Abstract: A conductive trace residing on a stretchable medium, whose geometry in terms of one or more of width, thickness, material stack-up, and other properties are varied along the trace to reduce changes in trace resistance when the medium is stretched. In some embodiments, the geometry is arranged to encourage increased bending in selected regions of the trace to allow stretch deformation of the trace at least partially by elongation rather than entirely by dimensional deformation, thereby reducing conductivity change due to changes in cross-sectional area.

Abstract: A heat spreader lid includes an outer periphery region having a lip for bonding to an underlying substrate board, a center region, and one or more strain isolation regions. The strain isolation regions are located between the center region and the outer periphery region and may comprise a number of slots cut partially or completely through the lid in a pattern surrounding or partially surrounding the center region. The strain isolation regions provide isolation of strain and relief of stress due to thermal expansion of the lid despite constraint at its periphery by the bonded lip, resulting in less thermally-induced warping of the center region, less thermally-induced stress on the bond between the lip and the substrate board, and/or less thermally-induced deflection of the substrate board.

Abstract: A heat spreader lid includes an outer periphery region having a lip for bonding to an underlying substrate board, a center region, and one or more strain isolation regions. The strain isolation regions are located between the center region and the outer periphery region and may comprise a number of slots cut partially or completely through the lid in a pattern surrounding or partially surrounding the center region. The strain isolation regions provide isolation of strain and relief of stress due to thermal expansion of the lid despite constraint at its periphery by the bonded lip, resulting in less thermally-induced warping of the center region, less thermally-induced stress on the bond between the lip and the substrate board, and/or less thermally-induced deflection of the substrate board.

Abstract: The invention is a novel process for producing composites, for Printed Circuit Board substrates, which are resistant to Conductive Anodic Filamentation (CAF). The method is based on using a pressurized fluid as a medium to deposit coating layers uniformly and at high density on fiber or particle surfaces, where the fibers and/or particles are components of the composite. These coating layers have functionalized chemical designs that produce CAF resistant properties such as increased fiber-resin bond strength, moisture resistant fiber filaments, and lower thermal expansion coefficient resin.

Abstract: A material and method useful in absorbing oil is provided. Variations of the material and method are useful in removing an oils spill from the water the oil is contaminating. In the preferred embodiments, a very high density coating is applied to a substrate, preferably using a supercritical coating process. The coating may approximate a Self-Assembled-Monolayer in the best case.

Abstract: A heat spreader lid includes an outer periphery region having a lip for bonding to an underlying substrate board, a center region, and one or more strain isolation regions. The strain isolation regions are located between the center region and the outer periphery region and may comprise a number of slots cut partially or completely through the lid in a pattern surrounding or partially surrounding the center region. The strain isolation regions provide isolation of strain and relief of stress due to thermal expansion of the lid despite constraint at its periphery by the bonded lip, resulting in less thermally-induced warping of the center region, less thermally-induced stress on the bond between the lip and the substrate board, and/or less thermally-induced deflection of the substrate board.

Abstract: A swage mount that includes a flange, having a first side and a second side, and a cylindrically shaped hub. The hub is primarily comprised of a metal (such as stainless steel), and extends from the second side of the flange, and has an inner surface and an outer surface. The surface of the swage mount is plated with one or more layers of metal, or a combination of metals, which provide a) increased retention torque, and b) increased part cleanliness. This invention may be used in conjunction with surface hardened swage mounts that contain surface protrusions. In this case the metal plating prevents separation of the protrusions from the swage mount, thereby preventing contamination.

Abstract: A heat spreader lid includes an outer periphery region having a lip for bonding to an underlying substrate board, a center region, and one or more strain isolation regions. The strain isolation regions are located between the center region and the outer periphery region and may comprise a number of slots cut partially or completely through the lid in a pattern surrounding or partially surrounding the center region. The strain isolation regions provide isolation of strain and relief of stress due to thermal expansion of the lid despite constraint at its periphery by the bonded lip, resulting in less thermally-induced warping of the center region, less thermally-induced stress on the bond between the lip and the substrate board, and/or less thermally-induced deflection of the substrate board.

Abstract: The invention relates to a thermal interface material comprising aligned nanostructures to increase the thermal conductivity of an electronic assembly. Aligned carbon nanotubes are a particularly suitable nanostructure possessing very high thermal conductivity. The novel use of nanostructures in the invention is particularly applicable to solving the issues of thermal expansion of the electronic assembly over time.

Abstract: A tolerance ring for applications requiring cleanliness has contacting portions having a novel profile that reduces debris generation during installation of the tolerance ring while still providing adequate stiffness after installation. The tolerance ring is suitable for cylindrical interface applications where both a reduction in debris generation and high interface stiffness are desirable, such as the interface between an actuator pivot bearing and an actuator arm in a magnetic hard disk drive.

Abstract: A snap ring for applications requiring cleanliness has a novel recessed interior contour that reduces debris generation during installation of the snap ring. The snap ring is suitable for applications where a reduction in debris generation is desirable, such as to retain an actuator pivot bearing in information storage devices like magnetic hard disk drives.

Abstract: A snap ring for applications requiring cleanliness has a novel blunted cross-sectional profile that reduces debris generation during installation of the snap ring. The snap ring is suitable for applications where a reduction in debris generation is desirable, such as to retain an actuator pivot bearing in information storage devices like magnetic hard disk drives.

Abstract: A heat spreader lid includes an outer periphery region having a lip for bonding to an underlying substrate board, a center region, and one or more strain isolation regions. The strain isolation regions are located between the center region and the outer periphery region and may comprise a number of slots cut partially or completely through the lid in a pattern surrounding or partially surrounding the center region. The strain isolation regions provide isolation of strain and relief of stress due to thermal expansion of the lid despite constraint at its periphery by the bonded lip, resulting in less thermally-induced warping of the center region, less thermally-induced stress on the bond between the lip and the substrate board, and/or less thermally-induced deflection of the substrate board.

Abstract: A magnetic head supporting structure comprises a metal purified by vacuum arc remelting, vacuum induction melting, electroslag remelting, or electroslag remelting under vacuum, in at least one of the regions that undergo plastic deformation during disk drive manufacture, to reduce small hard inclusions that might be released into the disk drive interior environment.

Abstract: Laminates consisting of a high-damping core material sandwiched between two stiff, weldable skins. The laminate structures have increased resonant frequencies, improved damping characteristics, do not outgas, and may have a decreased inertial moment. The laminates are comprised of 100% metal constituents, and do not rely on epoxy or low-melting point solders. To make the laminate structures, a first alloyable metal is deposited on the surface of a dissimilar metal. The coated surface is then placed in contact with a second alloyable metal and allowed to interdiffuse at elevated temperatures. The metals are chosen such that diffusion creates an alloy with a melting point lower than either of the constituents. The processing temperature is set so that the alloy melts but leaves the base metals in solid form, causing a thin layer of liquid to form and wet both sides of the interface.

Abstract: A heat spreader lid includes an outer periphery region having a lip for bonding to an underlying substrate board, a center region, and one or more strain isolation regions. The strain isolation regions are located between the center region and the outer periphery region and may comprise a number of slots cut partially or completely through the lid in a pattern surrounding or partially surrounding the center region. The strain isolation regions provide isolation of strain and relief of stress due to thermal expansion of the lid despite constraint at its periphery by the bonded lip, resulting in less thermally-induced warping of the center region, less thermally-induced stress on the bond between the lip and the substrate board, and/or less thermally-induced deflection of the substrate board.

Abstract: Laminates consisting of a high-damping core material sandwiched between two stiff, weldable skins. The laminate structures have increased resonant freguencies, improved damping characteristics, do not outgas, and may have a decreased inertial moment. The laminates are comprised of 100% metal constituents, and do not rely on epoxy or low-melting point solders.

Abstract: Laminates consisting of a high-damping core material sandwiched between two stiff, weldable skins. The laminate structures have increased resonant frequencies, improved damping characteristics, do not outgas, and may have a decreased inertial moment. The laminates are comprised of 100% metal constituents, and do not rely on epoxy or low-melting point solders. To make the laminate structures, a first alloyable metal is deposited on the surface of a dissimilar metal. The coated surface is then placed in contact with a second alloyable metal and allowed to interdiffuse at elevated temperatures. The metals are chosen such that diffusion creates an alloy with a melting point lower than either of the constituents. The processing temperature is set so that the alloy melts but leaves the base metals in solid form, causing a thin layer of liquid to form and wet both sides of the interface.