Abstract: A compression molding method reduces or removes adhesion property between a mold substrate and a high polymer material, which is to be imprinted with a pattern from the mold substrate. Accordingly, a pattern having increased granularity to tens of A can be obtained for application to fabrication processes of semiconductor devices and electronic products. The compression molding method can use a patterned mold and preferably a high polymer material to be imprinted with the pattern. The method can further include heating one of the mold and the high polymer material, compression-molding the mold and the high polymer material, cooling the heated one for a prescribed time and separating the high polymer material and the mold from each other.