Patents by Inventor Dale Dean Timm, Jr.

Dale Dean Timm, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bearing
    Patent number: 7695102
    Abstract: Embodiments of an apparatus including a rolling contact bearing are disclosed.
    Type: Grant
    Filed: April 12, 2005
    Date of Patent: April 13, 2010
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Tanya Schneider, Joseph E Scheffelin, Dale Dean Timm, Jr., Paul Mark Haines, Ronald J. Ender, Craig Malik
  • Electrical circuit for printhead assembly
    Patent number: 6843552
    Abstract: A printhead assembly includes a carrier having a first side and a second side contiguous with the first side, a plurality of printhead dies each mounted on the first side of the carrier, an electrical circuit including a first portion disposed on the first side of the carrier and a second portion disposed on the second side of the carrier, and a plurality of electrical connectors each electrically coupled to the first portion of the electrical circuit and one of the printhead dies. The electrical circuit has a plurality of openings defined in the first portion thereof such that each of the openings are sized to accommodate one of the printhead dies, and has a first side facing the carrier and a second side opposite the first side thereof such that each of the electrical connectors are electrically coupled to the second side of the electrical circuit and one of the printhead dies.
    Type: Grant
    Filed: May 5, 2003
    Date of Patent: January 18, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: David McElfresh, Noah Carl Lassar, Mohammad Akhavain, Brian J. Keefe, Joseph E. Scheffelin, Janis Horvath, Dale Dean Timm, Jr.
  • Electrical circuit for wide-array inkjet printhead assembly
    Patent number: 6557976
    Abstract: A wide-array inkjet printhead assembly includes a carrier having a first side and a second side contiguous with the first side, and a plurality of printhead dies each mounted on the first side of the carrier. An electrical circuit is disposed on the first side and the second side of the carrier. As such, a plurality of electrical connectors are each electrically coupled to the electrical circuit and one of the printhead dies.
    Type: Grant
    Filed: February 14, 2001
    Date of Patent: May 6, 2003
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: David McElfresh, Noah Carl Lassar, Mohammad Akhavain, Brian J. Keefe, Joseph E. Scheffelin, Janis Horvath, Dale Dean Timm, Jr.
  • Coplanar mounting of printhead dies for wide-array inkjet printhead assembly
    Patent number: 6409307
    Abstract: An inkjet printhead assembly includes a substrate having a non-planar surface and a plurality of adhesive quantities each disposed on the non-planar surface of the substrate. As such, a plurality of printhead dies are each adhered to the non-planar surface of the substrate by one of the adhesive quantities. A thickness of at least one of the adhesive quantities varies from the thickness of another of the adhesive quantities such that the thickness of the adhesive quantities compensates for the non-planar surface of the substrate. Thus, the adhesive quantities support the printhead dies and establish a substantially coplanar relationship among the printhead dies.
    Type: Grant
    Filed: February 14, 2001
    Date of Patent: June 25, 2002
    Assignee: Hewlett-Packard Company
    Inventors: Mohammad Akhavain, Robert-Scott Melendrino Lopez, Dale Dean Timm, Jr., Janis Horvath, Noah Carl Lassar, David McElfresh, Brian J. Keefe, Joseph E. Scheffelin
  • Electrical interconnection for wide-array inkjet printhead assembly
    Patent number: 6394580
    Abstract: A wide-array inkjet printhead assembly includes a carrier including a substructure and a substrate mounted on the substructure, a plurality of printhead dies each mounted on the substrate, and an electrical interconnect adapted to communicate electrical signals between an electronic controller and the inkjet printhead assembly. The substrate has an electrical circuit formed therein such that the printhead dies are electrically coupled to the electrical circuit and the electrical interconnect is electrically coupled to the electrical circuit. As such, the substructure accommodates the electrical interconnect.
    Type: Grant
    Filed: March 20, 2001
    Date of Patent: May 28, 2002
    Assignee: Hewlett-Packard Company
    Inventors: Joseph E. Scheffelin, Ernesto A. Garay, Gerald Vincent Rapp, Dale Dean Timm, Jr.