Patents by Inventor Dalip Kumar
Dalip Kumar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9620949Abstract: An electrically conductive surfacing material capable of providing sufficient conductivity for lightning strike protection (LSP) and/or electromagnetic interference (EMI) shielding is disclosed. The conductive surfacing material is a multi-layered structure having a very thin conductive layer (e.g. solid metal foil) and a resin film formed on at least one surface of the conductive layer. The resin film is formed from a curable resin composition containing an epoxy novolac resin, a tri-functional or tetra-functional epoxy resin, ceramic microspheres, a latent amine-based curing agent, particulate inorganic fillers; and a toughening component. Optionally, the resin film further includes conductive additives to increase electrical conductivity of the surfacing material. The resin film exhibits high Tg as well as high resistance to paint stripper solutions. Furthermore, the conductive surfacing material is suitable for co-curing with fiber-reinforced resin composite substrates.Type: GrantFiled: November 26, 2013Date of Patent: April 11, 2017Assignee: Cytec Industries Inc.Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli
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Publication number: 20170066226Abstract: A resin-rich peel ply that does not leave behind residual fibers after peeling and can work well with different resin-based composite substrates. The resin-rich peel ply is composed of a woven fabric impregnated with a resin matrix different from the resin matrix of the composite substrate. The peel ply is designed such that, upon manual removal of the peel ply from the composite substrate's surface, a thin film of the peel ply resin remains on the composite substrate's surface to create a bondable surface capable of bonding with another composite substrate, but no fibrous material from the woven fabric remains on the same surface.Type: ApplicationFiled: September 13, 2016Publication date: March 9, 2017Applicant: Cytec Technology Corp.Inventors: Yiqiang ZHAO, Dalip Kumar KOHLI, Kunal Gaurang SHAH
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Patent number: 9473459Abstract: A resin-rich peel ply that does not leave behind residual fibers after peeling and can work well with different resin-based composite substrates. The resin-rich peel ply is composed of a woven fabric impregnated with a resin matrix different from the resin matrix of the composite substrate. The peel ply is designed such that, upon manual removal of the peel ply from the composite substrate's surface, a thin film of the peel ply resin remains on the composite substrate's surface to create a bondable surface capable of bonding with another composite substrate, but no fibrous material from the woven fabric remains on the same surface.Type: GrantFiled: November 16, 2012Date of Patent: October 18, 2016Assignee: Cytec Technology Corp.Inventors: Yiqiang Zhao, Dalip Kumar Kohli, Kunal Gaurang Shah
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Patent number: 9107445Abstract: A composition has a gas containing agent or gas producing agent, a foam stabilizer and a food acid source. In one advantageous form, when the composition is dissolved in a liquid medium, a resulting beverage preferably has a pH between 2.5 and 5.4, and a viscosity between 1.0 and 10.0 cP when at a concentration between 1 and 150 grams per liter at a temperature between 2 and 28° C. In another advantageous form, the composition is water soluble in cold water, e.g., at a temperature between 2 and 28° C. In an alternative form, various components of the composition will be present in a premade liquid to which a gas containing agent or gas producing agent is added just prior to consumption.Type: GrantFiled: July 10, 2009Date of Patent: August 18, 2015Assignee: INTERCONTINENTAL GREAT BRANDS LLCInventors: Kieran Patrick Spelman, Antonio Paulo Pivesso, Jr., Marcio Hideo Nagata, Dalip Kumar Nayyar
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Patent number: 8974905Abstract: A structural adhesive composition that is suitable for high-strength bonding of metals and aerospace structural materials. In one embodiment, the structural adhesive composition based on a two-part system, which is curable at or below 200° F. (93° C.). The two-part system is composed of a resinous part (A) and a catalyst part (B), which may be stored separately at room temperature until they are ready to be used. The resinous part (A) includes at least two different multifunctional epoxy resins with different functionality selected from difunctional, trifunctional, and tetrafunctional epoxy resins, certain toughening components, and inorganic filler particles as a rheology/thixotrophy modifying component. The toughening components include core-shell rubber particles with different particle sizes and at least one of an elastomeric polymer and a polyethersulfone polymer.Type: GrantFiled: October 13, 2014Date of Patent: March 10, 2015Assignee: Cytec Technology Corp.Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli, Kunal Gaurang Shah
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Publication number: 20150030844Abstract: A structural adhesive composition that is suitable for high-strength bonding of metals and aerospace structural materials. In one embodiment, the structural adhesive composition based on a two-part system, which is curable at or below 200° F. (93° C.). The two-part system is composed of a resinous part (A) and a catalyst part (B), which may be stored separately at room temperature until they are ready to be used. The resinous part (A) includes at least two different multifunctional epoxy resins with different functionality selected from difunctional, trifunctional, and tetrafunctional epoxy resins, certain toughening components, and inorganic filler particles as a rheology/thixotrophy modifying component. The toughening components include core-shell rubber particles with different particle sizes and at least one of an elastomeric polymer and a polyethersulfone polymer.Type: ApplicationFiled: October 13, 2014Publication date: January 29, 2015Applicant: CYTEC TECHNOLOGY CORP.Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli, Kunal Gaurang Shah
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Patent number: 8895148Abstract: A structural adhesive composition that is suitable for high-strength bonding of metals and aerospace structural materials. In one embodiment, the structural adhesive composition based on a two-part system, which is curable at or below 200° F. (93° C.). The two-part system is composed of a resinous part (A) and a catalyst part (B), which may be stored separately at room temperature until they are ready to be used. The resinous part (A) includes at least two different multifunctional epoxy resins, toughening components, and inorganic filler particles. The catalyst part (B) includes an aliphatic or cyclic amine compound as a curing agent and inorganic filler. In another embodiment, the structural adhesive composition is based on a one-part system, which includes the components of the resinous part (A) mixed with a latent amine curing agent. The one-part system may further include an imidazole and/or an aliphatic amine.Type: GrantFiled: October 16, 2012Date of Patent: November 25, 2014Assignee: Cytec Technology Corp.Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli, Kunal Gaurang Shah
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Patent number: 8779035Abstract: Non-chromated corrosion inhibiting primer formulations having one or more active corrosion inhibitors covalently anchored, or optionally covalently anchored, onto an organic and/or inorganic reactive specie are provided herein.Type: GrantFiled: March 30, 2010Date of Patent: July 15, 2014Assignee: Cytec Technology Corp.Inventors: Kunal Gaurang Shah, Dalip Kumar Kohli
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Patent number: 8772391Abstract: Embodiments of the present disclosure present electrically conductive, thermosetting compositions for use in surfacing films and adhesives. The surfacing films possess enhanced electrical conductivity, comparable to metals, without the use of embedded metal screens or foils. Such surfacing films may be incorporated into composite structures (e.g., prepregs, tapes, and fabrics), for example, by co-curing, as an outermost surface layer. In particular, compositions formed using silver flakes as conductive fillers are found to exhibit very high electrical conductivity. For example, compositions including greater than 45 wt. % silver flake exhibit resistivities less than about 55 m?/sq. In this manner, the surfacing films as an outermost conductive layer may provide lighting strike protection (LSP) and electromagnetic interference (EMI) shielding when used in applications such as aircraft components.Type: GrantFiled: December 14, 2012Date of Patent: July 8, 2014Assignee: Cytec Technology Corp.Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli
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Publication number: 20140154496Abstract: An electrically conductive surfacing material capable of providing sufficient conductivity for lightning strike protection (LSP) and/or electromagnetic interference (EMI) shielding is disclosed. The conductive surfacing material is a multi-layered structure having a very thin conductive layer (e.g. solid metal foil) and a resin film formed on at least one surface of the conductive layer. The resin film is formed from a curable resin composition containing an epoxy novolac resin, a tri-functional or tetra-functional epoxy resin, ceramic microspheres, a latent amine-based curing agent, particulate inorganic fillers; and a toughening component. Optionally, the resin film further includes conductive additives to increase electrical conductivity of the surfacing material. The resin film exhibits high Tg as well as high resistance to paint stripper solutions. Furthermore, the conductive surfacing material is suitable for co-curing with fiber-reinforced resin composite substrates.Type: ApplicationFiled: November 26, 2013Publication date: June 5, 2014Applicant: Cytec Industries Inc.Inventors: Junjie Jeffrey SANG, Dalip Kumar KOHLI
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Publication number: 20130183420Abstract: The disclosure relates to methods of treating whole, cut, or other processed botanical ingredient(s) in a manner that reduces the load of viable food-contaminating organisms (human or other animal pathogens and food spoilage organisms), preferably without substantially altering one or more of the organoleptic properties of the ingredient(s). The method includes subjecting a botanical foodstuff to a high pressure processing (HPP) treatment and to aseptically sealing the foodstuff within a package that contains a microbistat. Such treatments improve the storage stability of the foodstuff and preferably do not significantly alter one or more organoleptic properties of the botanical ingredient(s). Packaged foodstuffs treated as described herein exhibit beneficial properties, such as retention of taste, appearance, and texture and extended shelf life, relative to non-treated foodstuffs.Type: ApplicationFiled: January 13, 2012Publication date: July 18, 2013Inventors: Justin Wade Shimek, Dalip Kumar Nayyar, Steven Bautista, David Glen Anderson
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Patent number: 8357740Abstract: Embodiments of the present disclosure present electrically conductive, thermosetting compositions for use in surfacing films and adhesives. The surfacing films possess enhanced electrical conductivity, comparable to metals, without the use of embedded metal screens or foils. Such surfacing films may be incorporated into composite structures (e.g., prepregs, tapes, and fabrics), for example, by co-curing, as an outermost surface layer. In particular, compositions formed using silver flakes as conductive fillers are found to exhibit very high electrical conductivity. For example, compositions including greater than 45 wt. % silver flake exhibit resistivities less than about 55 m?/sq. In this manner, the surfacing films as an outermost conductive layer may provide lighting strike protection (LSP) and electromagnetic interference (EMI) shielding when used in applications such as aircraft components.Type: GrantFiled: May 10, 2012Date of Patent: January 22, 2013Assignee: Cytec Technology Corp.Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli
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Publication number: 20120219786Abstract: Embodiments of the present disclosure present electrically conductive, thermosetting compositions for use in surfacing films and adhesives. The surfacing films possess enhanced electrical conductivity, comparable to metals, without the use of embedded metal screens or foils. Such surfacing films may be incorporated into composite structures (e.g., prepregs, tapes, and fabrics), for example, by co-curing, as an outermost surface layer. In particular, compositions formed using silver flakes as conductive fillers are found to exhibit very high electrical conductivity. For example, compositions including greater than 45 wt. % silver flake exhibit resistivities less than about 55 m?/sq. In this manner, the surfacing films as an outermost conductive layer may provide lighting strike protection (LSP) and electromagnetic interference (EMI) shielding when used in applications such as aircraft components.Type: ApplicationFiled: May 10, 2012Publication date: August 30, 2012Applicant: CYTEC TECHNOLOGY CORPInventors: Junjie Jeffrey Sang, Dalip Kumar Kohli
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Publication number: 20120190773Abstract: The present invention is a one-part ultraviolet light and abrasion resistant pigmented surfacing film composition adapted for co-curing with an amine cured composite prepreg material using a chain extended base cycloaliphatic epoxy resin. The chain extended cycloaliphatic epoxy resin is formed through the pre-reaction of a base cycloaliphatic epoxy resin with a chain extension agent such as bisphenol and a high molecular weight elastomer in the presence of triphenyl phosphine to chain link the base cycloaliphatic epoxy resin to form a film formable cycloaliphatic resin prereact capable of low temperature curing when added to a latent amine based epoxy curing agent; an amine catalyst; at least one filler; at least one pigment; and a flow control agent to form surfacing film composition. The surfacing film composition adapted for co-curing with an amine curable composite from about 180° F. to about 350° F.Type: ApplicationFiled: November 9, 2007Publication date: July 26, 2012Inventor: Dalip Kumar Kohli
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Publication number: 20120171477Abstract: A method of fabricating a composite structure having a conductive surface is disclosed herein. The composite structure is formed by laminating a self-surfacing, conductive prepreg to one or prepreg plies or tapes to form a layup. The self-surfacing, conductive prepreg comprises a conductive surfacing film with a conductivity of less than 20 milliOhms formed on at least one surface of a prepreg ply or tape. Furthermore, the self-surfacing, conductive prepreg is suitable for use in an Automated Fiber Placement (AFP) process.Type: ApplicationFiled: December 13, 2011Publication date: July 5, 2012Applicant: CYTEC TECHNOLOGY CORP.Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli
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Patent number: 8178606Abstract: Embodiments of the present disclosure present electrically conductive, thermosetting compositions for use in surfacing films and adhesives. The surfacing films possess enhanced electrical conductivity, comparable to metals, without the use of embedded metal screens or foils. Such surfacing films may be incorporated into composite structures (e.g., prepregs, tapes, and fabrics), for example, by co-curing, as an outermost surface layer. In particular, compositions formed using silver flakes as conductive fillers are found to exhibit very high electrical conductivity. For example, compositions including greater than 45 wt. % silver flake exhibit resistivities less than about 55 m?/sq. In this manner, the surfacing films as an outermost conductive layer may provide lighting strike protection (LSP) and electromagnetic interference (EMI) shielding when used in applications such as aircraft components.Type: GrantFiled: February 9, 2010Date of Patent: May 15, 2012Assignee: Cytec Technology Corp.Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli
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Publication number: 20110008514Abstract: A composition has a gas containing agent or gas producing agent, a foam stabilizer and a food acid source. In one advantageous form, when the composition is dissolved in a liquid medium, a resulting beverage preferably has a pH between 2.5 and 5.4, and a viscosity between 1.0 and 10.0 cP when at a concentration between 1 and 150 grams per liter at a temperature between 2 and 28° C. In another advantageous form, the composition is water soluble in cold water, e.g., at a temperature between 2 and 28° C. In an alternative form, various components of the composition will be present in a premade liquid to which a gas containing agent or gas producing agent is added just prior to consumption.Type: ApplicationFiled: July 10, 2009Publication date: January 13, 2011Inventors: Kieran Patrick Spelman, Antonio Paulo Pivesso, JR., Marcio Hideo Nagata, Dalip Kumar Nayyar
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Publication number: 20100247922Abstract: Non-chromated corrosion inhibiting primer formulations having one or more active corrosion inhibitors covalently anchored, or optionally covalently anchored, onto an organic and/or inorganic reactive specie are provided herein.Type: ApplicationFiled: March 30, 2010Publication date: September 30, 2010Applicant: CYTEC TECHNOLOGY CORP.Inventors: Kunal Gaurang Shah, Dalip Kumar Kohli
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Publication number: 20100209690Abstract: Embodiments of the present disclosure present electrically conductive, thermosetting compositions for use in surfacing films and adhesives. The surfacing films possess enhanced electrical conductivity, comparable to metals, without the use of embedded metal screens or foils. Such surfacing films may be incorporated into composite structures (e.g., prepregs, tapes, and fabrics), for example, by co-curing, as an outermost surface layer. In particular, compositions formed using silver flakes as conductive fillers are found to exhibit very high electrical conductivity. For example, compositions including greater than 45 wt. % silver flake exhibit resistivities less than about 55 m?/sq. In this manner, the surfacing films as an outermost conductive layer may provide lighting strike protection (LSP) and electromagnetic interference (EMI) shielding when used in applications such as aircraft components.Type: ApplicationFiled: February 9, 2010Publication date: August 19, 2010Applicant: CYTEC TECHNOLOGY CORP.Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli
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Patent number: 7172783Abstract: The present invention is directed to nutritionally superior cheese products and their methods of manufacture. More particularly, this invention is directed to the manufacture of nutritionally superior cheese products having at least two phases wherein at least one phase is cheese (e.g., process cheese, uncured natural cheese, cured natural cheese, and the like) and at least one phase is a second edible phase (e.g., a cheese different from the first phase, vegetables, meats, mixtures of vegetables and meats, fruit, nuts, and the like). The nutritionally superior cheese products of the present invention are prepared by co-extruding the two or more phases such that the use of adhesives or heat to bind the at least two phases is not required. Nutritional supplements (e.g., vitamins, calcium, minerals, and the like) can be incorporated into one or more of the at least two phases.Type: GrantFiled: August 10, 2004Date of Patent: February 6, 2007Assignee: Kraft Foods Holdings, Inc.Inventors: Shannon Noreen Murray, Sheryl Lynn Cole, Dalip Kumar Nayyar, Qadri Mustafa Abdallah