Patents by Inventor Dale L. Capewell

Dale L. Capewell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7024074
    Abstract: A system and method of monitoring a laser output power and laser extinction ratio includes an optical subassembly physically placed between a point light source and a optical fiber device. The optical subassembly creates a convergent light beam by reflecting a collimated light beam from the point light source off an interior surface of a first side of the optical subassembly. The optical subassembly creates an incident ray of the convergent light beam by including on a second side of the optical subassembly a wedge-shaped air gap.
    Type: Grant
    Filed: March 28, 2005
    Date of Patent: April 4, 2006
    Assignee: Intel Corporation
    Inventor: Dale L. Capewell
  • Patent number: 6974168
    Abstract: Embodiments of the present invention overcome the disadvantages of the metal bond head systems while also providing a method for performing precision die bond of multiple die at once. A mounting system is adapted for simultaneous high accuracy placement of multiple semiconductor components or dies on substrates. Simultaneous high accuracy multiple die placement is achieved by providing a mounting head assembly, including a see-through (ST) bond head with selectively and independently controlled gripping mechanisms, with moving and/or adjusting mechanisms adapted for accurate alignment of semiconductor components relative to a substrate in all directions.
    Type: Grant
    Filed: September 30, 2002
    Date of Patent: December 13, 2005
    Assignee: Intel Corporation
    Inventor: Dale L. Capewell
  • Patent number: 6769816
    Abstract: An integrated zig-zag transceiver module for multiplexing and demultiplexing several wavelengths achieves a high level of integration by combining several electronic and optical elements into TO headers with lids. A photodetector, a transimpedance amplifier (TIA), a lens, and a thin-film filter are integrated into a single TO can, with the filter and lens being designed for off-axis illumination and focusing. A VCSEL, a lens, and a thin-film filter are integrated into a single TO can, with the filter and lens being designed for off-axis beam steering and collimation.
    Type: Grant
    Filed: August 28, 2002
    Date of Patent: August 3, 2004
    Assignee: Intel Corporation
    Inventors: Dale L. Capewell, Sam Beizai, Siva Yegnanarayanan
  • Patent number: 6751379
    Abstract: A connector to an optical fiber comprises a prism, a ferrule and an aspheric lens. The prism includes a triangular wedge element having a first surface, a second surface and a base. The ferrule guides the optical fiber so as to contact the optical fiber with the first surface of the prism. The aspheric lens is integrated on the second surface, the integrated aspheric lens being positioned so that the prism serves to redirect a light beam at an angle relative to an axis of the optical source input through total internal reflection by utilizing the base of the triangle wedge element. The aspheric lens serves to collimate the redirected light beam or focus the light beam before being redirected. This arrangement may, for example, be used within a WDM system to multiplex and de-multiplex several wavelengths of light, using a “zig-zag” optical path configuration and thin film filters to separate the wavelengths.
    Type: Grant
    Filed: October 31, 2001
    Date of Patent: June 15, 2004
    Assignee: Intel Corporation
    Inventors: Dale L Capewell, Sam Beizai
  • Publication number: 20040061346
    Abstract: Embodiments of the present invention overcome the disadvantages of the metal bond head systems while also providing a method for performing precision die bond of multiple die at once. A mounting system is adapted for simultaneous high accuracy placement of multiple semiconductor components or dies on substrates. Simultaneous high accuracy multiple die placement is achieved by providing a mounting head assembly, including a see-through (ST) bond head with selectively and independently controlled gripping mechanisms, with moving and/or adjusting mechanisms adapted for accurate alignment of semiconductor components relative to a substrate in all directions.
    Type: Application
    Filed: September 30, 2002
    Publication date: April 1, 2004
    Applicant: Intel Corporation
    Inventor: Dale L. Capewell
  • Publication number: 20040042736
    Abstract: An integrated zig-zag transceiver module for multiplexing and demultiplexing several wavelengths achieves a high level of integration by combining several electronic and optical elements into TO headers with lids. A photodetector, a transimpedance amplifier (TIA), a lens, and a thin-film filter are integrated into a single TO can, with the filter and lens being designed for off-axis illumination and focusing. A VCSEL, a lens, and a thin-film filter are integrated into a single TO can, with the filter and lens being designed for off-axis beam steering and collimation.
    Type: Application
    Filed: August 28, 2002
    Publication date: March 4, 2004
    Applicant: Intel Corporation
    Inventors: Dale L. Capewell, Sam Beizai, Siva Yegnanarayanan
  • Patent number: 6580863
    Abstract: Optical filters in, for example, a wavelength division multiplexing (WDM) fiber optic system or an optical waveguide device are utilized and provided. The optical waveguide device comprises a lower substrate layer, an insulating dielectric layer and a waveguide ribs layer. The insulating dielectric layer, having a first refractive index, is positioned above the lower substrate layer. The waveguide ribs layer, having a second different refractive index, is positioned above the dielectric layer. An optical waveguide is formed from the waveguide ribs layer for transmission of light. In the waveguide ribs layer, an optical filter structure formed, wherein the optical filter structure is integrated onto the same substrate as the optical waveguide.
    Type: Grant
    Filed: October 31, 2001
    Date of Patent: June 17, 2003
    Assignee: Intel Corporation
    Inventors: Sivasubramaniam S Yegnanarayanan, Dale L Capewell
  • Publication number: 20030081924
    Abstract: Optical filters in, for example, a wavelength division multiplexing (WDM) fiber optic system or an optical waveguide device are utilized and provided. The optical waveguide device comprises a lower substrate layer, an insulating dielectric layer and a waveguide ribs layer. The insulating dielectric layer, having a first refractive index, is positioned above the lower substrate layer. The waveguide ribs layer, having a second different refractive index, is positioned above the dielectric layer. An optical waveguide is formed from the waveguide ribs layer for transmission of light. In the waveguide ribs layer, an optical filter structure formed, wherein the optical filter structure is integrated onto the same substrate as the optical waveguide.
    Type: Application
    Filed: October 31, 2001
    Publication date: May 1, 2003
    Inventors: Sivasubramaniam S. Yegnanarayanan, Dale L. Capewell
  • Publication number: 20020064191
    Abstract: A connector to an optical fiber comprises a prism, a ferrule and an aspheric lens. The prism includes a triangular wedge element having a first surface, a second surface and a base. The ferrule guides the optical fiber so as to contact the optical fiber with the first surface of the prism. The aspheric lens is integrated on the second surface, the integrated aspheric lens being positioned so that the prism serves to redirect a light beam at an angle relative to an axis of the optical source input through total internal reflection by utilizing the base of the triangle wedge element. The aspheric lens serves to collimate the redirected light beam or focus the light beam before being redirected. This arrangement may, for example, be used within a WDM system to multiplex and de-multiplex several wavelengths of light, using a “zig-zag” optical path configuration and thin film filters to separate the wavelengths.
    Type: Application
    Filed: October 31, 2001
    Publication date: May 30, 2002
    Applicant: Intel Corporation
    Inventors: Dale L. Capewell, Sam Beizai