Patents by Inventor Dan Graves

Dan Graves has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8653675
    Abstract: Embodiments include but are not limited to apparatuses and systems including semiconductor packages, e.g. memory packages, including a die and an encapsulant material formed over the die, and at least one topological feature formed on an external surface of the encapsulant material, and configured to resist out-of-plane deformation of the package. Other embodiments may be described and claimed.
    Type: Grant
    Filed: November 30, 2009
    Date of Patent: February 18, 2014
    Assignee: Micron Technology, Inc.
    Inventors: James Jian Zhang, Jason Brand, Jacob Brooksby, Dejen Eshete, Myung Jin Yim, Ravikumar Adimula, Dan Graves
  • Publication number: 20110127642
    Abstract: Embodiments include but are not limited to apparatuses and systems including semiconductor packages, e.g. memory packages, including a die and an encapsulant material formed over the die, and at least one topological feature formed on an external surface of the encapsulant material, and configured to resist out-of-plane deformation of the package. Other embodiments may be described and claimed.
    Type: Application
    Filed: November 30, 2009
    Publication date: June 2, 2011
    Inventors: James Jian Zhang, Jason Brand, Jacob Brooksby, Dejen Eshete, Myung Jin Yim, Ravikumar Adimula, Dan Graves
  • Publication number: 20090306268
    Abstract: The present disclosure relates to aromatic polyester compositions, such as PET, comprising an unsaturated polymer prepared by metathesis polymerization having at least one or more specified terminal functional groups.
    Type: Application
    Filed: March 1, 2007
    Publication date: December 10, 2009
    Inventors: James Pawlow, William Hergenrother, Dan Graves