Abstract: A method supports, on a printed circuit board, a circuit package including a substrate having a solder column array. The method comprises providing the circuit package with an over-sized lid that extends outwardly over an edge of the substrate. The circuit package is electrically connected to the printed circuit board via the solder column array and a plurality of supports are secured to the printed circuit board in position underneath the lid of the circuit package while leaving a gap between the lid and the support. A static compressive force is applied and maintained to the circuit package relative to the printed circuit board, thereby causing the solder column array to creep until the gap is closed and a substantial portion of the compressive force is borne by the supports.

Abstract: A device for assembling circuit boards. The device has an upper surface for receiving a compressing force. The device also has a lower surface for compressing a number of compression devices in a land grid array assembly while allowing access to a number of fasteners associated with the compression devices. The device is able to assist in the formation of an electrical contact between a chip package in the land grid array assembly and a circuit board by the lower surface being pressed against the compression devices to compress the compression devices and then allowing the plurality of fasteners to be tightened.

Abstract: A method for mechanically supporting a integrated circuit (IC) package having a column grid array (CGA) interconnection with a printed circuit board (PCB) is provided by inserting a supporting device between the IC package and the PCB after the IC package is solder attached to the PCB. The supporting device is removably and mechanically fastened to the PCB and is designed in such a shape so that the supporting device cannot come into contact with the solder columns of the CGA to cause damage or shorting. This invention eliminates the maximum retention load constraint of the IC package and enables a wide variety of thermal solution implementations without comprising reliability.

Abstract: A method for mechanically supporting a integrated circuit (IC) package having a column grid array (CGA) interconnection with a printed circuit board (PCB) is provided by inserting a supporting device between the IC package and the PCB after the IC package is solder attached to the PCB. The supporting device is removably and mechanically fastened to the PCB and is designed in such a shape so that the supporting device cannot come into contact with the solder columns of the CGA to cause damage or shorting. This invention eliminates the maximum retention load constraint of the IC package and enables a wide variety of thermal solution implementations without comprising reliability.

Abstract: A method supports, on a printed circuit board, a circuit package including a substrate having a solder column array. The method comprises providing the circuit package with an over-sized lid that extends outwardly over an edge of the substrate. The circuit package is electrically connected to the printed circuit board via the solder column array and a plurality of supports are secured to the printed circuit board in position underneath the lid of the circuit package while leaving a gap between the lid and the support. A static compressive force is applied and maintained to the circuit package relative to the printed circuit board, thereby causing the solder column array to creep until the gap is closed and a substantial portion of the compressive force is borne by the supports.

Abstract: A device for assembling circuit boards. The device has an upper surface for receiving a compressing force. The device also has a lower surface for compressing a number of compression devices in a land grid array assembly while allowing access to a number of fasteners associated with the compression devices. The device is able to assist in the formation of an electrical contact between a chip package in the land grid array assembly and a circuit board by the lower surface being pressed against the compression devices to compress the compression devices and then allowing the plurality of fasteners to be tightened.

Abstract: A device for assembling circuit boards. The device has an upper surface for receiving a compressing force. The device also has a lower surface for compressing a number of compression devices in a land grid array assembly while allowing access to a number of fasteners associated with the compression devices. The device is able to assist in the formation of an electrical contact between a chip package in the land grid array assembly and a circuit board by the lower surface being pressed against the compression devices to compress the compression devices and then allowing the plurality of fasteners to be tightened.

Abstract: A device for assembling circuit boards. The device has an upper surface for receiving a compressing force. The device also has a lower surface for compressing a number of compression devices in a land grid array assembly while allowing access to a number of fasteners associated with the compression devices. The device is able to assist in the formation of an electrical contact between a chip package in the land grid array assembly and a circuit board by the lower surface being pressed against the compression devices to compress the compression devices and then allowing the plurality of fasteners to be tightened.