Abstract: A surfacing material that is mold-releasable and electrically conductive. This surfacing material can be co-cured with a curable composite substrate and can be in contact with a mold surface such that when the cured composite part is removed from the mold, the surfacing material is releasable from the mold with ease. The mold-releasable surfacing material can effectively eliminate the need for mold release agents and mold surface preparation.

Abstract: A multifunctional surfacing material capable of providing lightning strike protection (LSP) and burn-through resistance. In one embodiment, the multifunctional surfacing material is composed of a conductive layer positioned between two resin layers, at least one of which contains one or more fire retardant compounds. In another embodiment, the multifunctional surfacing material is composed of a conductive layer positioned between two resin layers one of which is a thermally-stable layer. The surfacing material is co-curable with a composite substrate, e.g. prepreg or prepreg layup, which contains fiber-reinforced matrix resin.

Abstract: Multifunctional surfacing materials for use in composite structures are disclosed. According to one embodiment, the surfacing material includes (a) a stiffening layer, (b) a curable resin layer, (c) a conductive layer, and (d) a nonwoven layer, wherein the stiffening layer (a) and the nonwoven layer (d) are outermost layers, and the exposed surfaces of the outermost layers are substantially tack-free at room temperature (20° C. to 25° C.). The conductive layer may be interposed between the curable resin layer and the stiffening layer or embedded in the curable resin layer. According to another embodiment, the surfacing material includes a fluid barrier film between two curable resin layers. The surfacing materials may be in the form of a continuous or elongated tape that is suitable for automated placement.

Abstract: A multifunctional surfacing material capable of providing lightning strike protection (LSP) and burn-through resistance. In one embodiment, the multifunctional surfacing material is composed of a conductive layer positioned between two resin layers, at least one of which contains one or more fire retardant compounds. In another embodiment, the multifunctional surfacing material is composed of a conductive layer positioned between two resin layers one of which is a thermally-stable layer. The surfacing material is co-curable with a composite substrate, e.g. prepreg or prepreg layup, which contains fiber-reinforced matrix resin.

Abstract: A multifunctional surfacing material capable of providing lightning strike protection (LSP) and burn-through resistance. In one embodiment, the multifunctional surfacing material is composed of a conductive layer positioned between two resin layers, at least one of which contains one or more fire retardant compounds. In another embodiment, the multifunctional surfacing material is composed of a conductive layer positioned between two resin layers one of which is a thermally-stable layer. The surfacing material is co-curable with a composite substrate, e.g. prepreg or prepreg layup, which contains fiber-reinforced matrix resin.

Abstract: Multifunctional surfacing materials for use in composite structures are disclosed. According to one embodiment, the surfacing material includes (a) a stiffening layer, (b) a curable resin layer, (c) a conductive layer, and (d) a nonwoven layer, wherein the stiffening layer (a) and the nonwoven layer (d) are outermost layers, and the exposed surfaces of the outermost layers are substantially tack-free at room temperature (20° C. to 25° C.). The conductive layer may be interposed between the curable resin layer and the stiffening layer or embedded in the curable resin layer. According to another embodiment, the surfacing material includes a fluid barrier film between two curable resin layers. The surfacing materials may be in the form of a continuous or elongated tape that is suitable for automated placement.

Abstract: Multifunctional surfacing materials for use in composite structures are disclosed. According to one embodiment, the surfacing material includes (a) a stiffening layer, (b) a curable resin layer, (c) a conductive layer, and (d) a nonwoven layer, wherein the stiffening layer (a) and the nonwoven layer (d) are outermost layers, and the exposed surfaces of the outermost layers are substantially tack-free at room temperature (20° C. to 25° C.). The conductive layer may be interposed between the curable resin layer and the stiffening layer or embedded in the curable resin layer. According to another embodiment, the surfacing material includes a fluid barrier film between two curable resin layers. The surfacing materials may be in the form of a continuous or elongated tape that is suitable for automated placement.

Abstract: A surfacing material that is mold-releasable and electrically conductive. This surfacing material can be co-cured with a curable composite substrate and can be in contact with a mold surface such that when the cured composite part is removed from the mold, the surfacing material is releasable from the mold with ease. The mold-releasable surfacing material can effectively eliminate the need for mold release agents and mold surface preparation.

Abstract: A surfacing material that is mold-releasable and electrically conductive. This surfacing material can be co-cured with a curable composite substrate and can be in contact with a mold surface such that when the cured composite part is removed from the mold, the surfacing material is releasable from the mold with ease. The mold-releasable surfacing material can effectively eliminate the need for mold release agents and mold surface preparation.

Abstract: A water-based bonding primer composition and a method of applying the same onto a metallic surface prior to adhesive bonding. The bonding primer composition is a water-based dispersion containing water, one or more epoxy resins, at least one curing agent, a silane compound, a low amount of a carbon-based material in particulate form, and optional additives. The carbon-based material is selected from graphene, graphene oxide (GO), graphite, carbon with various structures in micron-scale or nanoscale size, and combination thereof.

Abstract: An electrically conductive surfacing material capable of providing sufficient conductivity for lightning strike protection (LSP) and/or electromagnetic interference (EMI) shielding is disclosed. The conductive surfacing material is a multi-layered structure having a very thin conductive layer (e.g. solid metal foil) and a resin film formed on at least one surface of the conductive layer. The resin film is formed from a curable resin composition containing an epoxy novolac resin, a tri-functional or tetra-functional epoxy resin, ceramic microspheres, a latent amine-based curing agent, particulate inorganic fillers; and a toughening component. Optionally, the resin film further includes conductive additives to increase electrical conductivity of the surfacing material. The resin film exhibits high Tg as well as high resistance to paint stripper solutions. Furthermore, the conductive surfacing material is suitable for co-curing with fiber-reinforced resin composite substrates.

Abstract: A multifunctional surfacing material capable of providing lightning strike protection (LSP) and burn-through resistance. In one embodiment, the multifunctional surfacing material is composed of a conductive layer positioned between two resin layers, at least one of which contains one or more fire retardant compounds. In another embodiment, the multifunctional surfacing material is composed of a conductive layer positioned between two resin layers one of which is a thermally-stable layer. The surfacing material is co-curable with a composite substrate, e.g. prepreg or prepreg layup, which contains fiber-reinforced matrix resin.

Abstract: A surfacing material that is mold-releasable and electrically conductive. This surfacing material can be co-cured with a curable composite substrate and can be in contact with a mold surface such that when the cured composite part is removed from the mold, the surfacing material is releasable from the mold with ease. The mold-releasable surfacing material can effectively elimiate the need for mold release agents and mold surface preparation.

Abstract: Multifunctional surfacing materials for use in composite structures are disclosed. According to one embodiment, the surfacing material includes (a) a stiffening layer, (b) a curable resin layer, (c) a conductive layer, and (d) a nonwoven layer, wherein the stiffening layer (a) and the nonwoven layer (d) are outermost layers, and the exposed surfaces of the outermost layers are substantially tack-free at room temperature (20° C. to 25° C.). The conductive layer may be interposed between the curable resin layer and the stiffening layer or embedded in the curable resin layer. According to another embodiment, the surfacing material includes a fluid barrier film between two curable resin layers. The surfacing materials may be in the form of a continuous or elongated tape that is suitable for automated placement.

Abstract: A resin-rich peel ply that does not leave behind residual fibers after peeling and can work well with different resin-based composite substrates. The resin-rich peel ply is composed of a woven fabric impregnated with a resin matrix different from the resin matrix of the composite substrate. The peel ply is designed such that, upon manual removal of the peel ply from the composite substrate's surface, a thin film of the peel ply resin remains on the composite substrate's surface to create a bondable surface capable of bonding with another composite substrate, but no fibrous material from the woven fabric remains on the same surface.

Abstract: A water-based bonding primer composition and a method of applying the same onto a metallic surface prior to adhesive bonding. The bonding primer composition is a water-based dispersion containing water, one or more epoxy resins, at least one curing agent, a silane compound, a low amount of a carbon-based material in particulate form, and optional additives. The carbon-based material is selected from graphene, graphene oxide (GO), graphite, carbon with various structures in micron-scale or nanoscale size, and combination thereof.

Abstract: A method for making a composite structure with a surfacing film thereon. The surfacing film is co-cured with fiber-reinforced resin composite materials. The surfacing film is formed from a curable resin composition containing an epoxy novolac resin, a tri-functional or tetra-functional epoxy resin, ceramic microspheres, an amine-based curing agent, particulate inorganic fillers; and a toughening component. The surfacing film exhibits high Tg and high cross-linked density after curing, as well as high resistance to paint stripper solutions.

Abstract: A method for making a composite structure with a surfacing film thereon. The surfacing film is co-cured with fiber-reinforced resin composite materials. The surfacing film is formed from a curable resin composition containing an epoxy novolac resin, a tri-functional or tetra-functional epoxy resin, ceramic microspheres, an amine-based curing agent, particulate inorganic fillers; and a toughening component. The surfacing film exhibits high Tg and high cross-linked density after curing, as well as high resistance to paint stripper solutions.

Abstract: An electrically conductive surfacing material capable of providing sufficient conductivity for lightning strike protection (LSP) and/or electromagnetic interference (EMI) shielding is disclosed. The conductive surfacing material is a multi-layered structure having a very thin conductive layer (e.g. solid metal foil) and a resin film formed on at least one surface of the conductive layer. The resin film is formed from a curable resin composition containing an epoxy novolac resin, a tri-functional or tetra-functional epoxy resin, ceramic microspheres, a latent amine-based curing agent, particulate inorganic fillers; and a toughening component. Optionally, the resin film further includes conductive additives to increase electrical conductivity of the surfacing material. The resin film exhibits high Tg as well as high resistance to paint stripper solutions. Furthermore, the conductive surfacing material is suitable for co-curing with fiber-reinforced resin composite substrates.

Abstract: A surfacing film is formed from a curable resin composition containing an epoxy novolac resin, a tri-functional or tetra-functional epoxy resin, ceramic microspheres, an amine-based curing agent, particulate inorganic fillers; and a toughening component. The surfacing film exhibits high Tg and high cross-linked density after curing, as well as high resistance to paint stripper solutions. The surfacing film is suitable for co-curing with fiber-reinforced resin composite materials. The surfacing film may optionally contain electrically conductive additives to provide sufficient conductivity for lightning strike protection (LSP) or electromagnetic interference (EMI) shielding.