Patents by Inventor Damon V. Williams

Damon V. Williams has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170220026
    Abstract: Systems and methods for calibrating an instrument having a tool and a work surface. An exemplary instrument may comprise a support member including a conductive surface. The instrument also may comprise a fluid-transport device including a conductive tube having an open end. A drive mechanism of the instrument may include a motor operable to drive movement of the surface and the tube relative to one another along an axis and into contact with one another. A circuit of the instrument may include a voltage source and the tube. A control module may be configured to calibrate a relationship between the drive mechanism and a position of the tube and/or surface along the axis based on a sensed change in an electrical property of the circuit that occurs when the tube and the surface contact one another.
    Type: Application
    Filed: February 1, 2017
    Publication date: August 3, 2017
    Inventors: Richard Tighe, Damon V. Williams, Samuel J. Evans
  • Patent number: 6937915
    Abstract: In chemical mechanical polishing apparatus, a wafer carrier plate is provided with a cavity for reception of a sensor positioned very close to a wafer to be polished. Energy resulting from contact between a polishing pad and an exposed surface of the wafer is transmitted only a very short distance to the sensor and is sensed by the sensor, providing data as to the nature of properties of the exposed surface of the wafer, and of transitions of those properties. Correlation methods provide graphs relating sensed energy to the surface properties, and to the transitions. The correlation graphs provide process status data for process control.
    Type: Grant
    Filed: March 28, 2002
    Date of Patent: August 30, 2005
    Assignee: Lam Research Corporation
    Inventors: Rodney Kistler, David J. Hemker, Yehiel Gotkis, Aleksander Owczarz, Bruno Morel, Damon V. Williams
  • Patent number: 6925348
    Abstract: In chemical mechanical polishing, a wafer carrier plate is provided with a cavity for reception of a sensor positioned very close to a wafer to be polished. Energy resulting from contact between a polishing pad and an exposed surface of the wafer is transmitted only a very short distance to the sensor and is sensed by the sensor, providing data as to the nature of properties of the exposed surface of the wafer, and of transitions of those properties. Correlation methods provide graphs relating sensed energy to the surface properties, and to the transitions. The correlation graphs provide process status data for process control.
    Type: Grant
    Filed: October 14, 2004
    Date of Patent: August 2, 2005
    Assignee: Lam Research Corporation
    Inventors: Rodney Kistler, David J. Hemker, Yehiel Gotkis, Aleksander Owczarz, Bruno Morel, Damon V. Williams