Patents by Inventor Damien M. Pricolo
Damien M. Pricolo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11961764Abstract: A semiconductor device has a carrier with a fixed size. A plurality of first semiconductor die is singulated from a first semiconductor wafer. The first semiconductor die are disposed over the carrier. The number of first semiconductor die on the carrier is independent from the size and number of first semiconductor die singulated from the first semiconductor wafer. An encapsulant is deposited over and around the first semiconductor die and carrier to form a reconstituted panel. An interconnect structure is formed over the reconstituted panel while leaving the encapsulant devoid of the interconnect structure. The reconstituted panel is singulated through the encapsulant. The first semiconductor die are removed from the carrier. A second semiconductor die with a size different from the size of the first semiconductor die is disposed over the carrier. The fixed size of the carrier is independent of a size of the second semiconductor die.Type: GrantFiled: April 15, 2021Date of Patent: April 16, 2024Assignee: STATS ChipPAC Pte. Ltd.Inventors: Thomas J. Strothmann, Damien M. Pricolo, Il Kwon Shim, Yaojian Lin, Heinz-Peter Wirtz, Seung Wook Yoon, Pandi C. Marimuthu
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Publication number: 20210233815Abstract: A semiconductor device has a carrier with a fixed size. A plurality of first semiconductor die is singulated from a first semiconductor wafer. The first semiconductor die are disposed over the carrier. The number of first semiconductor die on the carrier is independent from the size and number of first semiconductor die singulated from the first semiconductor wafer. An encapsulant is deposited over and around the first semiconductor die and carrier to form a reconstituted panel. An interconnect structure is formed over the reconstituted panel while leaving the encapsulant devoid of the interconnect structure. The reconstituted panel is singulated through the encapsulant. The first semiconductor die are removed from the carrier. A second semiconductor die with a size different from the size of the first semiconductor die is disposed over the carrier. The fixed size of the carrier is independent of a size of the second semiconductor die.Type: ApplicationFiled: April 15, 2021Publication date: July 29, 2021Applicant: STATS ChipPAC Pte. Ltd.Inventors: Thomas J. Strothmann, Damien M. Pricolo, Il Kwon Shim, Yaojian Lin, Heinz-Peter Wirtz, Seung Wook Yoon, Pandi C. Marimuthu
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Patent number: 11011423Abstract: A semiconductor device has a carrier with a fixed size. A plurality of first semiconductor die is singulated from a first semiconductor wafer. The first semiconductor die are disposed over the carrier. The number of first semiconductor die on the carrier is independent from the size and number of first semiconductor die singulated from the first semiconductor wafer. An encapsulant is deposited over and around the first semiconductor die and carrier to form a reconstituted panel. An interconnect structure is formed over the reconstituted panel while leaving the encapsulant devoid of the interconnect structure. The reconstituted panel is singulated through the encapsulant. The first semiconductor die are removed from the carrier. A second semiconductor die with a size different from the size of the first semiconductor die is disposed over the carrier. The fixed size of the carrier is independent of a size of the second semiconductor die.Type: GrantFiled: November 29, 2018Date of Patent: May 18, 2021Assignee: STATS ChipPAC Pte. Ltd.Inventors: Thomas J. Strothmann, Damien M. Pricolo, Il Kwon Shim, Yaojian Lin, Heinz-Peter Wirtz, Seung Wook Yoon, Pandi C. Marimuthu
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Publication number: 20190109048Abstract: A semiconductor device has a carrier with a fixed size. A plurality of first semiconductor die is singulated from a first semiconductor wafer. The first semiconductor die are disposed over the carrier. The number of first semiconductor die on the carrier is independent from the size and number of first semiconductor die singulated from the first semiconductor wafer. An encapsulant is deposited over and around the first semiconductor die and carrier to form a reconstituted panel. An interconnect structure is formed over the reconstituted panel while leaving the encapsulant devoid of the interconnect structure. The reconstituted panel is singulated through the encapsulant. The first semiconductor die are removed from the carrier. A second semiconductor die with a size different from the size of the first semiconductor die is disposed over the carrier. The fixed size of the carrier is independent of a size of the second semiconductor die.Type: ApplicationFiled: November 29, 2018Publication date: April 11, 2019Applicant: STATS ChipPAC Pte. Ltd.Inventors: Thomas J. Strothmann, Damien M. Pricolo, Il Kwon Shim, Yaojian Lin, Heinz-Peter Wirtz, Seung Wook Yoon, Pandi C. Marimuthu
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Patent number: 10181423Abstract: A semiconductor device has a carrier with a fixed size. A plurality of first semiconductor die is singulated from a first semiconductor wafer. The first semiconductor die are disposed over the carrier. The number of first semiconductor die on the carrier is independent from the size and number of first semiconductor die singulated from the first semiconductor wafer. An encapsulant is deposited over and around the first semiconductor die and carrier to form a reconstituted panel. An interconnect structure is formed over the reconstituted panel while leaving the encapsulant devoid of the interconnect structure. The reconstituted panel is singulated through the encapsulant. The first semiconductor die are removed from the carrier. A second semiconductor die with a size different from the size of the first semiconductor die is disposed over the carrier. The fixed size of the carrier is independent of a size of the second semiconductor die.Type: GrantFiled: January 24, 2017Date of Patent: January 15, 2019Assignee: STATS ChipPAC Pte. Ltd.Inventors: Thomas J. Strothmann, Damien M. Pricolo, Il Kwon Shim, Yaojian Lin, Heinz-Peter Wirtz, Seung Wook Yoon, Pandi C. Marimuthu
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Publication number: 20170133270Abstract: A semiconductor device has a carrier with a fixed size. A plurality of first semiconductor die is singulated from a first semiconductor wafer. The first semiconductor die are disposed over the carrier. The number of first semiconductor die on the carrier is independent from the size and number of first semiconductor die singulated from the first semiconductor wafer. An encapsulant is deposited over and around the first semiconductor die and carrier to form a reconstituted panel. An interconnect structure is formed over the reconstituted panel while leaving the encapsulant devoid of the interconnect structure. The reconstituted panel is singulated through the encapsulant. The first semiconductor die are removed from the carrier. A second semiconductor die with a size different from the size of the first semiconductor die is disposed over the carrier. The fixed size of the carrier is independent of a size of the second semiconductor die.Type: ApplicationFiled: January 24, 2017Publication date: May 11, 2017Applicant: STATS ChipPAC Pte. Ltd.Inventors: Thomas J. Strothmann, Damien M. Pricolo, Il Kwon Shim, Yaojian Lin, Heinz-Peter Wirtz, Seung Wook Yoon, Pandi C. Marimuthu
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Patent number: 9620413Abstract: A semiconductor device has a carrier with a fixed size. A plurality of first semiconductor die is singulated from a first semiconductor wafer. The first semiconductor die are disposed over the carrier. The number of first semiconductor die on the carrier is independent from the size and number of first semiconductor die singulated from the first semiconductor wafer. An encapsulant is deposited over and around the first semiconductor die and carrier to form a reconstituted panel. An interconnect structure is formed over the reconstituted panel while leaving the encapsulant devoid of the interconnect structure. The reconstituted panel is singulated through the encapsulant. The first semiconductor die are removed from the carrier. A second semiconductor die with a size different from the size of the first semiconductor die is disposed over the carrier. The fixed size of the carrier is independent of a size of the second semiconductor die.Type: GrantFiled: December 5, 2013Date of Patent: April 11, 2017Assignee: STATS ChipPAC Pte. Ltd.Inventors: Thomas J. Strothmann, Damien M. Pricolo, Il Kwon Shim, Yaojian Lin, Heinz-Peter Wirtz, Seung Wook Yoon, Pandi C. Marimuthu
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Publication number: 20140091455Abstract: A semiconductor device has a carrier with a fixed size. A plurality of first semiconductor die is singulated from a first semiconductor wafer. The first semiconductor die are disposed over the carrier. The number of first semiconductor die on the carrier is independent from the size and number of first semiconductor die singulated from the first semiconductor wafer. An encapsulant is deposited over and around the first semiconductor die and carrier to form a reconstituted panel. An interconnect structure is formed over the reconstituted panel while leaving the encapsulant devoid of the interconnect structure. The reconstituted panel is singulated through the encapsulant. The first semiconductor die are removed from the carrier. A second semiconductor die with a size different from the size of the first semiconductor die is disposed over the carrier. The fixed size of the carrier is independent of a size of the second semiconductor die.Type: ApplicationFiled: December 5, 2013Publication date: April 3, 2014Applicant: STATS ChipPAC, Ltd.Inventors: Thomas J. Strothmann, Damien M. Pricolo, Il Kwon Shim, Yaojioan Lin, Heinz-Peter Wirtz, Seung Wook Yoon, Pandi C. Marimuthu