Patents by Inventor Dan Hewak

Dan Hewak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070273055
    Abstract: A method of fabricating a metamaterial is provided, comprising providing a sample of engineered microstructured material that is transparent to electromagnetic radiation and comprises one or more voids, passing through the voids a high pressure fluid comprising a functional material carried in a carrier fluid, and causing the functional material to deposit or otherwise integrate into the engineered microstructured material to form the metamaterial. Many microstructured materials and functional materials can be used, together with various techniques for controlling the location of the integration of the functional material within the microstructured material, so that a wide range of different metamaterials can be produced.
    Type: Application
    Filed: October 8, 2004
    Publication date: November 29, 2007
    Applicant: University of Southhampton
    Inventors: Pier Sazio, John Badding, Dan Hewak, Steven Howdle