Abstract: In order to secure a cylindrically shaped inertial instrument transducer such as an accelerometer within a cylindrically shaped housing so as to minimize thermal and mechanical stresses on the transducer, a disk of thermally conductive, compliant adhesive film is used to bond one end of the transducer to the bottom of the housing. The disk can also be composed of a ceramic layer of alumina interposed between two layers of the adhesive film. To provide additional strength, a series of micro dots of epoxy resin located around the periphery of the upper surface of the transducer can be used to bond the transducer to the inner sidewall of the housing.