Patents by Inventor Dan Dynka

Dan Dynka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070193637
    Abstract: Systems and methods for controlling fluid flow, including valve assemblies that control the flow of two or more fluids during microfeature workpiece processing, are disclosed herein. Certain aspects of the invention are directed toward a valve assembly having a compartment with an interior volume, a first inlet, a second inlet, and an outlet. The assembly further includes a first sealing element having an open position and a closed position and a second sealing element having an open position and a closed position. The second sealing element is located downstream of the first sealing element so that when the first sealing element is in the open position and the second sealing element is in the closed position, fluid can enter the interior volume through the first inlet, pass by a portion of the second sealing element while in the interior volume, and exit the interior volume via the outlet.
    Type: Application
    Filed: February 23, 2006
    Publication date: August 23, 2007
    Applicant: Micron Technology, Inc.
    Inventors: Raynald Cantin, Dan Dynka
  • Patent number: 6093072
    Abstract: A pump is used to reduce the pressure in a field emission display package. The package is then filled with a gas or gas mixture, such as nitrogen and hydrogen. The package is then pumped again, to reduce the pressure in the package to the desired pressure and to obtain the desired partial pressure of the gas. Optionally, the process is then repeated, with a gas or gas mixture again inserted into the package and then the pressure reduced with a pump. After pumping, the package may be heated to cause outgassing and to activate a getter. The pumping is performed with a mechanical pump, an ion pump, or a combination of the two types of pumps.
    Type: Grant
    Filed: May 26, 1998
    Date of Patent: July 25, 2000
    Assignee: Micron Technology, Inc.
    Inventors: Dan Dynka, David A. Cathey