Abstract: Techniques that can improve efficiency of a touch sensitive device are presented. A touch controller (TC) can comprise a hover classification engine and an application processor (AP) can comprise a touch classification engine usable to classify touch or hover interactions of an object(s) with a touch sensitive surface (TSS) of the device. In response to classifying a touch or hover interaction with TSS as unintentional, AP can reject such interaction and can transition from an active state to an inactive state. TC can continue to monitor touch or hover interactions with TSS. In response to determining there is an intentional touch interaction with TS S or no unintentional face/ear interaction with TSS, TC can transmit a notification signal to AP. In response to the notification signal, AP can transition from the inactive state to active state, and can process the intentional touch interaction or monitor the TSS.

Abstract: Techniques that can improve efficiency of a touch sensitive device are presented. A touch controller (TC) can comprise a hover classification engine and an application processor (AP) can comprise a touch classification engine usable to classify touch or hover interactions of an object(s) with a touch sensitive surface (TSS) of the device. In response to classifying a touch or hover interaction with TSS as unintentional, AP can reject such interaction and can transition from an active state to an inactive state. TC can continue to monitor touch or hover interactions with TSS. In response to determining there is an intentional touch interaction with TS S or no unintentional face/ear interaction with TSS, TC can transmit a notification signal to AP. In response to the notification signal, AP can transition from the inactive state to active state, and can process the intentional touch interaction or monitor the TSS.

Abstract: Techniques enabling improved classification of objects against a touch sensitive surface of a touch sensitive device are presented. An object classification component can analyze touch screen data associated with a touch sensitive surface associated with a device and motion information relating to motion along at least one axis associated with the device. The object classification component can determine a contact classification for an object with respect to the touch sensitive surface, based on a result(s) of the analyzing, and in response to determining a contact state of the object with respect to the touch sensitive surface. An event determination component can control a function associated with the touch sensitive surface based on the contact classification for the object, the function comprising enabling or disabling a touch sensitive function of the touch sensitive surface of a display screen of the device or switching the display screen on or off.

Abstract: Techniques enabling improved classification of objects against a touch sensitive surface of a touch sensitive device are presented. An object classification component can analyze touch screen data associated with a touch sensitive surface associated with a device and motion information relating to motion along at least one axis associated with the device. The object classification component can determine a contact classification for an object with respect to the touch sensitive surface, based on a result(s) of the analyzing, and in response to determining a contact state of the object with respect to the touch sensitive surface. An event determination component can control a function associated with the touch sensitive surface based on the contact classification for the object, the function comprising enabling or disabling a touch sensitive function of the touch sensitive surface of a display screen of the device or switching the display screen on or off.

Abstract: A method of implanting ions into a workpiece without the formation of junctions, which impact the performance of the workpiece, is disclosed. To counteract the effect of dopant being implanted into the edge of the workpiece, components made of material having an opposite conductivity are placed near the workpiece. As ions from the beam strike these components, ions from the material are sputtered. These ions have the opposite conductivity as the implanted ions, and therefore inhibit the formation of junctions.

Abstract: A method of implanting ions into a workpiece without the formation of junctions, which impact the performance of the workpiece, is disclosed. To counteract the effect of dopant being implanted into the edge of the workpiece, components made of material having an opposite conductivity are placed near the workpiece. As ions from the beam strike these components, ions from the material are sputtered. These ions have the opposite conductivity as the implanted ions, and therefore inhibit the formation of junctions.

Abstract: The present invention is directed to a system and a method for peeling a wafer off of an electrostatic clamp (ESC). The ESC removal system comprises a electrostatic clamp and a wafer electrically coupled and physically in contact with each other. A plurality of grippers or pins are arranged with respect to the wafer and the ESC to allow the wafer to be peeled off or removed section by section from the electrostatic clamp. The system and method allow the wafer to be removed with a much lower pull force than current systems and methods.

Abstract: A control for pressurizing a load lock. The control initiates pressurization of the loadlock interior by coupling a source of gas to the loadlock interior. A representative load lock includes a pressure sensor and multiple valves to atmosphere where at least one such valves is a passthrough valve for removal of and insertion of workpieces from and into a load lock interior. A second fast acting valve also opens to atmosphere. A pressure rise inside the loadlock interior is monitored and when the pressure reaches a threshold pressure above atmosphere the fast acting valve is opened to atmosphere. This second fast acting valve is configured to relieve overpressure from the passthrough valve prior to opening of said passthrough valve. Workpiece movement is accomplished with the aid of a robot which reaches into the loadlock interior as it is either depositing workpieces or retrieving them.

Abstract: The present invention is directed to a system and a method for peeling a wafer off of an electrostatic clamp (ESC). The ESC removal system comprises a electrostatic clamp and a wafer electrically coupled and physically in contact with each other. A plurality of grippers or pins are arranged with respect to the wafer and the ESC to allow the wafer to be peeled off or removed section by section from the electrostatic clamp. The system and method allow the wafer to be removed with a much lower pull force than current systems and methods.

Abstract: A control for pressurizing a load lock. The control initiates pressurization of the loadlock interior by coupling a source of gas to the loadlock interior. A representative load lock includes a pressure sensor and multiple valves to atmosphere where at least one such valves is a passthrough valve for removal of and insertion of workpieces from and into a load lock interior. A second fast acting valve also opens to atmosphere. A pressure rise inside the loadlock interior is monitored and when the pressure reaches a threshold pressure above atmosphere the fast acting valve is opened to atmosphere. This second fast acting valve is configured to relieve overpressure from the passthrough valve prior to opening of said passthrough valve. Workpiece movement is accomplished with the aid of a robot which reaches into the loadlock interior as it is either depositing workpieces or retrieving them.

Abstract: An ion implanter having a source, a workpiece support and a transport system for delivering ions from the source to an ion implantation chamber that contains the workpiece support. The implanter includes one or more removable inserts mounted to an interior of either the transport system or the ion implantation chamber for collecting material entering either the transport system or the ion implantation chamber due to collisions between ions and the workpiece within the ion implantation chamber during ion processing of the workpiece. A temperature control coupled to the one or more removable inserts for maintaining the temperature of the insert at a controlled temperature to promote formation of a film on said insert during ion treatment due to collisions between ions and said workpiece.

Abstract: An ion beam implanter includes ion beam forming and directing apparatus and an implantation station where workpieces are implanted with ions from an ion beam. The beam travels along an evacuated path from an ion source to the implantation station. A flexible bellows couples the implantation station to the beam forming and directing apparatus permitting the implantation station to be pivoted with respect to the beam forming and directing apparatus and thereby change an implantation orientation of the workpieces with respect to the ion beam. A replaceable, flexible bellows liner is disposed within an interior region of the bellows to reduce the volume of implantation byproducts deposited on an interior surface of the bellows.