Patents by Inventor Dale R Kopf

Dale R Kopf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Image-forming apparatus
    Patent number: 7277107
    Abstract: An image-forming apparatus includes one or more shutters that selectively permit passage of light.
    Type: Grant
    Filed: August 12, 2004
    Date of Patent: October 2, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Dale R. Kopf, Mark W. Wright, Riyadth F. Al-Kazily
  • Electromagnetic interference shield
    Patent number: 6838613
    Abstract: An EMI shield that utilizes a waveguide structure in which all or part of the air flow opening has a non-uniform three dimensional shape.
    Type: Grant
    Filed: November 6, 2003
    Date of Patent: January 4, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Dale R Kopf
  • Electromagnetic interference shield
    Publication number: 20040118581
    Abstract: An EMI shield that utilizes a waveguide structure in which all or part of the air flow opening has a non-uniform three dimensional shape.
    Type: Application
    Filed: November 6, 2003
    Publication date: June 24, 2004
    Inventor: Dale R. Kopf
  • Device and method for interstitial components in a printed circuit board
    Patent number: 6704207
    Abstract: A printed circuit board (PCB) includes a first layer having first and second surfaces, with an above-board device mounted thereon. The PCB includes a second layer having third and fourth surfaces. One of the surfaces can include a recessed portion for securedly holding an interstitial component. A via, electrically connecting the PCB layers, is also coupled to a lead of the interstitial component.
    Type: Grant
    Filed: September 20, 2002
    Date of Patent: March 9, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Dale R. Kopf
  • Electromagnetic interference shield
    Patent number: 6671186
    Abstract: An EMI shield that utilizes a waveguide structure in which all or part of the air flow opening has a non-uniform three dimensional shape.
    Type: Grant
    Filed: April 20, 2001
    Date of Patent: December 30, 2003
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Dale R Kopf
  • Electromagnetic interference shield
    Patent number: 6567276
    Abstract: An EMI shield that utilzes perforated dimples or other features configured to reflect electromagnetic radiation while simultaneously permitting air flow through the shielding material.
    Type: Grant
    Filed: April 20, 2001
    Date of Patent: May 20, 2003
    Assignee: Hewlett-Packard Development Company L.P.
    Inventors: Dale R Kopf, Jay D Reeves
  • Device and method for interstitial components in a printed circuit board
    Publication number: 20030035275
    Abstract: A printed circuit board (PCB) includes a first layer having first and second surfaces, with an above-board device mounted thereon. The PCB includes a second layer having third and fourth surfaces. One of the surfaces can include a recessed portion for securedly holding an interstitial component. A via, electrically connecting the PCB layers, is also coupled to a lead of the interstitial component.
    Type: Application
    Filed: September 20, 2002
    Publication date: February 20, 2003
    Inventor: Dale R. Kopf
  • Electromagnetic interference shield
    Patent number: 6487090
    Abstract: An EMI shield that utilzes perforated dimples or other features configured to reflect electromagnetic radiation while simultaneously permitting air flow through the shielding material.
    Type: Grant
    Filed: April 20, 2001
    Date of Patent: November 26, 2002
    Assignee: Hewlett-Packard Company
    Inventors: Dale R Kopf, Jay D Reeves
  • Device and method for interstitial components in a printed circuit board
    Patent number: 6480395
    Abstract: A printed circuit board (PCB) includes a first layer having first and second surfaces, with an above-board device mounted thereon. The PCB includes a second layer having third and fourth surfaces. One of the surfaces can include a recessed portion for securedly holding an interstitial component. A via, electrically connecting the PCB layers, is also coupled to a lead of the interstitial component.
    Type: Grant
    Filed: May 25, 2000
    Date of Patent: November 12, 2002
    Assignee: Hewlett-Packard Company
    Inventor: Dale R. Kopf
  • Electromagnetic interference shield
    Publication number: 20020154493
    Abstract: An EMI shield that utilizes perforated dimples or other features configured to reflect eletromagnetic radiation while simultaneously permitting air flow through the shielding material.
    Type: Application
    Filed: April 20, 2001
    Publication date: October 24, 2002
    Inventors: Dale R. Kopf, Jay D. Reeves
  • Electromagnetic interference shield
    Publication number: 20020154495
    Abstract: An EMI shield that utilizes a waveguide structure in which all or part of the air flow opening has a non-uniform three dimensional shape.
    Type: Application
    Filed: April 20, 2001
    Publication date: October 24, 2002
    Inventor: Dale R. Kopf