Patents by Inventor Damien Lambert
Damien Lambert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12253714Abstract: An exemplary multi quantum well structure may include a silicon platform having a pit formed in the silicon platform, a chip positioned inside the pit, a first waveguide formed in the chip, and a second waveguide formed in the silicon platform. The pit may be defined at least in part by a sidewall and a base. The chip may include a first side and a first recess in the first side. The first side may be defined in part by a first cleaved or diced facet. The first recess may be defined in part by a first etched facet. The first waveguide may be configured to guide an optical beam to pass through the first etched facet. The second waveguide may be configured to guide the optical beam to pass through the sidewall. The second waveguide may be optically aligned with the first waveguide.Type: GrantFiled: March 6, 2023Date of Patent: March 18, 2025Assignee: Skorpios Technologies, Inc.Inventors: Paveen Apiratikul, Damien Lambert
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Patent number: 12210186Abstract: A semiconductor laser has a mirror formed in a gain chip. The mirror can be placed in the gain chip to provide a broadband reflector to support multiple lasers using the gain chip. The mirror can also be placed in the gain chip to have the semiconductor laser be more efficient or more powerful by changing an optical path length of the gain of the semiconductor laser.Type: GrantFiled: February 8, 2023Date of Patent: January 28, 2025Assignee: Skorpios Technologies, Inc.Inventor: Damien Lambert
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Publication number: 20230358951Abstract: An exemplary multi quantum well structure may include a silicon platform having a pit formed in the silicon platform, a chip positioned inside the pit, a first waveguide formed in the chip, and a second waveguide formed in the silicon platform. The pit may be defined at least in part by a sidewall and a base. The chip may include a first side and a first recess in the first side. The first side may be defined in part by a first cleaved or diced facet. The first recess may be defined in part by a first etched facet. The first waveguide may be configured to guide an optical beam to pass through the first etched facet. The second waveguide may be configured to guide the optical beam to pass through the sidewall. The second waveguide may be optically aligned with the first waveguide.Type: ApplicationFiled: March 6, 2023Publication date: November 9, 2023Applicant: Skorpios Technologies, Inc.Inventors: Paveen Apiratikul, Damien Lambert
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Publication number: 20230341620Abstract: A semiconductor laser has a mirror formed in a gain chip. The mirror can be placed in the gain chip to provide a broadband reflector to support multiple lasers using the gain chip. The mirror can also be placed in the gain chip to have the semiconductor laser be more efficient or more powerful by changing an optical path length of the gain of the semiconductor laser.Type: ApplicationFiled: February 8, 2023Publication date: October 26, 2023Inventor: Damien Lambert
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Patent number: 11624872Abstract: An exemplary multi quantum well structure may include a silicon platform having a pit formed in the silicon platform, a chip positioned inside the pit, a first waveguide formed in the chip, and a second waveguide formed in the silicon platform. The pit may be defined at least in part by a sidewall and a base. The chip may include a first side and a first recess in the first side. The first side may be defined in part by a first cleaved or diced facet. The first recess may be defined in part by a first etched facet. The first waveguide may be configured to guide an optical beam to pass through the first etched facet. The second waveguide may be configured to guide the optical beam to pass through the sidewall. The second waveguide may be optically aligned with the first waveguide.Type: GrantFiled: December 1, 2021Date of Patent: April 11, 2023Assignee: Skorpios Technologies, Inc.Inventors: Paveen Apiratikul, Damien Lambert
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Patent number: 11585977Abstract: A semiconductor laser has a mirror formed in a gain chip. The mirror can be placed in the gain chip to provide a broadband reflector to support multiple lasers using the gain chip. The mirror can also be placed in the gain chip to have the semiconductor laser be more efficient or more powerful by changing an optical path length of the gain of the semiconductor laser.Type: GrantFiled: June 26, 2020Date of Patent: February 21, 2023Assignee: Skorpios Technologies, Inc.Inventor: Damien Lambert
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Patent number: 11409039Abstract: A waveguide mode expander couples a smaller optical mode in a semiconductor waveguide to a larger optical mode in an optical fiber. The waveguide mode expander comprises a shoulder and a ridge. In some embodiments, the ridge of the waveguide mode expander has a plurality of stages, the plurality of stages having different widths at a given cross section.Type: GrantFiled: August 5, 2020Date of Patent: August 9, 2022Assignee: Skorpios Technologies, Inc.Inventors: Guoliang Li, Damien Lambert, Nikhil Kumar
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Publication number: 20220196911Abstract: An exemplary multi quantum well structure may include a silicon platform having a pit formed in the silicon platform, a chip positioned inside the pit, a first waveguide formed in the chip, and a second waveguide formed in the silicon platform. The pit may be defined at least in part by a sidewall and a base. The chip may include a first side and a first recess in the first side. The first side may be defined in part by a first cleaved or diced facet. The first recess may be defined in part by a first etched facet. The first waveguide may be configured to guide an optical beam to pass through the first etched facet. The second waveguide may be configured to guide the optical beam to pass through the sidewall. The second waveguide may be optically aligned with the first waveguide.Type: ApplicationFiled: December 1, 2021Publication date: June 23, 2022Inventors: Paveen Apiratikul, Damien Lambert
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Patent number: 11307440Abstract: A modulator and a capacitor are integrated on a semiconductor substrate for modulating a laser beam. Integrating the capacitor on the substrate reduces parasitic inductance for high-speed optical communication.Type: GrantFiled: April 8, 2020Date of Patent: April 19, 2022Assignee: Skorpios Technologies, Inc.Inventors: Stephen B. Krasulick, Damien Lambert, Andrew Bonthron, Guoliang Li
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Patent number: 11194092Abstract: An exemplary multi quantum well structure may include a silicon platform having a pit formed in the silicon platform, a chip positioned inside the pit, a first waveguide formed in the chip, and a second waveguide formed in the silicon platform. The pit may be defined at least in part by a sidewall and a base. The chip may include a first side and a first recess in the first side. The first side may be defined in part by a first cleaved or diced facet. The first recess may be defined in part by a first etched facet. The first waveguide may be configured to guide an optical beam to pass through the first etched facet. The second waveguide may be configured to guide the optical beam to pass through the sidewall. The second waveguide may be optically aligned with the first waveguide.Type: GrantFiled: November 21, 2019Date of Patent: December 7, 2021Assignee: SKORPIOS TECHNOLOGIES, INC.Inventors: Paveen Apiratikul, Damien Lambert
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Patent number: 11002907Abstract: A photonic device includes a semiconductor wafer having a waveguide formed therein. An end of the waveguide includes a step. The photonic device further includes a semiconductor chip bonded to the semiconductor wafer and having an active region, and a waveguide coupler disposed in a gap between a sidewall of the semiconductor chip and the end of the waveguide. The waveguide coupler includes an optical bridge that has a first end and a second end opposing the first end. The first end of the optical bridge is interfaced with a facet of the active region of the semiconductor chip. The second end of the optical bridge is interfaced with the end of waveguide, and has a portion thereof disposed over the step at the end of the waveguide.Type: GrantFiled: January 11, 2019Date of Patent: May 11, 2021Assignee: Skorpios Technologies, Inc.Inventor: Damien Lambert
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Publication number: 20210116640Abstract: A waveguide mode expander couples a smaller optical mode in a semiconductor waveguide to a larger optical mode in an optical fiber. The waveguide mode expander comprises a shoulder and a ridge. In some embodiments, the ridge of the waveguide mode expander has a plurality of stages, the plurality of stages having different widths at a given cross section.Type: ApplicationFiled: August 5, 2020Publication date: April 22, 2021Inventors: Guoliang Li, Damien Lambert, Nikhil Kumar
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Publication number: 20210116636Abstract: A semiconductor laser has a mirror formed in a gain chip. The mirror can be placed in the gain chip to provide a broadband reflector to support multiple lasers using the gain chip. The mirror can also be placed in the gain chip to have the semiconductor laser be more efficient or more powerful by changing an optical path length of the gain of the semiconductor laser.Type: ApplicationFiled: June 26, 2020Publication date: April 22, 2021Inventor: Damien Lambert
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Patent number: 10895686Abstract: A method of fabricating a waveguide mode expander includes providing a substrate including a waveguide, bonding a chiplet including multiple optical material layers in a mounting region adjacent an output end of the waveguide, and selectively removing portions of the chiplet to form tapered stages that successively increase in number and lateral size from a proximal end to a distal end of the chiplet. The first optical material layer supports an input mode substantially the same size as a mode exiting the waveguide. One or more of the overlying layers, when combined with the first layer, support a larger, output optical mode size. Each tapered stage of the mode expander is formed of a portion of a respective layer of the chiplet. The first layer and the tapered stages form a waveguide mode expander that expands an optical mode of light traversing the chiplet.Type: GrantFiled: May 1, 2018Date of Patent: January 19, 2021Assignee: Skorpios Technologies, Inc.Inventors: Damien Lambert, Guoliang Li, John Zyskind, Stephen B. Krasulick
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Publication number: 20200371383Abstract: A modulator and a capacitor are integrated on a semiconductor substrate for modulating a laser beam. Integrating the capacitor on the substrate reduces parasitic inductance for high-speed optical communication.Type: ApplicationFiled: April 8, 2020Publication date: November 26, 2020Applicant: Skorpios Technologies, Inc.Inventors: Stephen B. Krasulick, Damien Lambert, Andrew Bonthron, Guoliang Li
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Patent number: 10768369Abstract: A waveguide mode expander couples a smaller optical mode in a semiconductor waveguide to a larger optical mode in an optical fiber. The waveguide mode expander comprises a shoulder and a ridge. In some embodiments, the ridge of the waveguide mode expander has a plurality of stages, the plurality of stages having different widths at a given cross section.Type: GrantFiled: May 31, 2019Date of Patent: September 8, 2020Assignee: Skorpios Technologies, Inc.Inventors: Guoliang Li, Damien Lambert, Nikhil Kumar
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Patent number: 10732349Abstract: A semiconductor laser has a mirror formed in a gain chip. The mirror can be placed in the gain chip to provide a broadband reflector to support multiple lasers using the gain chip. The mirror can also be placed in the gain chip to have the semiconductor laser be more efficient or more powerful by changing an optical path length of the gain of the semiconductor laser.Type: GrantFiled: February 7, 2017Date of Patent: August 4, 2020Assignee: Skorpios Technologies, Inc.Inventor: Damien Lambert
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Publication number: 20200233150Abstract: An exemplary multi quantum well structure may include a silicon platform having a pit formed in the silicon platform, a chip positioned inside the pit, a first waveguide formed in the chip, and a second waveguide formed in the silicon platform. The pit may be defined at least in part by a sidewall and a base. The chip may include a first side and a first recess in the first side. The first side may be defined in part by a first cleaved or diced facet. The first recess may be defined in part by a first etched facet. The first waveguide may be configured to guide an optical beam to pass through the first etched facet. The second waveguide may be configured to guide the optical beam to pass through the sidewall. The second waveguide may be optically aligned with the first waveguide.Type: ApplicationFiled: November 21, 2019Publication date: July 23, 2020Inventors: Paveen Apiratikul, Damien Lambert
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Patent number: 10678073Abstract: A modulator and a capacitor are integrated on a semiconductor substrate for modulating a laser beam. Integrating the capacitor on the substrate reduces parasitic inductance for high-speed optical communication.Type: GrantFiled: July 21, 2017Date of Patent: June 9, 2020Assignee: Skorpios Technologies, Inc.Inventors: Stephen B. Krasulick, Damien Lambert, Andrew Bonthron, Guoliang Li
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Publication number: 20200124797Abstract: A waveguide mode expander couples a smaller optical mode in a semiconductor waveguide to a larger optical mode in an optical fiber. The waveguide mode expander comprises a shoulder and a ridge. In some embodiments, the ridge of the waveguide mode expander has a plurality of stages, the plurality of stages having different widths at a given cross section.Type: ApplicationFiled: May 31, 2019Publication date: April 23, 2020Inventors: Guoliang Li, Damien Lambert, Nikhil Kumar