Patents by Inventor Dale T. Morgan

Dale T. Morgan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240079786
    Abstract: An electronic device may be provided with peripheral conductive housing structures, a first antenna, and a second antenna. A gap may divide the housing structures into a first segment forming an arm of the first antenna and a second segment forming an arm of the second antenna. A first feed terminal may be coupled to the first segment and a second feed terminal may be coupled to the second segment. Switchable components may be coupled in parallel between the first and second feed terminals across the gap. The switchable components may be adjusted to tune the frequency response of the first and/or second antenna. The switchable components may have a first state in which only the first feed terminal feeds the first antenna and may have a second state in which both the first and second feed terminals feed the first antenna.
    Type: Application
    Filed: August 30, 2023
    Publication date: March 7, 2024
    Inventors: Han Wang, Aobo Li, Victor C Lee, Yuancheng Xu, Ahmed Ali Abdelhaliem Nafe, Enrique Ayala Vazquez, Yiren Wang, Yuan Tao, Christopher Q Ma, Zhiheng Zhou, Sherry Cao, Dale T Morgan, Timothy L Stickles, Hao Xu, Hongfei Hu, Mattia Pascolini
  • Publication number: 20220329678
    Abstract: A portable electronic device includes a housing, a sensor array including a first camera module having a first field of view, a second camera module having a second field of view different from the first field of view, and a light source, and a rear cover formed from a glass material and defining a raised sensor array region positioned over the sensor array. The raised sensor array region defines a first hole extending through the rear cover and positioned proximate a first corner region of the raised sensor array region, and a second hole extending through the rear cover and positioned proximate a second corner region diagonal from the first corner region. The first camera module includes a first camera housing defining a recess at a corner of the first camera housing, and the second camera module includes a second camera housing extending into the recess.
    Type: Application
    Filed: September 10, 2021
    Publication date: October 13, 2022
    Inventors: Xuyang Zhang, Jason P. Shannon, Jon F. Housour, Robert F. Meyer, Owen D. Hale, Dale T. Morgan, Daniel Jarvis, Nicholas Merz, Benjamin Morse, Rasamy Phouthavong, Michael B. Wittenberg, David A. Pakula, Simon C. Helmore, Gareth L. Rose, Marwan Rammah, Melissa A. Wah, Jacob Barton, Ian A.. Spraggs
  • Publication number: 20220286543
    Abstract: A mobile phone may include a housing, a battery at least partially within the housing, and a circuit board assembly at least partially within the housing and positioned along a side of the battery. The circuit board assembly may include a first circuit board defining a first hole, a second circuit board defining a second hole, a wall structure between the first circuit board and the second circuit board and attached to an inner surface of the first circuit board and an inner surface of the second circuit board, and a fastener assembly configured to retain the first circuit board to the second circuit board.
    Type: Application
    Filed: September 10, 2021
    Publication date: September 8, 2022
    Inventors: Owen D. Hale, Dale T. Morgan, Andrew U. Leopold, Yifan Zhao, Nicholas Merz, Daniel Jarvis, James B. Smith, Macey E. Dade, Samuel J. Pliska, Ethan R. Stobbe, Cameron Bauer, Ian A. Spraggs, Marwan Rammah, Bryan D. Keen, David A. Pakula
  • Patent number: 11006524
    Abstract: An interposer for mechanically and electrically connecting two circuit boards is described. The interposer can be bent to enclose an area of a circuit board. The interposer can include a first layer external to the enclosed area. The first layer can be conductive and can serve as an EMI shield. The interposer can also include a second layer internal to the enclosed area. The second layer can be non-conductive but can carry multiple discrete pins that can electrically couple the first and second circuit boards and provide signal transmission pathways between the circuit boards. The interposer can be formed by folding a sheet of conductive material having different cutout regions that forms a comb pattern into multiple stacked layers. Then, the bent regions that connect the stacked layers can be removed so that the conductive bars in the comb patterns can be separated and isolated to form discrete pins.
    Type: Grant
    Filed: January 19, 2018
    Date of Patent: May 11, 2021
    Assignee: Apple Inc.
    Inventors: Scott A. Myers, James B. Smith, Dale T. Morgan, Shayan Malek
  • Publication number: 20190082535
    Abstract: An interposer for mechanically and electrically connecting two circuit boards is described. The interposer can be bent to enclose an area of a circuit board. The interposer can include a first layer external to the enclosed area. The first layer can be conductive and can serve as an EMI shield. The interposer can also include a second layer internal to the enclosed area. The second layer can be non-conductive but can carry multiple discrete pins that can electrically couple the first and second circuit boards and provide signal transmission pathways between the circuit boards. The interposer can be formed by folding a sheet of conductive material having different cutout regions that forms a comb pattern into multiple stacked layers. Then, the bent regions that connect the stacked layers can be removed so that the conductive bars in the comb patterns can be separated and isolated to form discrete pins.
    Type: Application
    Filed: January 19, 2018
    Publication date: March 14, 2019
    Inventors: Scott A. MYERS, James B. SMITH, Dale T. MORGAN, Shayan MALEK
  • Patent number: 9698524
    Abstract: Embodiments of the present invention provide an apparatus, a system, and a method of manufacturer for a magnetic, self-retracting, auto-aligning electrical connector. The apparatus includes a first conductor and a first magnet configured to magnetically couple with a second magnet, wherein magnetic coupling causes a change in a magnetic field of a magnetically coupled combination of the first magnet and the second magnet and wherein the change in the magnetic field causes electrical coupling of the first conductor and a second conductor. The system includes a first connector comprising a first magnet and a first conductor and a second connector comprising a second magnet and a second conductor, wherein magnetic coupling causes a change in a magnetic field of a magnetically coupled combination of the first magnet and the second magnet and wherein the change in the magnetic field causes electrical coupling of the first conductor and the second conductor.
    Type: Grant
    Filed: August 13, 2015
    Date of Patent: July 4, 2017
    Assignee: EMC IP HOLDING COMPANY LLC
    Inventors: Dale T. Morgan, Sean P. O'Donnell, Jeremy Zorrilla De Los Santos, Matthew Kielbasa
  • Patent number: 9160102
    Abstract: Embodiments of the present invention provide an apparatus, a system, and a method of manufacturer for a magnetic, self-retracting, auto-aligning electrical connector. The apparatus includes a first conductor and a first magnet configured to magnetically couple with a second magnet, wherein magnetic coupling causes a change in a magnetic field of a magnetically coupled combination of the first magnet and the second magnet and wherein the change in the magnetic field causes electrical coupling of the first conductor and a second conductor. The system includes a first connector comprising a first magnet and a first conductor and a second connector comprising a second magnet and a second conductor, wherein magnetic coupling causes a change in a magnetic field of a magnetically coupled combination of the first magnet and the second magnet and wherein the change in the magnetic field causes electrical coupling of the first conductor and the second conductor.
    Type: Grant
    Filed: December 31, 2012
    Date of Patent: October 13, 2015
    Assignee: EMC Corporation
    Inventors: Dale T. Morgan, Sean P. O'Donnell, Jeremy Zorrilla De Los Santos, Matthew Kielbasa
  • Patent number: 9069039
    Abstract: A power measurement transducer includes a first surface configured to thermally couple the power measurement transducer to a device under test. A second surface is essentially parallel to and spaced apart from the first surface. Two or more temperature measurement elements are positioned between the first and second surfaces. The power measurement transducer is configured to allow at least a portion of the power generated within the device under test to enter the power measurement transducer through the first surface and exit the power measurement transducer through the second surface.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: June 30, 2015
    Assignee: EMC Corporation
    Inventors: John K. Bowman, Steven R. Cieluch, David Boudreau, Daniel A. Field, Dale T. Morgan
  • Patent number: 8814424
    Abstract: A method of determining thermal output of a device under test includes attaching a power measurement transducer to a device under test, wherein the power measurement transducer includes two or more temperature measurement elements. A test sequence is applied to the device under test. One or more signals produced by the power measurement transducer are monitored to determine a quantity of power produced by the device under test during the test sequence.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: August 26, 2014
    Assignee: EMC Corporation
    Inventors: John K. Bowman, Steven R. Cieluch, David Boudreau, Daniel A. Field, Dale T. Morgan
  • Patent number: 8814425
    Abstract: A power measurement transducer includes a thermally conductive heat spreading device having a first surface configured to thermally couple the power measurement transducer to a device under test. Two or more temperature measurement elements are positioned within the thermally conductive heat spreading device.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: August 26, 2014
    Assignee: EMC Corporation
    Inventors: John K. Bowman, Steven R. Cieluch, David Boudreau, Daniel A. Field, Dale T. Morgan
  • Patent number: D961594
    Type: Grant
    Filed: May 18, 2018
    Date of Patent: August 23, 2022
    Assignee: Apple Inc.
    Inventors: Matthew David Hill, Dale T. Morgan, James B. Smith, Ian Spraggs