Patents by Inventor Damien Lambert

Damien Lambert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190277547
    Abstract: A lubricant separator includes a shell, a vapor inlet located at a first end of the shell to admit a flow of refrigerant and lubricant into the lubricant separator and a muffler positioned in the shell. The muffler includes a first perforated pipe extending along a longitudinal axis of the shell from the vapor inlet, a second perforated pipe radially spaced from the first perforated pipe, an absorption material layer positioned radially outboard of the second perforated pipe, and a lubricant-permeable liner positioned radially between the second perforated pipe and the absorption material layer. The lubricant-permeable liner allows for acoustic wave transmission from the second perforated pipe to the absorption material layer.
    Type: Application
    Filed: November 15, 2016
    Publication date: September 12, 2019
    Inventors: Francois Lambert, Jin Liu, Damien Poux
  • Patent number: 10345521
    Abstract: A waveguide mode expander couples a smaller optical mode in a semiconductor waveguide to a larger optical mode in an optical fiber. The waveguide mode expander comprises a shoulder and a ridge. In some embodiments, the ridge of the waveguide mode expander has a plurality of stages, the plurality of stages having different widths at a given cross section.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: July 9, 2019
    Assignee: Skorpios Technologies, Inc.
    Inventors: Guoliang Li, Damien Lambert, Nikhil Kumar
  • Patent number: 10319693
    Abstract: Micro pillars are formed in silicon. The micro pillars are used in boding the silicon to hetero-material such as III-V material, ceramics, or metals. In bonding the silicon to the hetero-material, indium is used as a bonding material and attached to the hetero-material. The bonding material is heated and the silicon and the hetero-material are pressed together. As the silicon and the hetero-material are pressed together, the micro pillars puncture the bonding material. In some embodiments, pedestals are used in the silicon as hard stops to align the hetero-material with the silicon.
    Type: Grant
    Filed: June 16, 2015
    Date of Patent: June 11, 2019
    Assignee: Skorpios Technologies, Inc.
    Inventor: Damien Lambert
  • Patent number: 10312661
    Abstract: A composite semiconductor laser is made by securing a III-V wafer to a transfer wafer. A substrate of the III-V wafer is removed, and the III-V wafer is etched into a plurality of chips while the III-V wafer is secured to the transfer wafer. The transfer wafer is singulated. A portion of the transfer wafer is used as a handle for bonding the chip in a recess of a silicon device. The chip is used as a gain medium for the semiconductor laser.
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: June 4, 2019
    Assignee: Skorpios Technologies, Inc.
    Inventor: Damien Lambert
  • Patent number: 10234626
    Abstract: A photonic device includes a semiconductor wafer having a waveguide formed therein. An end of the waveguide includes a step. The photonic device further includes a semiconductor chip bonded to the semiconductor wafer and having an active region, and a waveguide coupler disposed in a gap between a sidewall of the semiconductor chip and the end of the waveguide. The waveguide coupler includes an optical bridge that has a first end and a second end opposing the first end. The first end of the optical bridge is interfaced with a facet of the active region of the semiconductor chip. The second end of the optical bridge is interfaced with the end of waveguide, and has a portion thereof disposed over the step at the end of the waveguide.
    Type: Grant
    Filed: February 7, 2017
    Date of Patent: March 19, 2019
    Assignee: Skorpios Technologies, Inc.
    Inventor: Damien Lambert
  • Publication number: 20180364416
    Abstract: A waveguide mode expander couples a smaller optical mode in a semiconductor waveguide to a larger optical mode in an optical fiber. The waveguide mode expander comprises a shoulder and a ridge. In some embodiments, the ridge of the waveguide mode expander has a plurality of stages, the plurality of stages having different widths at a given cross section.
    Type: Application
    Filed: May 15, 2018
    Publication date: December 20, 2018
    Applicant: Skorpios Technologies, Inc.
    Inventors: Guoliang Li, Damien Lambert, Nikhil Kumar
  • Publication number: 20180348432
    Abstract: A method of fabricating a waveguide mode expander includes providing a substrate including a waveguide, bonding a chiplet including multiple optical material layers in a mounting region adjacent an output end of the waveguide, and selectively removing portions of the chiplet to form tapered stages that successively increase in number and lateral size from a proximal end to a distal end of the chiplet. The first optical material layer supports an input mode substantially the same size as a mode exiting the waveguide. One or more of the overlying layers, when combined with the first layer, support a larger, output optical mode size. Each tapered stage of the mode expander is formed of a portion of a respective layer of the chiplet. The first layer and the tapered stages form a waveguide mode expander that expands an optical mode of light traversing the chiplet.
    Type: Application
    Filed: May 1, 2018
    Publication date: December 6, 2018
    Inventors: Damien Lambert, Guoliang Li, John Zyskind, Stephen B. Krasulick
  • Patent number: 10132996
    Abstract: A method forms a vertical output coupler for a waveguide, formed of waveguide material and disposed within a layer stack on a top surface of a wafer. The method includes etching through a portion of the wafer to form a via that exposes the waveguide material, and etching the waveguide material to remove at least a first portion of the waveguide. The etching forms a tilted plane in the waveguide material. The method further includes coating the first tilted plane with one or more reflective layers, to form a tilted mirror in contact with the first tilted plane in the waveguide material. The tilted mirror forms the vertical output coupler such that light propagating through the waveguide is deflected by the tilted mirror, and exits the waveguide.
    Type: Grant
    Filed: April 20, 2016
    Date of Patent: November 20, 2018
    Assignee: Skorpios Technologies, Inc.
    Inventor: Damien Lambert
  • Patent number: 10001600
    Abstract: A waveguide mode expander couples a smaller optical mode in a semiconductor waveguide to a larger optical mode in an optical fiber. The waveguide mode expander comprises a shoulder and a ridge. In some embodiments, the ridge of the waveguide mode expander has a plurality of stages, the plurality of stages having different widths at a given cross section.
    Type: Grant
    Filed: April 14, 2017
    Date of Patent: June 19, 2018
    Assignee: Skorpios Technologies, Inc.
    Inventors: Guoliang Li, Damien Lambert, Nikhil Kumar
  • Patent number: 9991149
    Abstract: A transfer substrate with a compliant resin is used to bond one or more chips to a target wafer. An implant region is formed in a transfer substrate. A portion of the transfer substrate is etched to form a riser. Compliant material is applied to the transfer substrate. A chip is secured to the compliant material, wherein the chip is secured to the compliant material above the riser. The chip is bonded to a target wafer while the chip is secured to the compliant material. The transfer substrate and compliant material are removed from the chip. The transfer substrate is opaque to UV light.
    Type: Grant
    Filed: November 5, 2015
    Date of Patent: June 5, 2018
    Assignee: SKORPIOS TECHNOLOGIES, INC.
    Inventors: Damien Lambert, John Spann, Stephen Krasulick
  • Patent number: 9977188
    Abstract: A method of fabricating a waveguide mode expander includes providing a substrate including a waveguide, bonding a chiplet including multiple optical material layers in a mounting region adjacent an output end of the waveguide, and selectively removing portions of the chiplet to form tapered stages that successively increase in number and lateral size from a proximal end to a distal end of the chiplet. The first optical material layer supports an input mode substantially the same size as a mode exiting the waveguide. One or more of the overlying layers, when combined with the first layer, support a larger, output optical mode size. Each tapered stage of the mode expander is formed of a portion of a respective layer of the chiplet. The first layer and the tapered stages form a waveguide mode expander that expands an optical mode of light traversing the chiplet.
    Type: Grant
    Filed: February 23, 2016
    Date of Patent: May 22, 2018
    Assignee: Skorpios Technologies, Inc.
    Inventors: Damien Lambert, Guoliang Li, John Zyskind, Stephen B. Krasulick
  • Patent number: 9917417
    Abstract: A widely tunable laser system includes a substrate, first and second lasers, an output and at least one optical combining device. The first laser is integrated with the substrate, includes a gain medium that includes a first material, and emits light at a wavelength that is tunable within a first wavelength range that is determined at least in part by the first material. The second laser is integrated with the substrate, includes a gain medium that includes a second material, and emits light at a wavelength that is tunable within a second wavelength range that is different from the first wavelength range that is determined at least in part by the second material. The at least one optical combining device is configured to direct light from one or both of the first laser and the second laser to the output.
    Type: Grant
    Filed: October 4, 2016
    Date of Patent: March 13, 2018
    Assignee: Skorpios Technologies, Inc.
    Inventors: Guoliang Li, Stephen B. Krasulick, Damien Lambert
  • Publication number: 20180067343
    Abstract: A modulator and a capacitor are integrated on a semiconductor substrate for modulating a laser beam. Integrating the capacitor on the substrate reduces parasitic inductance for high-speed optical communication.
    Type: Application
    Filed: July 21, 2017
    Publication date: March 8, 2018
    Applicant: Skorpios Technologies, Inc.
    Inventors: Stephen B. Krasulick, Damien Lambert, Andrew Bonthron, Guoliang Li
  • Patent number: 9885832
    Abstract: A waveguide mode expander couples a smaller optical mode in a semiconductor waveguide to a larger optical mode in an optical fiber. The waveguide mode expander comprises a shoulder made of crystalline silicon and a ridge made of non-crystalline silicon (e.g., amorphous silicon). In some embodiments, the ridge of the waveguide mode expander has a plurality of stages, the plurality of stages have different widths and/or thicknesses at a given cross section.
    Type: Grant
    Filed: May 27, 2015
    Date of Patent: February 6, 2018
    Assignee: Skorpios Technologies, Inc.
    Inventors: Damien Lambert, Nikhil Kumar, Elton Marchena, Daming Liu, Guoliang Li, John Zyskind
  • Publication number: 20170351028
    Abstract: A waveguide mode expander couples a smaller optical mode in a semiconductor waveguide to a larger optical mode in an optical fiber. The waveguide mode expander comprises a shoulder and a ridge. In some embodiments, the ridge of the waveguide mode expander has a plurality of stages, the plurality of stages having different widths at a given cross section.
    Type: Application
    Filed: April 14, 2017
    Publication date: December 7, 2017
    Applicant: Skorpios Technologies, Inc.
    Inventors: Guoliang Li, Damien Lambert, Nikhil Kumar
  • Patent number: 9829631
    Abstract: A method forms a vertical output coupler for a waveguide that propagates light along a horizontal propagation direction, through a waveguide material that overlies a buried oxide layer. The method includes etching the waveguide to remove a portion of the waveguide. The etching forms at least a first plane that is at an edge of the waveguide, is adjacent to the removed portion of the waveguide, and is tilted at a vertical angle between 20 degrees and 70 degrees with respect to the propagation direction. The method further includes coating the first tilted plane with a reflective metal to form a mirror, such that the mirror reflects the light into a direction having a vertical component.
    Type: Grant
    Filed: April 20, 2016
    Date of Patent: November 28, 2017
    Assignee: Skorpios Technologies, Inc.
    Inventor: Damien Lambert
  • Publication number: 20170331248
    Abstract: A composite semiconductor laser is made by securing a III-V wafer to a transfer wafer. A substrate of the III-V wafer is removed, and the III-V wafer is etched into a plurality of chips while the III-V wafer is secured to the transfer wafer. The transfer wafer is singulated. A portion of the transfer wafer is used as a handle for bonding the chip in a recess of a silicon device. The chip is used as a gain medium for the semiconductor laser.
    Type: Application
    Filed: May 11, 2017
    Publication date: November 16, 2017
    Applicant: Skorpios Technologies, Inc.
    Inventor: Damien Lambert
  • Publication number: 20170227709
    Abstract: A photonic device includes a semiconductor wafer having a waveguide formed therein. An end of the waveguide includes a step. The photonic device further includes a semiconductor chip bonded to the semiconductor wafer and having an active region, and a waveguide coupler disposed in a gap between a sidewall of the semiconductor chip and the end of the waveguide. The waveguide coupler includes an optical bridge that has a first end and a second end opposing the first end. The first end of the optical bridge is interfaced with a facet of the active region of the semiconductor chip. The second end of the optical bridge is interfaced with the end of waveguide, and has a portion thereof disposed over the step at the end of the waveguide.
    Type: Application
    Filed: February 7, 2017
    Publication date: August 10, 2017
    Applicant: Skorpios Technologies, Inc.
    Inventor: Damien Lambert
  • Publication number: 20170229840
    Abstract: A semiconductor laser has a mirror formed in a gain chip. The mirror can be placed in the gain chip to provide a broadband reflector to support multiple lasers using the gain chip. The mirror can also be placed in the gain chip to have the semiconductor laser be more efficient or more powerful by changing an optical path length of the gain of the semiconductor laser.
    Type: Application
    Filed: February 7, 2017
    Publication date: August 10, 2017
    Applicant: Skorpios Technologies, Inc.
    Inventor: Damien Lambert
  • Patent number: 9658401
    Abstract: A waveguide mode expander couples a smaller optical mode in a semiconductor waveguide to a larger optical mode in an optical fiber. The waveguide mode expander comprises a shoulder and a ridge. In some embodiments, the ridge of the waveguide mode expander has a plurality of stages, the plurality of stages having different widths at a given cross section.
    Type: Grant
    Filed: May 27, 2015
    Date of Patent: May 23, 2017
    Assignee: SKORPIOS TECHNOLOGIES, INC.
    Inventors: Guoliang Li, Damien Lambert, Nikhil Kumar