Abstract: Electroplating apparatus and methods for plating high aspect ratio thru-holes in printed circuit boards and the like. For copper plating thru-holes in printed circuit boards, the printed circuit board is immersed in a tank of electrolyte. Surrounding both sides of the printed circuit board are a plurality of cell-like structures which contain mechanical electrolyte agitating members, filters and electrolyte ion replenishment anode baskets. In addition, a pump is provided to encourage exhausting of the electrolyte from local regions of each side of the printed circuit board to encourage a general but definite flow of electrolyte through any thru-holes in the printed circuit board.

Abstract: Electroplating apparatus and methods for rapid and efficient plating of printed circuit board and the like are disclosed. In accordance with the method, a printed circuit board is disclosed within a tank of electrolyte and caused to oscillate in the plane of the printed circuit board. On each side of the printed circuit board are a plurality of paddle assemblies which are rotated to maintain a high degree of turbulence in the electrolyte adjacent the printed circuit board. Ion replenishment for the electrolyte is provided by baskets filled with pieces of the material to be plated, in the embodiment disclosed the baskets themselves being rotatable and having the paddle assemblies integral therewith. Electrolyte circulation is maintained by pumps with the electrolyte being withdrawn from the tank for filtering and replenishment through manifolds in the walls separating the cells within which the paddle assemblies operate. Various alternate embodiments are described.

Abstract: Electroplating apparatus and methods for rapid and efficient plating of printed circuit board and the like are disclosed. In accordance with the method, a printed circuit board is disclosed within a tank of electrolyte and caused to oscillate in the plane of the printed circuit board. On each side of the printed circuit board are a plurality of paddle assemblies which are rotated to maintain a high degree of turbulence in the electrolyte adjacent the printed cirucit board. Ion replenishment for the electrolyte is provided by baskets filled with pieces of the material to be plated, in the embodiment disclosed the baskets themselves being rotatable and having the paddle assemblies integral therewith. Electrolyte circulation is maintained by pumps with the electrolyte being withdrawn from the tank for filtering and replenishment through manifolds in the walls separating the cells within which the paddle assemblies operate. Various alternate embodiments are described.

Abstract: Electroplating apparatus and methods for plating high aspect ratio thru-holes in printed circuit boards and the like. For copper plating thru-holes in printed circuit boards, the printed circuit board is immersed in a tank of electrolyte. Surrounding both sides of the printed circuit board are a plurality of cell-like structures which contain mechanical electrolyte agitating members, filters and electrolyte ion replenishment anode baskets. In addition, a pump is provided to encourage exhausting of the electrolyte from local regions of each side of the printed circuit board to encourage a general but definite flow of electrolyte through any thru-holes in the printed circuit board.