Abstract: An electrically conductive probe of controlled shape and dimension useful in testing the functionality and performance of microcircuits and a method for manufacturing it are disclosed. The probe may be generally square or rectangular in cross section and consists of three distinct sections; the terminal end which is capable of being electrically contacted, the shaft which connects the terminal end to the probe tip, and the probe tip which is to make electrical contact with a microcircuit.

Abstract: A probe card provides an interconnection between pads on an integrated circuit chip and leads on a printed circuit board to test the chip operability. The card includes a dielectric substrate having a substantially planar surface and at least one channel disposed in such surface in a particular direction. Electrically conductive material is disposed in the channel to contact a conductive, preferably resilient, probe having a first portion disposed in the channel in abutting relationship with the planar surface on the support. Detents are provided in mating relationship in the channel and on the support to position the probe precisely in the channel. A second probe portion extends from the first portion at an angle to the first portion. A probe tip is at the end of the second portion to contact a pad on the chip.

Abstract: A method of electrically isolating a plurality of semiconductor integrated circuit components and for forming gate elements for silicon gate transistors is disclosed whereby extremely narrow line widths can be formed which heretofore have been unattainable by practicing conventional photolithography.

Abstract: A method of electrically isolating a plurality of semiconductor integrated circuit components and for forming gate elements for silicon gate transistors is disclosed whereby extremely narrow line widths can be formed which heretofore have been unattainable by practicing conventional photolithography.