Abstract: A method of testing a tester, comprising testing electronic units using a plurality of sites in order to obtain first bin assignment, instructing the tester to perform a tester quality test if conditions CiQA,1 and CiQA,2 are met, the tester quality test comprising performing a second plurality of tests on an electronic unit using a first site, thereby obtaining second bin assignment for the electronic unit, the second bin assignment being representative of passing or failing of the electronic unit of the second plurality of tests with respect to at least one second test criteria, wherein CiQA,1 is met if passing first bin assignment has been obtained for said electronic unit connected to the tester using the first site, and wherein CiQA,2 is met if data representative of passing first bin assignment obtained for electronic units which have been tested on the first site, meets a quality criteria.

Abstract: A method of testing a tester, comprising testing electronic units using a plurality of sites in order to obtain first bin assignment, instructing the tester to perform a tester quality test if conditions CiQA,1 and CiQA,2 are met, the tester quality test comprising performing a second plurality of tests on an electronic unit using a first site, thereby obtaining second bin assignment for the electronic unit, the second bin assignment being representative of passing or failing of the electronic unit of the second plurality of tests with respect to at least one second test criteria, wherein CiQA,1 is met if passing first bin assignment has been obtained for said electronic unit connected to the tester using the first site, and wherein CiQA,2 is met if data representative of passing first bin assignment obtained for electronic units which have been tested on the first site, meets a quality criteria.

Abstract: Disclosed are methods, systems and computer program products for concluding whether or not there is a correlation between a set of manufacturing condition(s) and performance of in-field end user devices. Also disclosed are methods, systems and computer program products for concluding whether or not there is an inconsistency in in-field end user devices data and/or manufacturing data associated with electronic elements included in end-user devices. In one example, a method includes analyzing received in-field data and/or data computed based on received in-field data, in order to determine whether or not there is a statistically significant difference in in-field performance between end-user devices including elements from a first population and end-user devices including elements from a second population, where manufacturing of the first population corresponds to a set of one or more manufacturing conditions, but manufacturing of the second population does not correspond to the set.

Abstract: Systems and methods for deciding whether or not to indicate misalignment. In some examples, an analysis of parametric data relating to tests sensitive to misalignment is performed in order to determine which data is incongruous and to identify corresponding probes or socket contacts as suspected misaligned. In some examples, additionally or alternatively, a spatial analysis quantifies the placement of a set of identified suspected misaligned probes, which were identified from pass/fail test data and/or parametric test data, with respect to a contiguous or non-contiguous area on one or more wafers.

Abstract: Systems and methods for deciding whether or not to indicate misalignment. In some examples, an analysis of parametric data relating to tests sensitive to misalignment is performed in order to determine which data is incongruous and to identify corresponding probes or socket contacts as suspected misaligned. In some examples, additionally or alternatively, a spatial analysis quantifies the placement of a set of identified suspected misaligned probes, which were identified from pass/fail test data and/or parametric test data, with respect to a contiguous or non-contiguous area on one or more wafers.