Patents by Inventor Dalin CUI

Dalin CUI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10415139
    Abstract: A coating apparatus includes a coating chamber, and a substrate support structure and a heater in the coating chamber. The substrate support structure includes a plurality of support units. The heater includes a heating plate body having a plurality of through holes and heating filling parts each provided in one of the plurality of through holes, and the plurality of support units are received in the plurality of through holes respectively. In each of the plurality of through holes, one of the plurality of support units is located between one of the heating filling parts and an inner wall of the through hole accommodating the one of the heating filling parts, and the heater further includes connection parts each configured to connect one of the heating filling parts with the inner wall of the through holes accommodating the one of the heating filling parts.
    Type: Grant
    Filed: April 16, 2018
    Date of Patent: September 17, 2019
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., FUZHOU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Shanshan Yang, Dalin Cui
  • Publication number: 20190062919
    Abstract: A coating apparatus includes a coating chamber, and a substrate support structure and a heater in the coating chamber. The substrate support structure includes a plurality of support units. The heater includes a heating plate body having a plurality of through holes and heating filling parts each provided in one of the plurality of through holes, and the plurality of support units are received in the plurality of through holes respectively. In each of the plurality of through holes, one of the plurality of support units is located between one of the heating filling parts and an inner wall of the through hole accommodating the one of the heating filling parts, and the heater further includes connection parts each configured to connect one of the heating filling parts with the inner wall of the through holes accommodating the one of the heating filling parts.
    Type: Application
    Filed: April 16, 2018
    Publication date: February 28, 2019
    Inventors: Shanshan Yang, Dalin Cui
  • Patent number: 10205029
    Abstract: A TFT, a manufacturing method thereof, and a display device are provided. The TFT includes a semiconductor layer and an etch-stop layer merely covering a channel region of the semiconductor layer. The semiconductor layer and the etch-stop layer are formed through a single patterning process.
    Type: Grant
    Filed: January 19, 2016
    Date of Patent: February 12, 2019
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Jiushi Wang, Dalin Cui
  • Publication number: 20180219105
    Abstract: A TFT, a manufacturing method thereof, and a display device are provided. The TFT includes a semiconductor layer and an etch-stop layer merely covering a channel region of the semiconductor layer. The semiconductor layer and the etch-stop layer are formed through a single patterning process.
    Type: Application
    Filed: January 19, 2016
    Publication date: August 2, 2018
    Applicant: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Jiushi WANG, Dalin CUI