Abstract: Replaceable contact pads of end effectors are provided. The contact pads support substrates in electronic device manufacturing. The contact pad includes a contact pad head having a contact surface configured to contact a substrate, a shaft coupled to the contact pad head, the shaft including a shaft indent formed between an underside of the contact pad head and a shaft end, and a circular securing member received around the shaft and seated in the shaft indent and configured to secure the contact pad to the end effector body. End effectors including replaceable contact pads and maintenance methods are described, as are additional aspects.

Abstract: Replaceable contact pads of end effectors are provided. The contact pads support substrates in electronic device manufacturing. The contact pad includes a contact pad head having a contact surface configured to contact a substrate, a shaft coupled to the contact pad head, the shaft including a shaft indent formed between an underside of the contact pad head and a shaft end, and a circular securing member received around the shaft and seated in the shaft indent and configured to secure the contact pad to the end effector body. End effectors including replaceable contact pads and maintenance methods are described, as are additional aspects.

Abstract: Embodiments include multi-arm robots for substrate transport systems that include a boom, first and second forearms rotationally coupled to the boom, the second forearm being shorter than the first forearm, a first wrist member rotationally coupled to the first forearm, and a second wrist member rotationally coupled to the second forearm. Each of the boom, first and second forearms, and the first and second wrist members are configured to be independently rotated to carry out substrate motion profiles. Electronic device processing systems and methods of transporting substrates are described, as are numerous other aspects.

Abstract: Substrate transport systems and robot apparatus are provided. The systems are adapted to pick or place a substrate at a destination by independently rotating an upper arm, a forearm, and dual wrist members relative to each other and a base. Methods of operating the robot apparatus are provided, as are numerous other aspects.

Abstract: Methods of correction of rotational and linear misalignment in multi-link robots are provided. The method allows for precise orientation of an end effector to put or pick substrates at a target destination by correcting for both positional and rotational orientation errors. The method rotates a boom linkage to a position adjacent to the target destination, corrects for linear and rotational error by rotating a boom linkage as well as an upper arm link as well as extending or retracting a wrist member. Systems including long boom linkages are disclosed. Numerous other aspects are provided.

Abstract: Embodiments include multi-arm robots for substrate transport systems that include a boom, first and second forearms rotationally coupled to the boom, the second forearm being shorter than the first forearm, a first wrist member rotationally coupled to the first forearm, and a second wrist member rotationally coupled to the second forearm. Each of the boom, first and second forearms, and the first and second wrist members are configured to be independently rotated to carry out substrate motion profiles. Electronic device processing systems and methods of transporting substrates are described, as are numerous other aspects.

Abstract: Methods of correction of rotational and linear misalignment in multi-link robots are provided. The method allows for precise orientation of an end effector to put or pick substrates at a target destination by correcting for both positional and rotational orientation errors. The method rotates a boom linkage to a position adjacent to the target destination, corrects for linear and rotational error by rotating a boom linkage as well as an upper arm link as well as extending or retracting a wrist member. Systems including long boom linkages are disclosed. Numerous other aspects are provided.

Abstract: Methods and apparatus are provided for the use of a dual Selective Compliant Assembly Robot Arm (SCARA) robot. In some embodiments two SCARAs are provided, each including an elbow joint, wherein the two SCARAs are vertically stacked such that one SCARA is a first arm and the other SCARA is a second arm, and wherein the second arm is adapted to support a first substrate, and the first arm is adapted to extend to a full length when the second arm supports the first substrate, and wherein the first substrate supported by the second arm is coplanar with the elbow joint of the first arm, and the second arm is further adapted to move concurrently in parallel (and/or in a coordinated fashion) with the first arm a sufficient amount to avoid interference between the first substrate and the elbow joint of the first arm. Numerous other embodiments are provided.

Abstract: Methods and apparatus are provided for the use of a dual Selective Compliant Assembly Robot Arm (SCARA) robot. In some embodiments two SCARAs are provided, each including an elbow joint, wherein the two SCARAs are vertically stacked such that one SCARA is a first arm and the other SCARA is a second arm, and wherein the second arm is adapted to support a first substrate, and the first arm is adapted to extend to a full length when the second arm supports the first substrate, and wherein the first substrate supported by the second arm is coplanar with the elbow joint of the first arm, and the second arm is further adapted to move concurrently in parallel (and/or in a coordinated fashion) with the first arm a sufficient amount to avoid interference between the first substrate and the elbow joint of the first arm. Numerous other embodiments are provided.

Abstract: Generally, a method of determining a position of a robot is provided. In one embodiment, a method of determining a position of a robot comprises acquiring a first set of positional metrics, acquiring a second set of positional metrics and resolving the position of the robot due to thermal expansion using the first set and the second set of positional metrics. Acquiring the first and second set of positional metrics may occur at the same location within a processing system, or may occur at different locations. For example, in another embodiment, the method may comprise acquiring a first set of positional metrics at a first location proximate a processing chamber and acquiring a second set of positional metrics in another location. In another embodiment, substrate center information is corrected using the determined position of the robot.

Abstract: The wafer clamping mechanism comprises a linkage mechanism and a wafer contact point coupled to the linkage mechanism. The linkage mechanism includes a four-bar linkage having: a first link having a first fixed pivot and a first floating pivot remote from the first fixed pivot; a second link having a second fixed pivot and a second floating pivot remote from the second fixed pivot; and a third link having a first coupling pivot rotatably coupled to the first floating pivot, and having a second coupling pivot rotatably coupled to the second floating pivot. In use motion of the linkage mechanism causes the wafer contact point to clamp a wafer.

Abstract: Generally, a method of determining a position of a robot is provided. In one embodiment, a method of determining a position of a robot comprises acquiring a first set of positional metrics, acquiring a second set of positional metrics and resolving the position of the robot due to thermal expansion using the first set and the second set of positional metrics. Acquiring the first and second set of positional metrics may occur at the same location within a processing system, or may occur at different locations. For example, in another embodiment, the method may comprise acquiring a first set of positional metrics at a first location proximate a processing chamber and acquiring a second set of positional metrics in another location. In another embodiment, substrate center information is corrected using the determined position of the robot.

Abstract: The wafer clamping apparatus is disclosed including a cam rotatably coupled to a base plate. The cam is configured to couple with a robot arm. The clamping apparatus also includes a rotating clamp mechanism rotatably coupled to the base plate about a single fixed point. A biasing mechanism, coupled to the rotating clamp mechanism, urges the rotating clamp mechanism towards a clamped position. The rotating clamp mechanism is configured to interact with the cam to engage and disengage the rotating clamp mechanism from the clamped position. The rotating clamp mechanism preferably comprises a hub rotatably coupled to the base plate and a clamping arm and cam follower extending from the hub. The clamping arm is configured to clamp a wafer when the rotating clamp mechanism is in the clamped position, while the cam follower is configured to interact with the cam.

Abstract: The proximity sensor includes a magnetic field source (first object) configured to generate a magnetic field, a switch plate (second object) made from a ferrous material, and a magnetic field sensor (detector). The magnetic field source and the switch plate are moveable relative to each another. The magnetic field sensor is disposed close enough to the magnetic field source to detect the magnetic field. In use, when the magnetic field source and the switch plate come into proximity of each another, the magnetic field flows from the magnetic field source to the switch plate, thereby disabling detection of the magnetic field and signaling the proximity.

Abstract: The proximity sensor includes a magnetic field source (first object) configured to generate a magnetic field, a switch plate (second object) made from a ferrous material, and a magnetic field sensor (detector). The magnetic field source and the switch plate are moveable relative to each another. The magnetic field sensor is disposed close enough to the magnetic field source to detect the magnetic field. In use, when the magnetic field source and the switch plate come into proximity of each another, the magnetic field flows from the magnetic field source to the switch plate, thereby disabling detection of the magnetic field and signaling the proximity.

Abstract: The wafer clamping apparatus is disclosed including a cam rotatably coupled to a base plate. The cam is configured to couple with a robot arm. The clamping apparatus also includes a rotating clamp mechanism rotatably coupled to the base plate about a single fixed point. A biasing mechanism, coupled to the rotating clamp mechanism, urges the rotating clamp mechanism towards a clamped position. The rotating clamp mechanism is configured to interact with the cam to engage and disengage the rotating clamp mechanism from the clamped position. The rotating clamp mechanism preferably comprises a hub rotatably coupled to the base plate and a clamping arm and cam follower extending from the hub. The clamping arm is configured to clamp a wafer when the rotating clamp mechanism is in the clamped position, while the cam follower is configured to interact with the cam.

Abstract: Generally, a method of determining a position of a robot is provided. In one embodiment, a method of determining a position of a robot comprises acquiring a first set of positional metrics, acquiring a second set of positional metrics and resolving the position of the robot due to thermal expansion using the first set and the second set of positional metrics. Acquiring the first and second set of positional metrics may occur at the same location within a processing system, or may occur at different locations. For example, in another embodiment, the method may comprise acquiring a first set of positional metrics at a first location proximate a processing chamber and acquiring a second set of positional metrics in another location. In another embodiment, substrate center information is corrected using the determined position of the robot.

Abstract: Generally, a method of determining a position of a robot is provided. In one embodiment, a method of determining a position of a robot comprises acquiring a first set of positional metrics, acquiring a second set of positional metrics and resolving the position of the robot due to thermal expansion using the first set and the second set of positional metrics. Acquiring the first and second set of positional metrics may occur at the same location within a processing system, or may occur at different locations. For example, in another embodiment, the method may comprise acquiring a first set of positional metrics at a first location proximate a processing chamber and acquiring a second set of positional metrics in another location. In another embodiment, substrate center information is corrected using the determined position of the robot.

Abstract: Generally, a robot for transferring a substrate in a processing system is provided. In one embodiment, a robot for transferring a substrate in a processing system includes a body, a linkage and an end effector that is adapted to retain the substrate thereon. The linkage couples the end effector to the body. The end effector and/or the linkage is comprised of a material having a coefficient of thermal expansion less than 5×10−6 K−1. In another embodiment, the end effector and/or the linkage is comprised of a material having a ratio of thermal conductivity/thermal expansion greater than 1×107 W/(m·K2). In yet another embodiment, the end effector and/or the linkage is comprised of a material having a ratio of thermal conductivity/thermal expansion greater than 1×107 W/(m·K2) and a fracture toughness greater than 1×106 Pa m0.5.

Abstract: Generally, a robot for transferring a substrate in a processing system is provided. In one embodiment, a robot for transferring a substrate in a processing system includes a body, a linkage and an end effector that is adapted to retain the substrate thereon. The linkage couples the end effector to the body. The end effector and/or the linkage is comprised of a material having a coefficient of thermal expansion less than about 5 m/(m×Kelvin). In another embodiment, the end effector and/or the linkage is comprised of a material having a ratio of thermal conductivity/thermal expansion greater than about 10 W/m(Kelvin)/(Kelvin). In yet another embodiment, the end effector and/or the linkage is comprised of a material having a ratio of thermal conductivity/thermal expansion greater than about 10 W/m(Kelvin)/(Kelvin) and a coefficient of fracture toughness less than about 1×106 Pa×m0.5.