Patents by Inventor Daliang Wang

Daliang Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11961245
    Abstract: Provided is a method for performing image guidance, including: acquiring a 3D magnetic resonance (MR) image of a target individual, wherein at least one region range of an object of interest is marked in the 3D MR image; acquiring a reference 3D image of the target individual, wherein the reference 3D image is a 3D-reconstructed computed tomography (CT) image; performing a 3D-3D registration on the 3D MR image and the reference 3D image, so as to mark each region range of the object of interest in the reference 3D image; and performing image guidance on the basis that the reference 3D image is adopted to characterize an initial position state.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: April 16, 2024
    Assignee: Our United Corporation
    Inventors: Zhongya Wang, Daliang Li, Hao Yan, Jiuliang Li
  • Patent number: 11929274
    Abstract: A poling apparatus for poling a polymer thin film formed on a workpiece carried by a workpiece carrier. The workpiece has grounding electrodes and grounding pads located at edges, and a thin film covering the grounding electrodes but exposing the grounding pads. The workpiece carrier has carrier electrodes located around the workpiece and inside grounding ports at the bottom. The poling apparatus includes, in a poling chamber, a poling source generating a plasma, a Z-elevator to raise the workpiece carrier toward the poling source using the grounding ports, and grounding mechanisms including downwardly biased electrical contacts which, when the workpiece carrier is raised by the Z-elevator, connect the grounding pads of the workpiece with the carrier electrodes, to ground the workpiece. The poling apparatus additionally includes preparation platform and transfer platform with conveyer systems with rollers and Z-elevators to move the workpiece carrier in and out of the poling chamber.
    Type: Grant
    Filed: July 9, 2023
    Date of Patent: March 12, 2024
    Assignee: Creesense Microsystems Inc.
    Inventors: Hongwei Lu, Daliang Wang, Albert Ting, Efrain Velazquez, Xiaoyan Zhang, Kai-An Wang
  • Patent number: 11830748
    Abstract: A poling apparatus for poling a polymer thin film formed on a workpiece carried by a workpiece carrier. The workpiece has grounding electrodes and grounding pads located at edges, and a thin film covering the grounding electrodes but exposing the grounding pads. The workpiece carrier has carrier electrodes located around the workpiece and inside grounding ports at the bottom. The poling apparatus includes, in a poling chamber, a poling source generating a plasma, a Z-elevator to raise the workpiece carrier toward the poling source using the grounding ports, and grounding mechanisms including downwardly biased electrical contacts which, when the workpiece carrier is raised by the Z-elevator, connect the grounding pads of the workpiece with the carrier electrodes, to ground the workpiece. The poling apparatus additionally includes preparation platform and transfer platform with conveyer systems with rollers and Z-elevators to move the workpiece carrier in and out of the poling chamber.
    Type: Grant
    Filed: August 11, 2021
    Date of Patent: November 28, 2023
    Assignee: CREESENSE MICROSYSTEMS INC.
    Inventors: Hongwei Lu, Daliang Wang, Albert Ting, Efrain Velazquez, Xiaoyan Zhang, Kai-An Wang
  • Publication number: 20230352329
    Abstract: A poling apparatus for poling a polymer thin film formed on a workpiece carried by a workpiece carrier. The workpiece has grounding electrodes and grounding pads located at edges, and a thin film covering the grounding electrodes but exposing the grounding pads. The workpiece carrier has carrier electrodes located around the workpiece and inside grounding ports at the bottom. The poling apparatus includes, in a poling chamber, a poling source generating a plasma, a Z-elevator to raise the workpiece carrier toward the poling source using the grounding ports, and grounding mechanisms including downwardly biased electrical contacts which, when the workpiece carrier is raised by the Z-elevator, connect the grounding pads of the workpiece with the carrier electrodes, to ground the workpiece. The poling apparatus additionally includes preparation platform and transfer platform with conveyer systems with rollers and Z-elevators to move the workpiece carrier in and out of the poling chamber.
    Type: Application
    Filed: July 9, 2023
    Publication date: November 2, 2023
    Applicant: Creesense Microsystems Inc.
    Inventors: Hongwei Lu, Daliang Wang, Albert Ting, Efrain Velazquez, Xiaoyan Zhang, Kai-An Wang
  • Patent number: 11282729
    Abstract: A poling apparatus for poling a polymer thin film formed on a workpiece carried by a workpiece carrier. The workpiece has grounding electrodes and grounding pads located at edges, and a thin film covering the grounding electrodes but exposing the grounding pads. The workpiece carrier has carrier electrodes located around the workpiece and inside grounding ports at the bottom. The poling apparatus includes, in a poling chamber, a poling source generating a plasma, a Z-elevator to raise the workpiece carrier toward the poling source using the grounding ports, and grounding mechanisms including downwardly biased electrical contacts which, when the workpiece carrier is raised by the Z-elevator, connect the grounding pads of the workpiece with the carrier electrodes, to ground the workpiece. The poling apparatus additionally includes preparation platform and transfer platform with conveyer systems with rollers and Z-elevators to move the workpiece carrier in and out of the poling chamber.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: March 22, 2022
    Assignee: Areesys Technologies, Inc.
    Inventors: Hongwei Lu, Daliang Wang, Albert Ting, Efrain Velazquez, Xiaoyan Zhang, Kai-An Wang
  • Publication number: 20210375652
    Abstract: A poling apparatus for poling a polymer thin film formed on a workpiece carried by a workpiece carrier. The workpiece has grounding electrodes and grounding pads located at edges, and a thin film covering the grounding electrodes but exposing the grounding pads. The workpiece carrier has carrier electrodes located around the workpiece and inside grounding ports at the bottom. The poling apparatus includes, in a poling chamber, a poling source generating a plasma, a Z-elevator to raise the workpiece carrier toward the poling source using the grounding ports, and grounding mechanisms including downwardly biased electrical contacts which, when the workpiece carrier is raised by the Z-elevator, connect the grounding pads of the workpiece with the carrier electrodes, to ground the workpiece. The poling apparatus additionally includes preparation platform and transfer platform with conveyer systems with rollers and Z-elevators to move the workpiece carrier in and out of the poling chamber.
    Type: Application
    Filed: August 11, 2021
    Publication date: December 2, 2021
    Applicant: Areesys Technologies, Inc.
    Inventors: Hongwei Lu, Daliang Wang, Albert Ting, Efrain Velazquez, Xiaoyan Zhang, Kai-An Wang
  • Publication number: 20200211878
    Abstract: A poling apparatus for poling a polymer thin film formed on a workpiece carried by a workpiece carrier. The workpiece has grounding electrodes and grounding pads located at edges, and a thin film covering the grounding electrodes but exposing the grounding pads. The workpiece carrier has carrier electrodes located around the workpiece and inside grounding ports at the bottom. The poling apparatus includes, in a poling chamber, a poling source generating a plasma, a Z-elevator to raise the workpiece carrier toward the poling source using the grounding ports, and grounding mechanisms including downwardly biased electrical contacts which, when the workpiece carrier is raised by the Z-elevator, connect the grounding pads of the workpiece with the carrier electrodes, to ground the workpiece. The poling apparatus additionally includes preparation platform and transfer platform with conveyer systems with rollers and Z-elevators to move the workpiece carrier in and out of the poling chamber.
    Type: Application
    Filed: December 27, 2019
    Publication date: July 2, 2020
    Applicant: Areesys Technologies, Inc.
    Inventors: Hongwei Lu, Daliang Wang, Albert Ting, Efrain Velazquez, Xiaoyan Zhang, Kai-An Wang