Abstract: The present invention provides a method of fabricating a metal oxide semiconductor field effect transistor. The method includes the steps of forming a source region on a silicon carbide layer and annealing the source region. A gate oxide layer is formed on the source region and the silicon carbide layer. The method further includes providing a gate electrode on the gate oxide layer and disposing a dielectric layer on the gate electrode and the gate oxide layer. The method further includes etching a portion of the dielectric layer and a portion of the gate oxide layer to form sidewalls on the gate electrode. A metal layer is disposed on the gate electrode, the sidewalls and the source region. The method further includes forming a gate contact and a source contact by subjecting the metal layer to a temperature of at least about 800° C. The gate contact and the source contact comprise a metal silicide. The distance between the gate contact and the source contact is less than about 0.6 ?m.

Abstract: There are provided semiconductor structures and devices comprising silicon carbide (SiC) and methods for making the same. The structures and devices comprise a base or shielding layer, channel and surface layer, all desirably formed via ion implantation. As a result, the structures and devices provided herein are hard, “normally off” devices, i.e., exhibiting threshold voltages of greater than about 3 volts.

Abstract: The present invention provides a method of fabricating a metal oxide semiconductor field effect transistor. The method includes the steps of forming a source region on a silicon carbide layer and annealing the source region. A gate oxide layer is formed on the source region and the silicon carbide layer. The method further includes providing a gate electrode on the gate oxide layer and disposing a dielectric layer on the gate electrode and the gate oxide layer. The method further includes etching a portion of the dielectric layer and a portion of the gate oxide layer to form sidewalls on the gate electrode. A metal layer is disposed on the gate electrode, the sidewalls and the source region. The method further includes forming a gate contact and a source contact by subjecting the metal layer to a temperature of at least about 800° C. The gate contact and the source contact comprise a metal silicide. The distance between the gate contact and the source contact is less than about 0.6 ?m.

Abstract: A photodiode device includes a silicon carbide photodiode including a second semiconductor layer on a first semiconductor layer and an integral aluminum gallium nitride filter on the second semiconductor layer. A method for fabricating a photodiode device for combustion flame temperature determination includes fabricating an integral filter over a silicon carbide photodiode. Examples of various filter fabrication techniques include growing an aluminum gallium nitride filter, fabricating a silicon oxynitride filter, and alternating thin film layers of silicon oxide and silicon nitride.

Abstract: An ultraviolet sensor monitors an effectiveness of ultraviolet lamps used in sterilization systems. The sensor includes an ultraviolet photodetector and a filter cooperating therewith configured for detecting light at wavelengths between 200-300 nm. A purification system for air or water utilizes the sensor in conjunction with an ultraviolet lamp directing ultraviolet light toward the air or water.

Abstract: A solid state optical spectrometer for combustion flame temperature determination comprises: a first photodiode device for obtaining a first photodiode signal, the first photodiode device comprising a silicon carbide photodiode and having a range of optical responsivity within an OH band; a second photodiode device for obtaining a second photodiode signal, the second photodiode device comprising a silicon carbide photodiode and a filter, the second photodiode device having a range of optical responsivity in a different and overlapping portion of the OH band than the first photodiode device; and a computer for obtaining a ratio using the first and second photodiode signals and using the ratio to determine the combustion flame temperature.

Abstract: A solid state optical spectrometer for combustion flame temperature determination comprises: a first photodiode device for obtaining a first photodiode signal, the first photodiode device comprising a silicon carbide photodiode and having a range of optical responsivity within an OH band; a second photodiode device for obtaining a second photodiode signal, the second photodiode device comprising a silicon carbide photodiode and a filter, the second photodiode device having a range of optical responsivity in a different and overlapping portion of the OH band than the first photodiode device; and a computer for obtaining a ratio using the first and second photodiode signals and using the ratio to determine the combustion flame temperature.

Abstract: An apparatus for detecting flashback occurrences in a premixed combustor system having at least one fuel nozzle includes at least one photodetector and at least one fiber optic element coupled between the at least one photodetector and a test region of the combustor system wherein a respective flame of the fuel nozzle is not present under normal operating conditions. A signal processor monitors a signal of the photodetector. The fiber optic element can include at least one optical fiber positioned within a protective tube. The fiber optic element can include two fiber optic elements coupled to the test region. The optical fiber and the protective tube can have lengths sufficient to situate the photodetector outside of an engine compartment.

Abstract: An optical spectrometer for combustion flame temperature determination includes at least two photodetectors positioned for receiving light from a combustion flame and having different overlapping optical bandwidths for producing respective output signals; and a computer for obtaining a difference between a first respective output signal of a first one of the at least two photodetectors with and a second respective output signal of a second one of the at least two photodetectors, dividing the difference by one of the first and second respective output signals to obtain a normalized output signal, and using the normalized output signal to determine the combustion flame temperature.

Abstract: A solid state optical spectrometer for combustion flame temperature determination comprises: a first photodiode device for obtaining a first photodiode signal, the first photodiode device comprising a silicon carbide photodiode and having a range of optical responsivity within an OH band; a second photodiode device for obtaining a second photodiode signal, the second photodiode device comprising a silicon carbide photodiode and a filter, the second photodiode device having a range of optical responsivity in a different and overlapping portion of the OH band than the first photodiode device; and a computer for obtaining a ratio using the first and second photodiode signals and using the ratio to determine the combustion flame temperature.

Abstract: An optical spectrometer for combustion flame temperature determination includes at least two photodetectors positioned for receiving light from a combustion flame, each of the at least two photodetectors having a different, overlapping bandwidth for detecting a respective output signal in an OH emission band; and a computer for subtracting a respective output signal of a first one of the at least two photodetectors from a respective output signal of a second one of the at least two photodetectors to obtain a segment signal, and using the segment signal to determine the combustion flame temperature.

Abstract: A depletion mode MOSFET and resistor are fabricated as a silicon carbide (SiC) integrated circuit (IC). The SiC IC includes a first SiC layer doped to a first conductivity type and a second SiC layer overlaid on the first SiC layer and doped to a second conductivity type. The second SiC layer includes at least four more heavily doped regions of the second conductivity type, with two of such regions comprising MOSFET source and drain electrodes and two other of such regions comprising resistor electrodes. The second SiC layer includes an isolation trench between the MOSFET electrodes and the resistor electrodes. At least two electrically conductive contacts are provided as MOSFET electrode contacts, each being positioned over at least a portion of a respective MOSFET electrode and two other electrically conductive contacts are provided as resistor electrode contacts, each being positioned over at least a portion of a respective resistor electrode.

Abstract: An apparatus for detecting flashback occurrences in a premixed combustor system having at least one fuel nozzle includes at least one photodetector and at least one fiber optic element coupled between the at least one photodetector and a test region of the combustor system wherein a respective flame of the fuel nozzle is not present under normal operating conditions. A signal processor monitors a signal of the photodetector. The fiber optic element can include at least one optical fiber positioned within a protective tube. The fiber optic element can include two fiber optic elements coupled to the test region. The optical fiber and the protective tube can have lengths sufficient to situate the photodetector outside of an engine compartment.

Abstract: A SiC MOSFET having a self-aligned gate structure is fabricated upon a monocrystalline substrate layer, such as a p type conductivity .alpha.6H silicon carbide (SiC) substrate. An SiC n+ type conductivity layer is epitaxially grown on the substrate layer. A steep-walled groove is etched through the n+ SiC layer and partially into the p SiC layer at a location on the substrate where a MOSFET gate structure is desired. Subsequently, a thin layer of silicon dioxide and a layer of gate metal are successively deposited over the entire structure. The gate metal layer is deposited with sufficient thickness to substantially fill the groove. A layer of photoresist is applied to the entire surface of the gate metal layer. The photoresist and the underlying gate metal are then reactive ion etched down to the oxide layer, leaving gate metal remaining only in the groove.

Abstract: A high temperature photocurrent detector circuit including a transimpedance amplifier having multiple stages of gain, and a driver amplifier which generates a driver current that is proportional to the photocurrent flowing through a photocurrent sensor. The voltage source utilizes source voltage wires to generate a supply current that is proportional to the driver current enabling the photocurrent detector circuit to operate as a two wire photocurrent detector circuit.

Abstract: A SiC MOSFET having a self-aligned gate structure is fabricated upon a monocrystalline substrate layer, such as a p type conductivity .alpha.6H silicon carbide (SiC) substrate. An SiC n+ type conductivity layer, epitaxially grown on the substrate layer, includes a steep-walled groove etched through the n+ SiC layer and partially into the p SiC layer. The groove is lined with a thin layer of silicon dioxide which extends onto the n+ type conductivity layer. A filling of gate metal over the layer of silicon dioxide is contained entirely in the groove. The silicon dioxide layer includes a first window extending to the filling of gate metal in the groove, and second and third windows extending to the n+ type conductivity layer on either side of the groove, respectively.

Abstract: A MOSFET includes a first SiC semiconductor contact layer, a SiC semiconductor channel layer supported by the first SiC contact layer, and a second SiC semiconductor contact layer supported by the channel layer. The second contact and channel layers are patterned to form a plurality of gate region grooves therethrough. Each of the gate region grooves includes a base surface and side surfaces which are covered with groove oxide material. A plurality of metal gate layers are provided, each being supported in a respective one of the plurality of grooves. A plurality of deposited oxide layers are provided, each in a respective one of the grooves so as to be supported by a respective one of the plurality of metal gate layers. A first metal contact layer is applied to the surface of the first SiC contact layer, and a second metal contact layer is applied to a portion of the surface of the second SiC contact layer.