Abstract: Surfactants useful for enhancing the electrical conduction of electrodes attached to the surface of a patient. The surfactants are also useful in transport of materials in and out of the body of a patient (animal or human) and in the measurement of disease states. Typical surfactants particularly useful in the invention are broadly represented by protein/fatty acid based compounds. The protein/fatty acid compounds may be lipopolypeptides. In some embodiments the lipopolypeptides may be acyl peptides. Typical acyl peptides are Lamepon S™, MayTein C™ and MayTein CT™.

Abstract: Surfactants useful for enhancing the electrical conduction of electrodes attached to the surface of a patient. The surfactants are also useful in transport of materials in and out of the body of a patient (animal or human) and in the measurement of disease states. Typical surfactants particularly useful in the invention are broadly represented by protein/fatty acid based compounds. The protein/fatty acid compounds may be lipopolypeptides. In some embodiments the lipopolypeptides may be acyl peptides. Typical acyl peptides are Lamepon S™, MayTein C™ and MayTein CT™.

Abstract: A leak in an enclosure of an integrated circuit package is detected by the steps of: filling the enclosure with a first gas at the time the enclosure is sealed; subsequently enveloping the integrated circuit package with a second gas that is different than the first gas; holding the second gas at a constant pressure over a certain time period; and sensing a surface of the enclosure, during the above steps, for the presence of microscopic deflections. If the enclosure has a gross leak, no deflection will occur when the package is initially enveloped with the second gas. If the package has a minor leak, a deflection will occur when the package is initially enveloped with the second gas, and the amount of the deflection will decrease during the holding time period.

Abstract: A magnetically sealed integrated circuit package includes a substrate having a cavity for holding multiple integrated circuit die, a lid for covering the cavity to protect the die, a ferromagnetic seal ring which is fixed to the substrate around the die, and a magnet which is fixed to the lid and coincides in shape to the seal ring for magnetically attracting the seal ring to hold the lid in place when the lid covers the cavity.