Patents by Inventor Dalip Kohli
Dalip Kohli has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10773508Abstract: Peel ply for surface preparation and a method of surface preparation prior to adhesive bonding. A resin-rich peel ply is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the matrix resin in the peel ply remains partially cured. When the peel ply is removed, a roughened, bondable surface with chemically-active functional groups is revealed. The composite substrate with the chemically-active, bondable surface may be bonded to another composite substrate to form a covalently-bonded structure.Type: GrantFiled: March 18, 2017Date of Patent: September 15, 2020Assignee: CYTEC INDUSTRIES INC.Inventors: Leonard MacAdams, Dalip Kohli
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Patent number: 10315404Abstract: A method for surface preparation of composite substrates prior to adhesive bonding. A curable surface treatment layer is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the surface treatment layer remains partially cured. The surface treatment layer may be a resin film or a removal peel ply composed of resin-impregnated fabric. After surface preparation, the composite substrate is provided with a chemically-active, bondable surface that can be adhesively bonded to another composite substrate to form a covalently-bonded structure.Type: GrantFiled: September 18, 2017Date of Patent: June 11, 2019Assignee: CYTEC INDUSTRIES INC.Inventors: Leonard MacAdams, Dalip Kohli
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Patent number: 10240048Abstract: Corrosion-inhibiting microgels that are suitable for use in non-chromated primer compositions. Each discrete microgel is composed of a cross-linked polymer network and organic corrosion-inhibiting compounds entrapped or immobilized within the polymer network.Type: GrantFiled: December 18, 2013Date of Patent: March 26, 2019Assignee: CYTEC INDUSTRIES INC.Inventors: Yiqiang Zhao, Dalip Kohli, Keltoum Ouzineb
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Publication number: 20180001572Abstract: A method for surface preparation of composite substrates prior to adhesive bonding. A curable surface treatment layer is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the surface treatment layer remains partially cured. The surface treatment layer may be a resin film or a removal peel ply composed of resin-impregnated fabric. After surface preparation, the composite substrate is provided with a chemically-active, bondable surface that can be adhesively bonded to another composite substrate to form a covalently-bonded structure.Type: ApplicationFiled: September 18, 2017Publication date: January 4, 2018Applicant: CYTEC INDUSTRIES INC.Inventors: Leonard MacAdams, Dalip Kohli
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Patent number: 9789646Abstract: A method for surface preparation of composite substrates prior to adhesive bonding. A curable surface treatment layer is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the surface treatment layer remains partially cured. The surface treatment layer may be a resin film or a removal peel ply composed of resin-impregnated fabric. After surface preparation, the composite substrate is provided with a chemically-active, bondable surface that can be adhesively bonded to another composite substrate to form a covalently-bonded structure.Type: GrantFiled: October 27, 2015Date of Patent: October 17, 2017Assignee: Cytec Industries Inc.Inventors: Leonard MacAdams, Dalip Kohli
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Publication number: 20170190165Abstract: Peel ply for surface preparation and a method of surface preparation prior to adhesive bonding. A resin-rich peel ply is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the matrix resin in the peel ply remains partially cured. When the peel ply is removed, a roughened, bondable surface with chemically-active functional groups is revealed. The composite substrate with the chemically-active, bondable surface may be bonded to another composite substrate to form a covalently-bonded structure.Type: ApplicationFiled: March 18, 2017Publication date: July 6, 2017Applicant: CYTEC INDUSTRIES INC.Inventors: Leonard MacAdams, Dalip Kohli
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Patent number: 9636867Abstract: Peel ply for surface preparation and a method of surface preparation prior to adhesive bonding. A resin-rich peel ply is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the matrix resin in the peel ply remains partially cured. When the peel ply is removed, a roughened, bondable surface with chemically-active functional groups is revealed. The composite substrate with the chemically-active, bondable surface may be bonded to another composite substrate to form a covalently-bonded structure.Type: GrantFiled: July 24, 2014Date of Patent: May 2, 2017Assignee: CYTEC INDUSTRIES INC.Inventors: Leonard MacAdams, Dalip Kohli
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Publication number: 20160121591Abstract: A method for surface preparation of composite substrates prior to adhesive bonding. A curable surface treatment layer is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the surface treatment layer remains partially cured. The surface treatment layer may be a resin film or a removal peel ply composed of resin-impregnated fabric. After surface preparation, the composite substrate is provided with a chemically-active, bondable surface that can be adhesively bonded to another composite substrate to form a covalently-bonded structure.Type: ApplicationFiled: October 27, 2015Publication date: May 5, 2016Applicant: Cytec Industries Inc.Inventors: Leonard MacAdams, Dalip Kohli
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Publication number: 20150056433Abstract: Peel ply for surface preparation and a method of surface preparation prior to adhesive bonding. A resin-rich peel ply is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the matrix resin in the peel ply remains partially cured. When the peel ply is removed, a roughened, bondable surface with chemically-active functional groups is revealed. The composite substrate with the chemically-active, bondable surface may be bonded to another composite substrate to form a covalently-bonded structure.Type: ApplicationFiled: July 24, 2014Publication date: February 26, 2015Applicant: CYTEC INDUSTRIES INC.Inventors: Leonard MacAdams, Dalip Kohli
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Publication number: 20140187672Abstract: Corrosion-inhibiting microgels that are suitable for use in non-chromated primer compositions. Each discrete microgel is composed of a cross-linked polymer network and organic corrosion-inhibiting compounds entrapped or immobilized within the polymer network.Type: ApplicationFiled: December 18, 2013Publication date: July 3, 2014Inventors: Yiqiang Zhao, Dalip Kohli, Keltoum Ouzineb
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Patent number: 8518208Abstract: Thermosetting adhesive compositions formed from an epoxy resin containing nano-sized core-shell particles, one or more thermoplastic toughening agent containing an amine-terminated polyethersulfone, and at least one multi-functional epoxy resin, together with at least one amine curing agent to allow full cure of the adhesive composition up to 400° F. are provided herein. Such compositions are useful for forming adhesive films that can bond composite/metal/honeycomb structures for aerospace including bonding of aircraft leading or trailing edges, acoustic nacelle structures, horizontal and vertical tail, and various other structures, as well as for other high performance industrial applications.Type: GrantFiled: August 26, 2010Date of Patent: August 27, 2013Assignee: Cytec Technology Corp.Inventor: Dalip Kohli
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Publication number: 20110048637Abstract: Thermosetting adhesive compositions formed from an epoxy resin containing nano-sized core-shell particles, one or more thermoplastic toughening agent containing an amine-terminated polyethersulfone, and at least one multi-functional epoxy resin, together with at least one amine curing agent to allow full cure of the adhesive composition up to 400° F. are provided herein. Such compositions are useful for forming adhesive films that can bond composite/metal/honeycomb structures for aerospace including bonding of aircraft leading or trailing edges, acoustic nacelle structures, horizontal and vertical tail, and various other structures, as well as for other high performance industrial applications.Type: ApplicationFiled: August 26, 2010Publication date: March 3, 2011Applicant: CYTEC TECHNOLOGY CORP.Inventor: Dalip KOHLI
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Patent number: 6475621Abstract: The subject invention pertains to an aqueous primer for use on metal surfaces to which a composite or a metal adherend is bonded. The primer composition includes an aqueous dispersion of: (a) at least one thermosetting resin curable at an elevated temperature; (b) at least one organosilane, each said organosilane containing at least ore hydrolyzable group; and (c) a curing agent. The aqueous primer composition contains substantially no volatile organic solvent, is environmentally superior to solvent-based primers, is storage stable, exhibits excellent solvent resistance and performs without loss of physical properties.Type: GrantFiled: September 11, 1998Date of Patent: November 5, 2002Assignee: Cytec Technology Corp.Inventors: Dalip Kohli, Elaine Dickerson