Patents by Inventor Dan Hariton

Dan Hariton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • USB system with spread spectrum EMI reduction
    Patent number: 7953175
    Abstract: A method for applying spread spectrum noise reduction techniques to USB specifically USB2.0 communications systems includes the step of generating a base (seed) frequency for the USB system, modulating the base (seed) frequency with a spread spectrum (SS) characteristic, and utilizing (as-is, not modified) the existing ASIC that multiplying the now modulated base (seed) frequency to generate the USB standard frequency signaling rate of 480 MHz with the SS characteristic within the USB standard specification for frequency deviation.
    Type: Grant
    Filed: July 27, 2007
    Date of Patent: May 31, 2011
    Assignee: ON Semiconductor Trading, Ltd.
    Inventors: Dan Hariton, Narendar Venugopal, Duoc Nguyen, Santosh K. Panigrahi, Gautam K. Singh, Sushl Kumar
  • USB system with spread spectrum EMI reduction
    Publication number: 20090028218
    Abstract: A method for applying spread spectrum noise reduction techniques to USB specifically USB2.0 communications systems includes the step of generating a base (seed) frequency for the USB system, modulating the base (seed) frequency with a spread spectrum (SS) characteristic, and utilizing (as-is, not modified) the existing ASIC that multiplying the now modulated base (seed) frequency to generate the USB standard frequency signaling rate of 480 MHz with the SS characteristic within the USB standard specification for frequency deviation.
    Type: Application
    Filed: July 27, 2007
    Publication date: January 29, 2009
    Inventors: Dan Hariton, Narendar Venugopal, Duoc Nguyen, Santosh K. Panigrahi, Gautam K. Singh, Sushl Kumar
  • High voltage pin for low voltage process
    Publication number: 20070159744
    Abstract: An integrated circuit is adapted for dual use in three different ways: 1) it is powered by either of two different low or high voltage sources; 2) it may be connected to the IC package voltage reference pin in two different ways, using either an on-chip internal resistor or an in-package external resistor to limit the voltage/current to the IC; 3) the ESD structures are used not only for their well-known circuit protection function, but also as a conductive path for the high voltage operating source.
    Type: Application
    Filed: January 6, 2006
    Publication date: July 12, 2007
    Inventors: Ramen Dutta, Chih-Jiann Chen, Dan Hariton, Jayanta Lahiri, May Vijay, Mark Sherwood