Abstract: A method of installing a radiant density floor heating system, in which a multi-layer conductive/insulation pad is disposed atop the ground or a subfloor, a heating element is placed atop the pad, a concrete or cement layer is laid atop the heating element and pad, and a flooring material is laid atop the cement layer. The pad comprises a first polymer layer having a first side that forms an outer surface of the multi-layer conductive/insulation pad, a conductive layer laminated to an opposite second side of the first polymer layer, a second polymer layer laminated to the side of the conductive layer opposite the first polymer layer, and a first air cellular cushioning layer laminated to the side of the second polymer layer opposite the conductive layer. The pad can also include a second air cellular cushioning layer and/or a protective polymer layer.

Abstract: Abstract of the Disclosure There is provides a multi-layer conductive/insulation pad is provided having a first polymer layer, a conductive layer such as a thin foil of metal or a metallized thermoplastic film laminated to the first polymer layer, a second polymer layer laminated to the side of the conductive layer opposite the side of the first polymer layer, and a first bubble wrap layer. The first bubble wrap layer is laminated to the side of the second polymer film opposite the conductive layer. Optionally, a protective heavy-duty polymer layer is laminated to the first bubble wrap layer on the opposite side of the second polymer layer. In another embodiment the multi-layer construction of pad of the first embodiment has added thereto a third polymer layer laminated to the side opposite the first layer of bubble wrap and a second layer of bubble wrap laminated to the third polymer layer on the side opposite the first bubble wrap.