Abstract: An LED package including an LED chip (LA, A, B), a sealed transparent envelope (D) containing the LED chip inside, transparent liquid (E) filled in the envelope, electrodes (C) is disclosed. The LED chip comprises a plurality of conductive nodes. The transparent liquid is provided with a high resistance, the resistance of the liquid being higher than on-state resistance of the LED chip. The electrodes are respectively connected with the conductive nodes. The electrodes are extended out from the sealed envelope to be electrically connected with an exterior circuit. A method forming an LED package comprises steps: providing an LED chip, encapsulating the LED chip with a transparent encapsulating envelope; transparent liquid provided with high resistance accommodated in the envelope.