Abstract: A heat sink including a pedestal. The heat sink is used to dissipate heat from an electrical component such as a processor (e.g., a Pentium® Pro processor). The pedestal is arranged on the heat sink such that a gap which is formed between a surface of the electrical component and the heat sink is maintained to be less than an acceptable gap size. The gap between the heat sink and the electrical component can occur, for example, due to excessive warping of a surface of the electrical component. The excessive warping can be caused, for example, from manufacturing process problems or thermal changes. The pedestal can be arranged on an end of the heat sink facing the electrical component in a manner advantageous to cover a maximum surface area of the electrical component caused due to a particular size and shape of warping which uniquely occurs on a particular type of electrical component.

Abstract: A disk drive controller having a plurality of disk drive interfaces, each interface includes a connector, a delay circuit, and a set of power application circuits is provided to a server to support hot docking of SCA drives. Each connector is adapted to mate with a hot docking disk drive having equal length connecting pins, and detect the presence of such disk drive when the hot docking disk drive makes contact with the connector. Each delay circuit generates a set of properly delayed enabling signals to the corresponding power application circuits. Each set of power application circuits regulates power applications to the hot docking disk drive making contact with the corresponding connector. The delayed and regulated manner of applying power prevents voltage and power swings that might disrupt on-going operations and/or cause damages to the neighboring drives.