Abstract: A method and apparatus for the forming of a solder deposit on an SMD pad on a printed circuit or hybrid board. This formed solder deposit is in a defined three-dimensional well having the proper profile and a defined solder gap. The solder before forming can be solid solder or a solder paste. By the placement of a mesh on the surface of the circuit board with the solder in place on the pads, applying a slight positive pressure on a rigid or elastic surface on the other side of the mesh, and subjecting this system to a temperature just low enough to reflow the solder by means of a heat transfer fluid, then cooling the board to solidify the solder, a product results having the above properties. The duration of the application of heat and pressure is made so brief, that the laminate structure of the board and the coating thereon remain substantially unaffected. A circuit board with the solder so formed thereon.