, Hyunjeong Jeon, Joon-Kee Cho, Byung-Kwon Choi, Won Je Choi, Younsuk Choi, Taesin Ha
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Patent number: 12135170Abstract: A heat exchanger is provided. The heat exchanger includes a target area that is a target for heat exchange; and a flow path structure. The flow path structure includes at least one inlet; at least one outlet; a first flow path connected to each of the at least one inlet and the at least one outlet, and extending along a first side of the target area; and a second flow path connected to each of the at least one inlet and the at least one outlet, and extending along a second side, different from the first side, of the target area.Type: GrantFiled: August 15, 2022Date of Patent: November 5, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Wooram Hong, Hyun Do Choi, Dal Heo, Youngchun Kwon, Hyukju Kwon, Gahee Kim, Bosung Kim, Jeonghun Kim, Jin Woo Kim, Min Sik Park, Youngjin Park, Hyungtae Seo, Won Seok Oh, Dongseon Lee, Sangyoon Lee, Jaejun Chang, Jun-Won Jang, Hyunjeong Jeon, Joon-Kee Cho, Byung-Kwon Choi, Won Je Choi, Younsuk Choi, Taesin Ha
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Publication number: 20230366714Abstract: A liquid supply apparatus includes: a chamber configured to contain a liquid; an injector disposed on a first side of the chamber and configured to spray the liquid; and a piston extending from a second side of the chamber toward an interior of the chamber, wherein the chamber includes a first area configured to store the liquid; and a second area between the first area and the injector, and wherein the piston is configured to selectively seal or transfer the liquid between the first area and the second area, and press the liquid in the second area to expel the liquid from the liquid supply apparatus.Type: ApplicationFiled: January 17, 2023Publication date: November 16, 2023Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Won Je CHOI, Hyungtae SEO, Wooram HONG, Jeonghun KIM, Taesin HA, Youngjin PARK, Hyun Do CHOI, Dal HEO
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Publication number: 20230366487Abstract: A fluid supply system may include: a tube configured to allow a fluid to flow through the tube; a housing including a storage space configured to store at least a portion of the tube, and an outlet which allows the tube to extend from the storage space; a support portion configured to support at least a portion of the tube in the storage space, and configured to move from an initial position of the support portion towards the outlet based on a degree of extension of the tube from the outlet; and a position maintaining portion connected to the support portion and configured to apply a restoring force to the support portion to return the support portion to the initial position.Type: ApplicationFiled: April 12, 2023Publication date: November 16, 2023Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Dal Heo, Youngjin Park, Wooram Hong
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Publication number: 20230184490Abstract: A heat exchanger is provided. The heat exchanger includes a target area that is a target for heat exchange; and a flow path structure. The flow path structure includes at least one inlet; at least one outlet; a first flow path connected to each of the at least one inlet and the at least one outlet, and extending along a first side of the target area; and a second flow path connected to each of the at least one inlet and the at least one outlet, and extending along a second side, different from the first side, of the target area.Type: ApplicationFiled: August 15, 2022Publication date: June 15, 2023Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Wooram HONG, Hyun Do CHOI, Dal HEO, Youngchun KWON, Hyukju KWON, Gahee KIM, Bosung KIM, Jeonghun KIM, Jin Woo KIM, Min Sik PARK, Youngjin PARK, Hyungtae SEO, Won Seok OH, Dongseon LEE, Sangyoon LEE, Jaejun CHANG, Jun-Won JANG, Hyunjeong JEON, Joon-Kee CHO, Byung-Kwon CHOI, Won Je CHOI, Younsuk CHOI, Taesin HA
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Publication number: 20230089079Abstract: A sealing structure may include a lid including a first lid face, a second lid face opposite to the first lid face, and a fragile area between the first lid face and the second lid face, a cover including a first cover face facing the second lid face and covering the fragile area and a second cover face opposite to the first cover face, wherein a first distance between the second lid face and the first cover face is substantially equal to or less than a second distance between the first cover face and the second cover face, and a connector configured to connect the lid and the cover.Type: ApplicationFiled: March 7, 2022Publication date: March 23, 2023Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Wooram HONG, Hyun Do Choi, Dal Heo, Youngchun Kwon, Hyukju Kwon, Gahee Kim, Bosung Kim, Jeonghun Kim, Jin Woo Kim, Min Sik Park, Youngjin Park, Hyungtae Seo, Won Seok Oh, Dongseon Lee, Sangyoon Lee, Jaejun Chang, Jun-Woon Jang, Hyunjeong Jeon, Joon-Kee Cho, Byung-Kwon Choi, Won Je Choi, Younsuk Choi, Taesin Ha
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Publication number: 20220319642Abstract: A material synthesis apparatus includes: at least one device configured to synthesize a material; a user interface configured to obtain information on a target product; and a processor, wherein the processor is configured to: determine synthesis conditions for preparing the target product using a pretrained synthesis prediction model; calculate a first synthesis method for preparing the target product based on the synthesis conditions; and control the at least one device based on the first synthesis method.Type: ApplicationFiled: October 21, 2021Publication date: October 6, 2022Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Dongseon LEE, Taesin HA, Younsuk CHOI, Jeonghun KIM, Wonseok OH, Hyunjeong JEON, Byungkwon CHOI, Youngchun KWON, Hyukju KWON, Gahee KIM, Bosung KIM, Eunji KIM, Minsik MIN, Minsik PARK, Youngjin PARK, Jinwoo PARK, Hyungtae SEO, Sangyoon LEE, Jaejun CHANG, Junwon JANG, Aram JEON, Yongsik JUNG, Joonkee CHO, Wonje CHOI, Hyundo CHOI, Dal HEO, Wooram HONG
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Patent number: 8859663Abstract: The present invention relates to a calcium carbonate having a surface charge, the preparing process thereof and filler for producing a paper using the same. The present invention provides the process of preparing a calcium carbonate having a surface charge, characterized in that it comprises the following steps of: preparing a solution mixture of one or more monomer selected from the group consisting of calcium hydroxide, acrylic acid, acrylamide, or [2-(acryloyloxy)ethyl]-trimethylammonium chloride; removing dissolved gases such as oxygen and carbon dioxide in the said solution by injecting nitrogen (N2) gas; adjusting pH of the said solution; and inducing a reaction by adding polymerization initiator of a high molecule while injecting carbon dioxide to the said mixture.Type: GrantFiled: March 21, 2012Date of Patent: October 14, 2014Assignee: Hankuk Paper Mfg. Co., Ltd.Inventors: Dong Ho Yoon, Seong Dal Heo, Seung Suk Seo, In Woo Cheong
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Publication number: 20130164206Abstract: The present invention relates to a calcium carbonate having a surface charge, the preparing process thereof and filler for producing a paper using the same. The present invention provides the process of preparing a calcium carbonate having a surface charge, characterized in that it comprises the following steps of: preparing a solution mixture of one or more monomer selected from the group consisting of calcium hydroxide, acrylic acid, acrylamide, or [2-(acryloyloxy)ethyl]-trimethylammonium chloride; removing dissolved gases such as oxygen and carbon dioxide in the said solution by injecting nitrogen (N2) gas; adjusting pH of the said solution; and inducing a reaction by adding polymerization initiator of a high molecule while injecting carbon dioxide to the said mixture.Type: ApplicationFiled: March 21, 2012Publication date: June 27, 2013Applicant: HANKUK PAPER MFG, CO, LTD.Inventors: Dong Ho YOON, Seoung Dal HEO, Seung Suk SEO, In Woo CHEONG