Abstract: An electronic device may include a display having an array of organic light-emitting diodes formed on a substrate. An encapsulation layer may be formed over the array of organic light-emitting diodes to protect the organic light-emitting diodes from moisture and other contaminants. The encapsulation layer may include a transparent sheet of material interposed between upper and lower inorganic films. The reliability of the encapsulation layer is increased by dividing one or both of the inorganic films into multiple sub-layers. The sub-layers may have different densities and may be deposited in sequential steps. Additional moisture protection may be provided by forming a conformal thin-film coating over the organic light-emitting diodes. The conformal thin-film coating may be an aluminum oxide layer that is formed using atomic layer deposition techniques.

Abstract: A display may have thin-film transistor (TFT) circuitry on a substrate. An array of organic light-emitting diodes may be formed on the thin-film transistor circuitry. The display may include inorganic brittle layers and organic and metal layers that are ductile and mechanically robust. To help prevent propagation of cracks and other defects along the edge of the display, the display may be provided with crack stop structures and crack detection circuitry. The crack detection circuitry may include one or more loops that are formed along the periphery of the display. The crack stop structures may include TFT/OLED structures formed in a staggered configuration. At least some of the brittle layers can be removed from the panel edge. An additional adhesion layer may also be formed directly on the substrate to help prevent inorganic layers from debonding from the surface of the substrate.

Abstract: A display may have thin-film transistor (TFT) circuitry on a substrate. An array of organic light-emitting diodes may be formed on the thin-film transistor circuitry. The display may include inorganic brittle layers and organic and metal layers that are ductile and mechanically robust. To help prevent propagation of cracks and other defects along the edge of the display, the display may be provided with crack stop structures and crack detection circuitry. The crack detection circuitry may include one or more loops that are formed along the periphery of the display. The crack stop structures may include TFT/OLED structures formed in a staggered configuration. At least some of the brittle layers can be removed from the panel edge. An additional adhesion layer may also be formed directly on the substrate to help prevent inorganic layers from debonding from the surface of the substrate.

Abstract: A patterned multilayered barrier film for protecting devices from permeation of moisture and gases includes a substrate, a first layer on the substrate acting as a barrier layer, a second layer on the first layer and acting as a decoupling or planarization layer, and a third layer on the second layer, and acting as a barrier layer. Each of the first and third layers has an area greater than an area of the second layer such that the second layer is completely enclosed between the first and third layers defining an edge perimeter surrounding the second layer that is completely sealed between the first and third layers. The patterned multilayered barrier film may be cut into individual barrier units between portions of the second layer such that portions of the second layer of each individual barrier unit are completely edge-sealed between the first and third layers.

Abstract: An encapsulated device includes a barrier laminate on the device, and adhesive between the barrier laminate and the device, and an edge sealing member at an edge of the encapsulated device. The edge sealing member may be embedded in the adhesive, may enclose the adhesive between the barrier laminate and the device, or may cover an edge portion of the barrier laminate and an edge portion of the adhesive. A method of making an encapsulated device includes forming an edge sealing member by attaching it to an edge of the device, depositing it adjacent the edge of the device, or covering an edge of an encapsulated volume defined by the edge of the device with the edge sealing member. The method further includes applying an adhesive on the device, and applying a barrier laminate on the adhesive.

Abstract: Barrier stacks according to embodiments of the present invention provide early indication of barrier failure. In some embodiments, the barrier stack includes one or more dyads comprising a first polymer decoupling layer and a second barrier layer. The barrier stack includes one or more integrated gas permeation sensors between the first and second layers of one of the dyads, or between two of the dyads. In some embodiments, the barrier stack can include a primary barrier stack including one or more dyads, one or more integrated gas permeation sensor laterally spaced apart from the primary barrier stack, and a secondary barrier stack including one or more dyads on both the primary stack and the integrated gas permeation sensor(s).

Abstract: An electronic device may include a display having an array of organic light-emitting diodes formed on a substrate. An encapsulation layer may be formed over the array of organic light-emitting diodes to protect the organic light-emitting diodes from moisture and other contaminants. The encapsulation layer may include a transparent sheet of material interposed between upper and lower inorganic films. The reliability of the encapsulation layer is increased by dividing one or both of the inorganic films into multiple sub-layers. The sub-layers may have different densities and may be deposited in sequential steps. Additional moisture protection may be provided by forming a conformal thin-film coating over the organic light-emitting diodes. The conformal thin-film coating may be an aluminum oxide layer that is formed using atomic layer deposition techniques.

Abstract: A patterned multilayered barrier film for protecting devices from permeation of moisture and gases includes a substrate, a first layer on the substrate acting as a barrier layer, a second layer on the first layer and acting as a decoupling or planarization layer, and a third layer on the second layer, and acting as a barrier layer. Each of the first and third layers has an area greater than an area of the second layer such that the second layer is completely enclosed between the first and third layers defining an edge perimeter surrounding the second layer that is completely sealed between the first and third layers. The patterned multilayered barrier film may be cut into individual barrier units between portions of the second layer such that portions of the second layer of each individual barrier unit are completely edge-sealed between the first and third layers.