Abstract: A method of forming a leadframe package, a leadframe package formed according to the method, and a system incorporating the leadframe package. The leadframe package includes: a metallization layer comprising a paddle portion and a contact portion including contact leads; a die mounted onto the paddle portion; wirebonds connected between the die and respective ones of the contact leads; an overmold encapsulating the die, the paddle portion, the contact leads and the wirebonds; and a stiffening element encapsulated in the overmold and unconnected to electrical pathways within the leadframe package.

Abstract: A method of forming a leadframe package, a leadframe package formed according to the method, and a system incorporating the leadframe package. The leadframe package includes: a metallization layer comprising a paddle portion and a contact portion including contact leads; a die mounted onto the paddle portion; wirebonds connected between the die and respective ones of the contact leads; an overmold encapsulating the die, the paddle portion, the contact leads and the wirebonds; and a stiffening element encapsulated in the overmold and unconnected to electrical pathways within the leadframe package.

Abstract: Embodiments of the invention provide a microelectronic device having a heat spreader positioned between a chip and substrate to which the chip is electrically connected. For one embodiment of the invention, the heat spreader is a thermal slug having a coefficient of thermal expansion approximately equal to the coefficient of thermal expansion of the chip.

Abstract: A wire-bonding substrate is described. The wire-bonding substrate includes a copper metallization and a gold surface finish disposed above and on the copper metallization. The gold surface finish completes a structure that includes at least one of a bond finger for wire bonding of a first side of the substrate, and a land pad for a ball attach on a second side of the substrate. A process of forming the surface finish is also disclosed. An electronic package is also disclosed that uses the surface finish on the wire-bonding substrate. A method of assembling an electronic package is also disclosed that includes the surface finish on the wire-bonding substrate. A computing system is also described that includes the surface finish on the wire-bonding substrate.

Abstract: Embodiments of the invention provide a microelectronic device having a heat spreader positioned between a chip and substrate to which the chip is electrically connected. For one embodiment of the invention, the heat spreader is a thermal slug having a coefficient of thermal expansion approximately equal to the coefficient of thermal expansion of the chip.

Abstract: A wire-bonding substrate is described. The wire-bonding substrate includes a copper metallization and a gold surface finish disposed above and on the copper metallization. The gold surface finish completes a structure that includes at least one of a bond finger for wire bonding of a first side of the substrate, and a land pad for a ball attach on a second side of the substrate. A process of forming the surface finish is also disclosed. An electronic package is also disclosed that uses the surface finish on the wire-bonding substrate. A method of assembling an electronic package is also disclosed that includes the surface finish on the wire-bonding substrate. A computing system is also described that includes the surface finish on the wire-bonding substrate.

Abstract: A wire-bonding substrate is described. The wire-bonding substrate includes a copper metallization and a gold surface finish disposed above and on the copper metallization. The gold surface finish completes a structure that includes at least one of a bond finger for wire bonding of a first side of the substrate, and a land pad for a ball attach on a second side of the substrate. A process of forming the surface finish is also disclosed. An electronic package is also disclosed that uses the surface finish on the wire-bonding substrate. A method of assembling an electronic package is also disclosed that includes the surface finish on the wire-bonding substrate. A computing system is also described that includes the surface finish on the wire-bonding substrate.

Abstract: An integrated circuit package that contains a heat spreader which has a plurality of legs stamped from a sheet of metal material. The heat spreader also has a plurality of slots which allow plastic to flow between the bonding wires of the integrated circuit assembly during the molded injection process of the package.