Patents by Inventor Daliang Wang
Daliang Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11961245Abstract: Provided is a method for performing image guidance, including: acquiring a 3D magnetic resonance (MR) image of a target individual, wherein at least one region range of an object of interest is marked in the 3D MR image; acquiring a reference 3D image of the target individual, wherein the reference 3D image is a 3D-reconstructed computed tomography (CT) image; performing a 3D-3D registration on the 3D MR image and the reference 3D image, so as to mark each region range of the object of interest in the reference 3D image; and performing image guidance on the basis that the reference 3D image is adopted to characterize an initial position state.Type: GrantFiled: October 30, 2018Date of Patent: April 16, 2024Assignee: Our United CorporationInventors: Zhongya Wang, Daliang Li, Hao Yan, Jiuliang Li
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Patent number: 11929274Abstract: A poling apparatus for poling a polymer thin film formed on a workpiece carried by a workpiece carrier. The workpiece has grounding electrodes and grounding pads located at edges, and a thin film covering the grounding electrodes but exposing the grounding pads. The workpiece carrier has carrier electrodes located around the workpiece and inside grounding ports at the bottom. The poling apparatus includes, in a poling chamber, a poling source generating a plasma, a Z-elevator to raise the workpiece carrier toward the poling source using the grounding ports, and grounding mechanisms including downwardly biased electrical contacts which, when the workpiece carrier is raised by the Z-elevator, connect the grounding pads of the workpiece with the carrier electrodes, to ground the workpiece. The poling apparatus additionally includes preparation platform and transfer platform with conveyer systems with rollers and Z-elevators to move the workpiece carrier in and out of the poling chamber.Type: GrantFiled: July 9, 2023Date of Patent: March 12, 2024Assignee: Creesense Microsystems Inc.Inventors: Hongwei Lu, Daliang Wang, Albert Ting, Efrain Velazquez, Xiaoyan Zhang, Kai-An Wang
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Patent number: 11830748Abstract: A poling apparatus for poling a polymer thin film formed on a workpiece carried by a workpiece carrier. The workpiece has grounding electrodes and grounding pads located at edges, and a thin film covering the grounding electrodes but exposing the grounding pads. The workpiece carrier has carrier electrodes located around the workpiece and inside grounding ports at the bottom. The poling apparatus includes, in a poling chamber, a poling source generating a plasma, a Z-elevator to raise the workpiece carrier toward the poling source using the grounding ports, and grounding mechanisms including downwardly biased electrical contacts which, when the workpiece carrier is raised by the Z-elevator, connect the grounding pads of the workpiece with the carrier electrodes, to ground the workpiece. The poling apparatus additionally includes preparation platform and transfer platform with conveyer systems with rollers and Z-elevators to move the workpiece carrier in and out of the poling chamber.Type: GrantFiled: August 11, 2021Date of Patent: November 28, 2023Assignee: CREESENSE MICROSYSTEMS INC.Inventors: Hongwei Lu, Daliang Wang, Albert Ting, Efrain Velazquez, Xiaoyan Zhang, Kai-An Wang
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Publication number: 20230352329Abstract: A poling apparatus for poling a polymer thin film formed on a workpiece carried by a workpiece carrier. The workpiece has grounding electrodes and grounding pads located at edges, and a thin film covering the grounding electrodes but exposing the grounding pads. The workpiece carrier has carrier electrodes located around the workpiece and inside grounding ports at the bottom. The poling apparatus includes, in a poling chamber, a poling source generating a plasma, a Z-elevator to raise the workpiece carrier toward the poling source using the grounding ports, and grounding mechanisms including downwardly biased electrical contacts which, when the workpiece carrier is raised by the Z-elevator, connect the grounding pads of the workpiece with the carrier electrodes, to ground the workpiece. The poling apparatus additionally includes preparation platform and transfer platform with conveyer systems with rollers and Z-elevators to move the workpiece carrier in and out of the poling chamber.Type: ApplicationFiled: July 9, 2023Publication date: November 2, 2023Applicant: Creesense Microsystems Inc.Inventors: Hongwei Lu, Daliang Wang, Albert Ting, Efrain Velazquez, Xiaoyan Zhang, Kai-An Wang
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Patent number: 11282729Abstract: A poling apparatus for poling a polymer thin film formed on a workpiece carried by a workpiece carrier. The workpiece has grounding electrodes and grounding pads located at edges, and a thin film covering the grounding electrodes but exposing the grounding pads. The workpiece carrier has carrier electrodes located around the workpiece and inside grounding ports at the bottom. The poling apparatus includes, in a poling chamber, a poling source generating a plasma, a Z-elevator to raise the workpiece carrier toward the poling source using the grounding ports, and grounding mechanisms including downwardly biased electrical contacts which, when the workpiece carrier is raised by the Z-elevator, connect the grounding pads of the workpiece with the carrier electrodes, to ground the workpiece. The poling apparatus additionally includes preparation platform and transfer platform with conveyer systems with rollers and Z-elevators to move the workpiece carrier in and out of the poling chamber.Type: GrantFiled: December 27, 2019Date of Patent: March 22, 2022Assignee: Areesys Technologies, Inc.Inventors: Hongwei Lu, Daliang Wang, Albert Ting, Efrain Velazquez, Xiaoyan Zhang, Kai-An Wang
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Publication number: 20210375652Abstract: A poling apparatus for poling a polymer thin film formed on a workpiece carried by a workpiece carrier. The workpiece has grounding electrodes and grounding pads located at edges, and a thin film covering the grounding electrodes but exposing the grounding pads. The workpiece carrier has carrier electrodes located around the workpiece and inside grounding ports at the bottom. The poling apparatus includes, in a poling chamber, a poling source generating a plasma, a Z-elevator to raise the workpiece carrier toward the poling source using the grounding ports, and grounding mechanisms including downwardly biased electrical contacts which, when the workpiece carrier is raised by the Z-elevator, connect the grounding pads of the workpiece with the carrier electrodes, to ground the workpiece. The poling apparatus additionally includes preparation platform and transfer platform with conveyer systems with rollers and Z-elevators to move the workpiece carrier in and out of the poling chamber.Type: ApplicationFiled: August 11, 2021Publication date: December 2, 2021Applicant: Areesys Technologies, Inc.Inventors: Hongwei Lu, Daliang Wang, Albert Ting, Efrain Velazquez, Xiaoyan Zhang, Kai-An Wang
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Publication number: 20200211878Abstract: A poling apparatus for poling a polymer thin film formed on a workpiece carried by a workpiece carrier. The workpiece has grounding electrodes and grounding pads located at edges, and a thin film covering the grounding electrodes but exposing the grounding pads. The workpiece carrier has carrier electrodes located around the workpiece and inside grounding ports at the bottom. The poling apparatus includes, in a poling chamber, a poling source generating a plasma, a Z-elevator to raise the workpiece carrier toward the poling source using the grounding ports, and grounding mechanisms including downwardly biased electrical contacts which, when the workpiece carrier is raised by the Z-elevator, connect the grounding pads of the workpiece with the carrier electrodes, to ground the workpiece. The poling apparatus additionally includes preparation platform and transfer platform with conveyer systems with rollers and Z-elevators to move the workpiece carrier in and out of the poling chamber.Type: ApplicationFiled: December 27, 2019Publication date: July 2, 2020Applicant: Areesys Technologies, Inc.Inventors: Hongwei Lu, Daliang Wang, Albert Ting, Efrain Velazquez, Xiaoyan Zhang, Kai-An Wang