Patents by Inventor Damyon L. CORBIN

Damyon L. CORBIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package assembly for thin wafer shipping and method of use
    Patent number: 10784137
    Abstract: A package assembly for thin wafer shipping using a wafer container and a method of use are disclosed. The package assembly includes a shipping container and a wafer container having a bottom surface and a plurality of straps attached thereto placed within the shipping container. The package assembly further includes upper and lower force distribution plates provided within the shipping container positioned respectively on a top side and bottom side thereof.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: September 22, 2020
    Assignee: ELPIS TECHNOLOGIES INC.
    Inventors: Damyon L. Corbin, Charles F. Musante
  • Package assembly for thin wafer shipping and method of use
    Patent number: 10622235
    Abstract: A package assembly for thin wafer shipping using a wafer container and a method of use are disclosed. The package assembly includes a shipping container and a wafer container having a bottom surface and a plurality of straps attached thereto placed within the shipping container. The package assembly further includes upper and lower force distribution plates provided within the shipping container positioned respectively on a top side and bottom side thereof.
    Type: Grant
    Filed: October 6, 2016
    Date of Patent: April 14, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Damyon L. Corbin, Charles F. Musante
  • PACKAGE ASSEMBLY FOR THIN WAFER SHIPPING AND METHOD OF USE
    Publication number: 20200027766
    Abstract: A package assembly for thin wafer shipping using a wafer container and a method of use are disclosed. The package assembly includes a shipping container and a wafer container having a bottom surface and a plurality of straps attached thereto placed within the shipping container. The package assembly further includes upper and lower force distribution plates provided within the shipping container positioned respectively on a top side and bottom side thereof.
    Type: Application
    Filed: September 30, 2019
    Publication date: January 23, 2020
    Inventors: Damyon L. Corbin, Charles F. Musante
  • Package assembly for thin wafer shipping and method of use
    Patent number: 10468280
    Abstract: A package assembly for thin wafer shipping using a wafer container and a method of use are disclosed. The package assembly includes a shipping container and a wafer container having a bottom surface and a plurality of straps attached thereto placed within the shipping container. The package assembly further includes upper and lower force distribution plates provided within the shipping container positioned respectively on a top side and bottom side thereof.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: November 5, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Damyon L. Corbin, Charles F. Musante
  • Controlling of etch depth in deep via etching processes and resultant structures
    Patent number: 10192748
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a method to control depth of etch in deep via etching and related structures. The method includes: forming an interface within the substrate between an etch control dopant and material of the substrate; etching a via within substrate; and terminating the etching of the via at the interface upon detection of the interface.
    Type: Grant
    Filed: October 19, 2016
    Date of Patent: January 29, 2019
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Timothy C. Krywanczyk, Patrick A. Raymond, John C. Hall, Damyon L. Corbin
  • PACKAGE ASSEMBLY FOR THIN WAFER SHIPPING AND METHOD OF USE
    Publication number: 20180308734
    Abstract: A package assembly for thin wafer shipping using a wafer container and a method of use are disclosed. The package assembly includes a shipping container and a wafer container having a bottom surface and a plurality of straps attached thereto placed within the shipping container. The package assembly further includes upper and lower force distribution plates provided within the shipping container positioned respectively on a top side and bottom side thereof.
    Type: Application
    Filed: June 29, 2018
    Publication date: October 25, 2018
    Inventors: Damyon L. Corbin, Charles F. Musante
  • Package assembly for thin wafer shipping and method of use
    Patent number: 10090180
    Abstract: A package assembly for thin wafer shipping using a wafer container and a method of use are disclosed. The package assembly includes a shipping container and a wafer container having a bottom surface and a plurality of straps attached thereto placed within the shipping container. The package assembly further includes upper and lower force distribution plates provided within the shipping container positioned respectively on a top side and bottom side thereof.
    Type: Grant
    Filed: October 13, 2016
    Date of Patent: October 2, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Damyon L. Corbin, Charles F. Musante
  • CONTROLLING OF ETCH DEPTH IN DEEP VIA ETCHING PROCESSES AND RESULTANT STRUCTURES
    Publication number: 20180108535
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a method to control depth of etch in deep via etching and related structures. The method includes: forming an interface within the substrate between an etch control dopant and material of the substrate; etching a via within substrate; and terminating the etching of the via at the interface upon detection of the interface.
    Type: Application
    Filed: October 19, 2016
    Publication date: April 19, 2018
    Inventors: Timothy C. Krywanczyk, Patrick A. Raymond, John C. Hall, Damyon L. Corbin
  • PACKAGE ASSEMBLY FOR THIN WAFER SHIPPING AND METHOD OF USE
    Publication number: 20170032993
    Abstract: A package assembly for thin wafer shipping using a wafer container and a method of use are disclosed. The package assembly includes a shipping container and a wafer container having a bottom surface and a plurality of straps attached thereto placed within the shipping container. The package assembly further includes upper and lower force distribution plates provided within the shipping container positioned respectively on a top side and bottom side thereof.
    Type: Application
    Filed: October 13, 2016
    Publication date: February 2, 2017
    Inventors: Damyon L. Corbin, Charles F. Musante
  • PACKAGE ASSEMBLY FOR THIN WAFER SHIPPING AND METHOD OF USE
    Publication number: 20170025295
    Abstract: A package assembly for thin wafer shipping using a wafer container and a method of use are disclosed. The package assembly includes a shipping container and a wafer container having a bottom surface and a plurality of straps attached thereto placed within the shipping container. The package assembly further includes upper and lower force distribution plates provided within the shipping container positioned respectively on a top side and bottom side thereof.
    Type: Application
    Filed: October 6, 2016
    Publication date: January 26, 2017
    Inventors: Damyon L. Corbin, Charles F. Musante
  • Package assembly for thin wafer shipping and method of use
    Patent number: 9543175
    Abstract: A package assembly for thin wafer shipping using a wafer container and a method of use are disclosed. The package assembly includes a shipping container and a wafer container having a bottom surface and a plurality of straps attached thereto placed within the shipping container. The package assembly further includes upper and lower force distribution plates provided within the shipping container positioned respectively on a top side and bottom side thereof.
    Type: Grant
    Filed: September 25, 2013
    Date of Patent: January 10, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Damyon L. Corbin, Charles F. Musante
  • PACKAGE ASSEMBLY FOR THIN WAFER SHIPPING AND METHOD OF USE
    Publication number: 20150083638
    Abstract: A package assembly for thin wafer shipping using a wafer container and a method of use are disclosed. The package assembly includes a shipping container and a wafer container having a bottom surface and a plurality of straps attached thereto placed within the shipping container. The package assembly further includes upper and lower force distribution plates provided within the shipping container positioned respectively on a top side and bottom side thereof.
    Type: Application
    Filed: September 25, 2013
    Publication date: March 26, 2015
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Damyon L. Corbin, Charles F. Musante
  • PACKAGE ASSEMBLY FOR THIN WAFER SHIPPING
    Publication number: 20150076029
    Abstract: A package assembly for thin wafer shipping using force distribution plates and a method of use are disclosed. The package assembly includes a container and upper and lower force distribution plates provided within the container. The upper and lower force distribution plates are positioned respectively on a top side and bottom side of the container.
    Type: Application
    Filed: September 19, 2013
    Publication date: March 19, 2015
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Damyon L. Corbin, Charles F. Musante
  • Backside metal ground plane with improved metal adhesion and design structures
    Patent number: 8912091
    Abstract: A backside metal ground plane with improved metal adhesion and methods of manufacture are disclosed herein. The method includes forming at least one through silicon via (TSV) in a substrate. The method further includes forming an oxide layer on a backside of the substrate. The method further includes forming a metalized ground plane on the oxide layer and in electrical contact with an exposed portion of the at least one TSV.
    Type: Grant
    Filed: January 10, 2013
    Date of Patent: December 16, 2014
    Assignee: International Business Machines Corporation
    Inventors: Jay S. Burnham, Damyon L. Corbin, George A. Dunbar, III, Jeffrey P. Gambino, John C. Hall, Kenneth F. McAvey, Jr., Charles F. Musante, Anthony K. Stamper
  • BACKSIDE METAL GROUND PLANE WITH IMPROVED METAL ADHESION AND DESIGN STRUCTURES
    Publication number: 20140191408
    Abstract: A backside metal ground plane with improved metal adhesion and methods of manufacture are disclosed herein. The method includes forming at least one through silicon via (TSV) in a substrate. The method further includes forming an oxide layer on a backside of the substrate. The method further includes forming a metalized ground plane on the oxide layer and in electrical contact with an exposed portion of the at least one TSV.
    Type: Application
    Filed: January 10, 2013
    Publication date: July 10, 2014
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jay S. BURNHAM, Damyon L. CORBIN, George A. DUNBAR, III, Jeffrey P. GAMBINO, John C. HALL, Kenneth F. MCAVEY, JR., Charles F. MUSANTE, Anthony K. STAMPER