Patents by Inventor Dalip Kumar

Dalip Kumar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9620949
    Abstract: An electrically conductive surfacing material capable of providing sufficient conductivity for lightning strike protection (LSP) and/or electromagnetic interference (EMI) shielding is disclosed. The conductive surfacing material is a multi-layered structure having a very thin conductive layer (e.g. solid metal foil) and a resin film formed on at least one surface of the conductive layer. The resin film is formed from a curable resin composition containing an epoxy novolac resin, a tri-functional or tetra-functional epoxy resin, ceramic microspheres, a latent amine-based curing agent, particulate inorganic fillers; and a toughening component. Optionally, the resin film further includes conductive additives to increase electrical conductivity of the surfacing material. The resin film exhibits high Tg as well as high resistance to paint stripper solutions. Furthermore, the conductive surfacing material is suitable for co-curing with fiber-reinforced resin composite substrates.
    Type: Grant
    Filed: November 26, 2013
    Date of Patent: April 11, 2017
    Assignee: Cytec Industries Inc.
    Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli
  • Publication number: 20170066226
    Abstract: A resin-rich peel ply that does not leave behind residual fibers after peeling and can work well with different resin-based composite substrates. The resin-rich peel ply is composed of a woven fabric impregnated with a resin matrix different from the resin matrix of the composite substrate. The peel ply is designed such that, upon manual removal of the peel ply from the composite substrate's surface, a thin film of the peel ply resin remains on the composite substrate's surface to create a bondable surface capable of bonding with another composite substrate, but no fibrous material from the woven fabric remains on the same surface.
    Type: Application
    Filed: September 13, 2016
    Publication date: March 9, 2017
    Applicant: Cytec Technology Corp.
    Inventors: Yiqiang ZHAO, Dalip Kumar KOHLI, Kunal Gaurang SHAH
  • Patent number: 9473459
    Abstract: A resin-rich peel ply that does not leave behind residual fibers after peeling and can work well with different resin-based composite substrates. The resin-rich peel ply is composed of a woven fabric impregnated with a resin matrix different from the resin matrix of the composite substrate. The peel ply is designed such that, upon manual removal of the peel ply from the composite substrate's surface, a thin film of the peel ply resin remains on the composite substrate's surface to create a bondable surface capable of bonding with another composite substrate, but no fibrous material from the woven fabric remains on the same surface.
    Type: Grant
    Filed: November 16, 2012
    Date of Patent: October 18, 2016
    Assignee: Cytec Technology Corp.
    Inventors: Yiqiang Zhao, Dalip Kumar Kohli, Kunal Gaurang Shah
  • Patent number: 9107445
    Abstract: A composition has a gas containing agent or gas producing agent, a foam stabilizer and a food acid source. In one advantageous form, when the composition is dissolved in a liquid medium, a resulting beverage preferably has a pH between 2.5 and 5.4, and a viscosity between 1.0 and 10.0 cP when at a concentration between 1 and 150 grams per liter at a temperature between 2 and 28° C. In another advantageous form, the composition is water soluble in cold water, e.g., at a temperature between 2 and 28° C. In an alternative form, various components of the composition will be present in a premade liquid to which a gas containing agent or gas producing agent is added just prior to consumption.
    Type: Grant
    Filed: July 10, 2009
    Date of Patent: August 18, 2015
    Assignee: INTERCONTINENTAL GREAT BRANDS LLC
    Inventors: Kieran Patrick Spelman, Antonio Paulo Pivesso, Jr., Marcio Hideo Nagata, Dalip Kumar Nayyar
  • Patent number: 8974905
    Abstract: A structural adhesive composition that is suitable for high-strength bonding of metals and aerospace structural materials. In one embodiment, the structural adhesive composition based on a two-part system, which is curable at or below 200° F. (93° C.). The two-part system is composed of a resinous part (A) and a catalyst part (B), which may be stored separately at room temperature until they are ready to be used. The resinous part (A) includes at least two different multifunctional epoxy resins with different functionality selected from difunctional, trifunctional, and tetrafunctional epoxy resins, certain toughening components, and inorganic filler particles as a rheology/thixotrophy modifying component. The toughening components include core-shell rubber particles with different particle sizes and at least one of an elastomeric polymer and a polyethersulfone polymer.
    Type: Grant
    Filed: October 13, 2014
    Date of Patent: March 10, 2015
    Assignee: Cytec Technology Corp.
    Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli, Kunal Gaurang Shah
  • Publication number: 20150030844
    Abstract: A structural adhesive composition that is suitable for high-strength bonding of metals and aerospace structural materials. In one embodiment, the structural adhesive composition based on a two-part system, which is curable at or below 200° F. (93° C.). The two-part system is composed of a resinous part (A) and a catalyst part (B), which may be stored separately at room temperature until they are ready to be used. The resinous part (A) includes at least two different multifunctional epoxy resins with different functionality selected from difunctional, trifunctional, and tetrafunctional epoxy resins, certain toughening components, and inorganic filler particles as a rheology/thixotrophy modifying component. The toughening components include core-shell rubber particles with different particle sizes and at least one of an elastomeric polymer and a polyethersulfone polymer.
    Type: Application
    Filed: October 13, 2014
    Publication date: January 29, 2015
    Applicant: CYTEC TECHNOLOGY CORP.
    Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli, Kunal Gaurang Shah
  • Patent number: 8895148
    Abstract: A structural adhesive composition that is suitable for high-strength bonding of metals and aerospace structural materials. In one embodiment, the structural adhesive composition based on a two-part system, which is curable at or below 200° F. (93° C.). The two-part system is composed of a resinous part (A) and a catalyst part (B), which may be stored separately at room temperature until they are ready to be used. The resinous part (A) includes at least two different multifunctional epoxy resins, toughening components, and inorganic filler particles. The catalyst part (B) includes an aliphatic or cyclic amine compound as a curing agent and inorganic filler. In another embodiment, the structural adhesive composition is based on a one-part system, which includes the components of the resinous part (A) mixed with a latent amine curing agent. The one-part system may further include an imidazole and/or an aliphatic amine.
    Type: Grant
    Filed: October 16, 2012
    Date of Patent: November 25, 2014
    Assignee: Cytec Technology Corp.
    Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli, Kunal Gaurang Shah
  • Patent number: 8779035
    Abstract: Non-chromated corrosion inhibiting primer formulations having one or more active corrosion inhibitors covalently anchored, or optionally covalently anchored, onto an organic and/or inorganic reactive specie are provided herein.
    Type: Grant
    Filed: March 30, 2010
    Date of Patent: July 15, 2014
    Assignee: Cytec Technology Corp.
    Inventors: Kunal Gaurang Shah, Dalip Kumar Kohli
  • Patent number: 8772391
    Abstract: Embodiments of the present disclosure present electrically conductive, thermosetting compositions for use in surfacing films and adhesives. The surfacing films possess enhanced electrical conductivity, comparable to metals, without the use of embedded metal screens or foils. Such surfacing films may be incorporated into composite structures (e.g., prepregs, tapes, and fabrics), for example, by co-curing, as an outermost surface layer. In particular, compositions formed using silver flakes as conductive fillers are found to exhibit very high electrical conductivity. For example, compositions including greater than 45 wt. % silver flake exhibit resistivities less than about 55 m?/sq. In this manner, the surfacing films as an outermost conductive layer may provide lighting strike protection (LSP) and electromagnetic interference (EMI) shielding when used in applications such as aircraft components.
    Type: Grant
    Filed: December 14, 2012
    Date of Patent: July 8, 2014
    Assignee: Cytec Technology Corp.
    Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli
  • Publication number: 20140154496
    Abstract: An electrically conductive surfacing material capable of providing sufficient conductivity for lightning strike protection (LSP) and/or electromagnetic interference (EMI) shielding is disclosed. The conductive surfacing material is a multi-layered structure having a very thin conductive layer (e.g. solid metal foil) and a resin film formed on at least one surface of the conductive layer. The resin film is formed from a curable resin composition containing an epoxy novolac resin, a tri-functional or tetra-functional epoxy resin, ceramic microspheres, a latent amine-based curing agent, particulate inorganic fillers; and a toughening component. Optionally, the resin film further includes conductive additives to increase electrical conductivity of the surfacing material. The resin film exhibits high Tg as well as high resistance to paint stripper solutions. Furthermore, the conductive surfacing material is suitable for co-curing with fiber-reinforced resin composite substrates.
    Type: Application
    Filed: November 26, 2013
    Publication date: June 5, 2014
    Applicant: Cytec Industries Inc.
    Inventors: Junjie Jeffrey SANG, Dalip Kumar KOHLI
  • Publication number: 20130183420
    Abstract: The disclosure relates to methods of treating whole, cut, or other processed botanical ingredient(s) in a manner that reduces the load of viable food-contaminating organisms (human or other animal pathogens and food spoilage organisms), preferably without substantially altering one or more of the organoleptic properties of the ingredient(s). The method includes subjecting a botanical foodstuff to a high pressure processing (HPP) treatment and to aseptically sealing the foodstuff within a package that contains a microbistat. Such treatments improve the storage stability of the foodstuff and preferably do not significantly alter one or more organoleptic properties of the botanical ingredient(s). Packaged foodstuffs treated as described herein exhibit beneficial properties, such as retention of taste, appearance, and texture and extended shelf life, relative to non-treated foodstuffs.
    Type: Application
    Filed: January 13, 2012
    Publication date: July 18, 2013
    Inventors: Justin Wade Shimek, Dalip Kumar Nayyar, Steven Bautista, David Glen Anderson
  • Patent number: 8357740
    Abstract: Embodiments of the present disclosure present electrically conductive, thermosetting compositions for use in surfacing films and adhesives. The surfacing films possess enhanced electrical conductivity, comparable to metals, without the use of embedded metal screens or foils. Such surfacing films may be incorporated into composite structures (e.g., prepregs, tapes, and fabrics), for example, by co-curing, as an outermost surface layer. In particular, compositions formed using silver flakes as conductive fillers are found to exhibit very high electrical conductivity. For example, compositions including greater than 45 wt. % silver flake exhibit resistivities less than about 55 m?/sq. In this manner, the surfacing films as an outermost conductive layer may provide lighting strike protection (LSP) and electromagnetic interference (EMI) shielding when used in applications such as aircraft components.
    Type: Grant
    Filed: May 10, 2012
    Date of Patent: January 22, 2013
    Assignee: Cytec Technology Corp.
    Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli
  • Publication number: 20120219786
    Abstract: Embodiments of the present disclosure present electrically conductive, thermosetting compositions for use in surfacing films and adhesives. The surfacing films possess enhanced electrical conductivity, comparable to metals, without the use of embedded metal screens or foils. Such surfacing films may be incorporated into composite structures (e.g., prepregs, tapes, and fabrics), for example, by co-curing, as an outermost surface layer. In particular, compositions formed using silver flakes as conductive fillers are found to exhibit very high electrical conductivity. For example, compositions including greater than 45 wt. % silver flake exhibit resistivities less than about 55 m?/sq. In this manner, the surfacing films as an outermost conductive layer may provide lighting strike protection (LSP) and electromagnetic interference (EMI) shielding when used in applications such as aircraft components.
    Type: Application
    Filed: May 10, 2012
    Publication date: August 30, 2012
    Applicant: CYTEC TECHNOLOGY CORP
    Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli
  • Publication number: 20120190773
    Abstract: The present invention is a one-part ultraviolet light and abrasion resistant pigmented surfacing film composition adapted for co-curing with an amine cured composite prepreg material using a chain extended base cycloaliphatic epoxy resin. The chain extended cycloaliphatic epoxy resin is formed through the pre-reaction of a base cycloaliphatic epoxy resin with a chain extension agent such as bisphenol and a high molecular weight elastomer in the presence of triphenyl phosphine to chain link the base cycloaliphatic epoxy resin to form a film formable cycloaliphatic resin prereact capable of low temperature curing when added to a latent amine based epoxy curing agent; an amine catalyst; at least one filler; at least one pigment; and a flow control agent to form surfacing film composition. The surfacing film composition adapted for co-curing with an amine curable composite from about 180° F. to about 350° F.
    Type: Application
    Filed: November 9, 2007
    Publication date: July 26, 2012
    Inventor: Dalip Kumar Kohli
  • Publication number: 20120171477
    Abstract: A method of fabricating a composite structure having a conductive surface is disclosed herein. The composite structure is formed by laminating a self-surfacing, conductive prepreg to one or prepreg plies or tapes to form a layup. The self-surfacing, conductive prepreg comprises a conductive surfacing film with a conductivity of less than 20 milliOhms formed on at least one surface of a prepreg ply or tape. Furthermore, the self-surfacing, conductive prepreg is suitable for use in an Automated Fiber Placement (AFP) process.
    Type: Application
    Filed: December 13, 2011
    Publication date: July 5, 2012
    Applicant: CYTEC TECHNOLOGY CORP.
    Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli
  • Patent number: 8178606
    Abstract: Embodiments of the present disclosure present electrically conductive, thermosetting compositions for use in surfacing films and adhesives. The surfacing films possess enhanced electrical conductivity, comparable to metals, without the use of embedded metal screens or foils. Such surfacing films may be incorporated into composite structures (e.g., prepregs, tapes, and fabrics), for example, by co-curing, as an outermost surface layer. In particular, compositions formed using silver flakes as conductive fillers are found to exhibit very high electrical conductivity. For example, compositions including greater than 45 wt. % silver flake exhibit resistivities less than about 55 m?/sq. In this manner, the surfacing films as an outermost conductive layer may provide lighting strike protection (LSP) and electromagnetic interference (EMI) shielding when used in applications such as aircraft components.
    Type: Grant
    Filed: February 9, 2010
    Date of Patent: May 15, 2012
    Assignee: Cytec Technology Corp.
    Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli
  • Publication number: 20110008514
    Abstract: A composition has a gas containing agent or gas producing agent, a foam stabilizer and a food acid source. In one advantageous form, when the composition is dissolved in a liquid medium, a resulting beverage preferably has a pH between 2.5 and 5.4, and a viscosity between 1.0 and 10.0 cP when at a concentration between 1 and 150 grams per liter at a temperature between 2 and 28° C. In another advantageous form, the composition is water soluble in cold water, e.g., at a temperature between 2 and 28° C. In an alternative form, various components of the composition will be present in a premade liquid to which a gas containing agent or gas producing agent is added just prior to consumption.
    Type: Application
    Filed: July 10, 2009
    Publication date: January 13, 2011
    Inventors: Kieran Patrick Spelman, Antonio Paulo Pivesso, JR., Marcio Hideo Nagata, Dalip Kumar Nayyar
  • Publication number: 20100247922
    Abstract: Non-chromated corrosion inhibiting primer formulations having one or more active corrosion inhibitors covalently anchored, or optionally covalently anchored, onto an organic and/or inorganic reactive specie are provided herein.
    Type: Application
    Filed: March 30, 2010
    Publication date: September 30, 2010
    Applicant: CYTEC TECHNOLOGY CORP.
    Inventors: Kunal Gaurang Shah, Dalip Kumar Kohli
  • Publication number: 20100209690
    Abstract: Embodiments of the present disclosure present electrically conductive, thermosetting compositions for use in surfacing films and adhesives. The surfacing films possess enhanced electrical conductivity, comparable to metals, without the use of embedded metal screens or foils. Such surfacing films may be incorporated into composite structures (e.g., prepregs, tapes, and fabrics), for example, by co-curing, as an outermost surface layer. In particular, compositions formed using silver flakes as conductive fillers are found to exhibit very high electrical conductivity. For example, compositions including greater than 45 wt. % silver flake exhibit resistivities less than about 55 m?/sq. In this manner, the surfacing films as an outermost conductive layer may provide lighting strike protection (LSP) and electromagnetic interference (EMI) shielding when used in applications such as aircraft components.
    Type: Application
    Filed: February 9, 2010
    Publication date: August 19, 2010
    Applicant: CYTEC TECHNOLOGY CORP.
    Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli
  • Patent number: 7172783
    Abstract: The present invention is directed to nutritionally superior cheese products and their methods of manufacture. More particularly, this invention is directed to the manufacture of nutritionally superior cheese products having at least two phases wherein at least one phase is cheese (e.g., process cheese, uncured natural cheese, cured natural cheese, and the like) and at least one phase is a second edible phase (e.g., a cheese different from the first phase, vegetables, meats, mixtures of vegetables and meats, fruit, nuts, and the like). The nutritionally superior cheese products of the present invention are prepared by co-extruding the two or more phases such that the use of adhesives or heat to bind the at least two phases is not required. Nutritional supplements (e.g., vitamins, calcium, minerals, and the like) can be incorporated into one or more of the at least two phases.
    Type: Grant
    Filed: August 10, 2004
    Date of Patent: February 6, 2007
    Assignee: Kraft Foods Holdings, Inc.
    Inventors: Shannon Noreen Murray, Sheryl Lynn Cole, Dalip Kumar Nayyar, Qadri Mustafa Abdallah