Patents by Inventor Dalip Kohli

Dalip Kohli has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10773508
    Abstract: Peel ply for surface preparation and a method of surface preparation prior to adhesive bonding. A resin-rich peel ply is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the matrix resin in the peel ply remains partially cured. When the peel ply is removed, a roughened, bondable surface with chemically-active functional groups is revealed. The composite substrate with the chemically-active, bondable surface may be bonded to another composite substrate to form a covalently-bonded structure.
    Type: Grant
    Filed: March 18, 2017
    Date of Patent: September 15, 2020
    Assignee: CYTEC INDUSTRIES INC.
    Inventors: Leonard MacAdams, Dalip Kohli
  • Patent number: 10315404
    Abstract: A method for surface preparation of composite substrates prior to adhesive bonding. A curable surface treatment layer is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the surface treatment layer remains partially cured. The surface treatment layer may be a resin film or a removal peel ply composed of resin-impregnated fabric. After surface preparation, the composite substrate is provided with a chemically-active, bondable surface that can be adhesively bonded to another composite substrate to form a covalently-bonded structure.
    Type: Grant
    Filed: September 18, 2017
    Date of Patent: June 11, 2019
    Assignee: CYTEC INDUSTRIES INC.
    Inventors: Leonard MacAdams, Dalip Kohli
  • Patent number: 10240048
    Abstract: Corrosion-inhibiting microgels that are suitable for use in non-chromated primer compositions. Each discrete microgel is composed of a cross-linked polymer network and organic corrosion-inhibiting compounds entrapped or immobilized within the polymer network.
    Type: Grant
    Filed: December 18, 2013
    Date of Patent: March 26, 2019
    Assignee: CYTEC INDUSTRIES INC.
    Inventors: Yiqiang Zhao, Dalip Kohli, Keltoum Ouzineb
  • Publication number: 20180001572
    Abstract: A method for surface preparation of composite substrates prior to adhesive bonding. A curable surface treatment layer is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the surface treatment layer remains partially cured. The surface treatment layer may be a resin film or a removal peel ply composed of resin-impregnated fabric. After surface preparation, the composite substrate is provided with a chemically-active, bondable surface that can be adhesively bonded to another composite substrate to form a covalently-bonded structure.
    Type: Application
    Filed: September 18, 2017
    Publication date: January 4, 2018
    Applicant: CYTEC INDUSTRIES INC.
    Inventors: Leonard MacAdams, Dalip Kohli
  • Patent number: 9789646
    Abstract: A method for surface preparation of composite substrates prior to adhesive bonding. A curable surface treatment layer is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the surface treatment layer remains partially cured. The surface treatment layer may be a resin film or a removal peel ply composed of resin-impregnated fabric. After surface preparation, the composite substrate is provided with a chemically-active, bondable surface that can be adhesively bonded to another composite substrate to form a covalently-bonded structure.
    Type: Grant
    Filed: October 27, 2015
    Date of Patent: October 17, 2017
    Assignee: Cytec Industries Inc.
    Inventors: Leonard MacAdams, Dalip Kohli
  • Publication number: 20170190165
    Abstract: Peel ply for surface preparation and a method of surface preparation prior to adhesive bonding. A resin-rich peel ply is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the matrix resin in the peel ply remains partially cured. When the peel ply is removed, a roughened, bondable surface with chemically-active functional groups is revealed. The composite substrate with the chemically-active, bondable surface may be bonded to another composite substrate to form a covalently-bonded structure.
    Type: Application
    Filed: March 18, 2017
    Publication date: July 6, 2017
    Applicant: CYTEC INDUSTRIES INC.
    Inventors: Leonard MacAdams, Dalip Kohli
  • Patent number: 9636867
    Abstract: Peel ply for surface preparation and a method of surface preparation prior to adhesive bonding. A resin-rich peel ply is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the matrix resin in the peel ply remains partially cured. When the peel ply is removed, a roughened, bondable surface with chemically-active functional groups is revealed. The composite substrate with the chemically-active, bondable surface may be bonded to another composite substrate to form a covalently-bonded structure.
    Type: Grant
    Filed: July 24, 2014
    Date of Patent: May 2, 2017
    Assignee: CYTEC INDUSTRIES INC.
    Inventors: Leonard MacAdams, Dalip Kohli
  • Publication number: 20160121591
    Abstract: A method for surface preparation of composite substrates prior to adhesive bonding. A curable surface treatment layer is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the surface treatment layer remains partially cured. The surface treatment layer may be a resin film or a removal peel ply composed of resin-impregnated fabric. After surface preparation, the composite substrate is provided with a chemically-active, bondable surface that can be adhesively bonded to another composite substrate to form a covalently-bonded structure.
    Type: Application
    Filed: October 27, 2015
    Publication date: May 5, 2016
    Applicant: Cytec Industries Inc.
    Inventors: Leonard MacAdams, Dalip Kohli
  • Publication number: 20150056433
    Abstract: Peel ply for surface preparation and a method of surface preparation prior to adhesive bonding. A resin-rich peel ply is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the matrix resin in the peel ply remains partially cured. When the peel ply is removed, a roughened, bondable surface with chemically-active functional groups is revealed. The composite substrate with the chemically-active, bondable surface may be bonded to another composite substrate to form a covalently-bonded structure.
    Type: Application
    Filed: July 24, 2014
    Publication date: February 26, 2015
    Applicant: CYTEC INDUSTRIES INC.
    Inventors: Leonard MacAdams, Dalip Kohli
  • Publication number: 20140187672
    Abstract: Corrosion-inhibiting microgels that are suitable for use in non-chromated primer compositions. Each discrete microgel is composed of a cross-linked polymer network and organic corrosion-inhibiting compounds entrapped or immobilized within the polymer network.
    Type: Application
    Filed: December 18, 2013
    Publication date: July 3, 2014
    Inventors: Yiqiang Zhao, Dalip Kohli, Keltoum Ouzineb
  • Patent number: 8518208
    Abstract: Thermosetting adhesive compositions formed from an epoxy resin containing nano-sized core-shell particles, one or more thermoplastic toughening agent containing an amine-terminated polyethersulfone, and at least one multi-functional epoxy resin, together with at least one amine curing agent to allow full cure of the adhesive composition up to 400° F. are provided herein. Such compositions are useful for forming adhesive films that can bond composite/metal/honeycomb structures for aerospace including bonding of aircraft leading or trailing edges, acoustic nacelle structures, horizontal and vertical tail, and various other structures, as well as for other high performance industrial applications.
    Type: Grant
    Filed: August 26, 2010
    Date of Patent: August 27, 2013
    Assignee: Cytec Technology Corp.
    Inventor: Dalip Kohli
  • Publication number: 20110048637
    Abstract: Thermosetting adhesive compositions formed from an epoxy resin containing nano-sized core-shell particles, one or more thermoplastic toughening agent containing an amine-terminated polyethersulfone, and at least one multi-functional epoxy resin, together with at least one amine curing agent to allow full cure of the adhesive composition up to 400° F. are provided herein. Such compositions are useful for forming adhesive films that can bond composite/metal/honeycomb structures for aerospace including bonding of aircraft leading or trailing edges, acoustic nacelle structures, horizontal and vertical tail, and various other structures, as well as for other high performance industrial applications.
    Type: Application
    Filed: August 26, 2010
    Publication date: March 3, 2011
    Applicant: CYTEC TECHNOLOGY CORP.
    Inventor: Dalip KOHLI
  • Patent number: 6475621
    Abstract: The subject invention pertains to an aqueous primer for use on metal surfaces to which a composite or a metal adherend is bonded. The primer composition includes an aqueous dispersion of: (a) at least one thermosetting resin curable at an elevated temperature; (b) at least one organosilane, each said organosilane containing at least ore hydrolyzable group; and (c) a curing agent. The aqueous primer composition contains substantially no volatile organic solvent, is environmentally superior to solvent-based primers, is storage stable, exhibits excellent solvent resistance and performs without loss of physical properties.
    Type: Grant
    Filed: September 11, 1998
    Date of Patent: November 5, 2002
    Assignee: Cytec Technology Corp.
    Inventors: Dalip Kohli, Elaine Dickerson