Abstract: An apparatus for detecting an intrusion of an environmental substance into an environmentally sealed electronic components package. The electronic components package generally includes a plastic coated or plastic enclosed electronic component, that includes a printed circuit board and/or integrated circuits. The intrusion of the environmental substance into the electronic components package can be measured by one of a plurality of monitors. The monitors can detect the presence of the environmental substance and alert a user that a break in the seal of the electronic components package has occurred.

Abstract: An apparatus for detecting an intrusion of an environmental substance into an environmentally sealed electronic components package. The electronic components package generally includes a plastic coated or plastic enclosed electronic component, that includes a printed circuit board and/or integrated circuits. The intrusion of the environmental substance into the electronic components package can be measured by one of a plurality of monitors. The monitors can detect the presence of the environmental substance and alert a user that a break in the seal of the electronic components package has occurred.

Abstract: An apparatus for detecting an intrusion of an environmental substance into an environmentally sealed electronic components package. The electronic components package generally includes a plastic coated or plastic enclosed electronic component, that includes a printed circuit board and/or integrated circuits. The intrusion of the environmental substance into the electronic components package can be measured by one of a plurality of monitors. The monitors can detect the presence of the environmental substance and alert a user that a break in the seal of the electronic components package has occurred.

Abstract: An antenna package includes a lid-like structure that fits onto an electrically conductive, metallic box-like structure. The lid-like structure includes an electrically conductive, metallic seal member that is connected to an antenna and defines a primary opening. The antenna includes a dielectric mounted between an inner metallic layer and an outer metallic layer. The connection between the seal member and the antenna is a substantially hermetic, soldered connection between the seal member and the inner metallic layer, such that the inner metallic layer is electrically connected to the seal member. The soldered connection secures the antenna to the seal member such that the inner metallic layer occludes the primary opening. A substantially hermetic, fused connection is provided between the lid-like structure and the box-like structure so that a hermetically sealed chamber is defined within the box-like structure. Electric circuitry is positioned in the chamber and is connected to the antenna.

Abstract: A microelectronic device is rendered resistant to reverse engineering by encapsulating it in a dual layer encapsulant. The inner layer is compatible with the operation of the device, and has a greater resistance to chemical attack then does the device. The outer layer includes a filler of barium sulfate and gadolinium oxide, to absorb X-rays and N-rays respectively, is more resistant to chemical attack than the inner layer, and includes a groove around its periphery, to preferentially allow chemical attack radially. A full chemical attack damages the device beyond usable inspection, but a partial chemical attack is insufficient to remove X-ray and N-ray concealment.

Abstract: A container (20) and blank (10) therefor are formed from a single blank of sheet material. The blank is easily folded and locked in shape into a food-receiving tube (20) with a bottom (50) at a point-of-sale for protecting foodstuffs placed therein from bruising or crushing. The foodstuffs in turn are used to help reinforce the container (20).