Abstract: An electronic connector for connecting a coaxial cable to a microstrip transmission line or to a coplanar transmission line. The connector has a transition length which is long enough to be treated as a transmission line rather than as a lumped element. In one embodiment, the transition is linear. In a optimal embodiment for minimal distortion, the transition follows a cosine shape.

Abstract: A probe fixture for making multiple high frequency connections to an electronic device under test. An application for the apparatus is in integrated circuit wafer testing fixtures requiring high frequency signals. Low frequency signals are attached by ribbon cables to a printed circuit board. High frequency signals use coaxial cables. A probe carrying ceramic substrate has microstrips for the high frequency signals. Low frequency signals are connected from the printed circuit board to the ceramic substrate by a conductive elastomer interconnect strip clamped between the printed circuit board and the substrate. Coaxial adapters passing through the printed circuit board have spring loaded center conductors to provide pressure contact between the coaxial cables and microstrip signal strips. In one embodiment, contact between coaxial cable shields and microstrip ground is through a conductive clamp to a substrate backplane.

Abstract: An integrated circuit packaging system with an integrated circuit die mounted onto a substrate having a top side ground plane between the integrated circuit and the substrate, a bottom side ground plane and short high frequency connections between the two ground planes. The top side ground plane decreases signal degradation due to reflections by providing high frequency ground access close to the die and by providing a transmission line for bond wires. A grid of conductive vias through the substrate improves thermal conductivity and provides the short high frequency current path for the top side ground plane. The die is separated from the top side ground plane by a dielectric layer which also has a conductive layer next the die to provide a back bias voltage.