Patents by Inventor Dan Hong
Dan Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20230304058Abstract: A 5?Cap analog having a Cap2 structure and a preparation method therefor. The molecular formula of the 5? Cap analog having a Cap2 structure is selected from any one of m7G(5?)ppp(5?)(2?OMeA)p(2?OMeG), m7G(5?)ppp(5?)(2?OMeG)p(2?OMeG), etc. The 5?Cap analog having a Cap2 structure has higher synthesis efficiency, higher capping efficiency, lower immunogenicity, and higher protein translation efficiency.Type: ApplicationFiled: October 29, 2020Publication date: September 28, 2023Inventors: Yong Hu, Miaomiao Zhang, Dan Hong, Xun Hu
-
Patent number: 9064028Abstract: Webpages configured for display on a full-sized screen such as a computer monitor (111) are reconfigured for use with a mobile device in accordance with a user's preferences. A custom rendering tool engages the user in customizing the webpage in order to render the webpage information suitable for display on a mobile device. A browser toolbar is used, by which the user may highlight a section of interest section (121) from a webpage and save the customization information. A proxy server receives the customization information and uses the information to accurately retrieve the sections of interest later, even after the webpage or the section has been updated.Type: GrantFiled: April 3, 2008Date of Patent: June 23, 2015Assignee: THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGYInventors: Vincent Yun Shen Shen, Benfeng Chen, Dan Hong, Kwok Chu Lo, Yongzhen Zhuang
-
Publication number: 20110281044Abstract: Composite structures may be formed using sheets of unidirectional fiber prepreg. Each of the prepreg sheets may include unidirectional fibers such as glass fibers and a binder such as plastic. The prepreg sheets may be wrapped around the outer surface of a drum. Ring-shaped sections of the wrapped sheets may be cut from the drum to form rings of prepreg layers. The prepreg rings may be placed into a mold cavity of a desired shape. While contained in stack of molds, prepreg rings may be cured by applying heat and pressure. Finished composite structures such as ring-shaped composite structures may be released from the molds following curing. The composite structures may be planar structures that have planar upper and lower surfaces and inner and outer edges. The fibers in the finished composite structures may run parallel to the upper and lower surfaces and parallel to the inner and outer edges.Type: ApplicationFiled: May 17, 2010Publication date: November 17, 2011Inventors: Spyros Michail, Kevin Kenney, Tommy Tang, Vinh Diep, Shannon Hsueh, Dan Hong
-
Publication number: 20100077321Abstract: Webpages configured for display on a full-sized screen such as a computer monitor (111) are reconfigured for use with a mobile device in accordance with a user's preferences. A custom rendering tool engages the user in customizing the webpage in order to render the webpage information suitable for display on a mobile device. A browser toolbar is used, by which the user may highlight a section of interest section (121) from a webpage and save the customization information. A proxy server receives the customization information and uses the information to accurately retrieve the sections of interest later, even after the webpage or the section has been updated.Type: ApplicationFiled: April 3, 2008Publication date: March 25, 2010Applicant: The Hong Kong University of Science and TechnologyInventors: Vincent Yun Shen Shen, Benfeng Chen, Dan Hong, Kwok Chu Lo, Yongzhen Zhuang
-
Patent number: 7636244Abstract: A computing device having an improved enclosure arrangement is disclosed. One aspect of the enclosure pertains to enclosure parts that are structurally bonded together to form a singular composite structure. In one embodiment, structural glue is used to bond at least two unique parts together. Another aspect of the enclosure pertains to enclosure parts that are electrically bonded together to form a singular integrated conductive member. In one embodiment, conductive paste is used to bond at least two unique parts together. The improved enclosure is particularly useful in portable computing devices such as laptop computers.Type: GrantFiled: December 29, 2006Date of Patent: December 22, 2009Assignee: Apple Inc.Inventors: Michael Kriege, Dan Hong, John DiFonzo, Stephen Zadesky, David Lynch, David Lundgren, Nick Merz
-
Patent number: 7310872Abstract: A computing device having an improved enclosure arrangement is disclosed. One aspect of the enclosure pertains to enclosure parts that are structurally bonded together to form a singular composite structure. In one embodiment, structural glue is used to bond at least two unique parts together. Another aspect of the enclosure pertains to enclosure parts that are electrically bonded together to form a singular integrated conductive member. In one embodiment, conductive paste is used to bond at least two unique parts together. The improved enclosure is particularly useful in portable computing devices such as laptop computers.Type: GrantFiled: August 27, 2004Date of Patent: December 25, 2007Assignee: Apple Inc.Inventors: Michael Kriege, Dan Hong, John DiFonzo, Stephen Zadesky, David Lynch, David Lundgren, Nick Merz
-
Publication number: 20070109737Abstract: A computing device having an improved enclosure arrangement is disclosed. One aspect of the enclosure pertains to enclosure parts that are structurally bonded together to form a singular composite structure. In one embodiment, structural glue is used to bond at least two unique parts together. Another aspect of the enclosure pertains to enclosure parts that are electrically bonded together to form a singular integrated conductive member. In one embodiment, conductive paste is used to bond at least two unique parts together. The improved enclosure is particularly useful in portable computing devices such as laptop computers.Type: ApplicationFiled: December 29, 2006Publication date: May 17, 2007Applicant: Apple Computer, Inc.Inventors: Michael Kriege, Dan Hong, John DiFonzo, Stephen Zadesky, David Lynch, David Lundgren, Nick Merz
-
Patent number: 7012189Abstract: A computing device having an improved enclosure arrangement is disclosed. One aspect of the enclosure pertains to enclosure parts that are structurally bonded together to form a singular composite structure. In one embodiment, structural glue is used to bond at least two unique parts together. Another aspect of the enclosure pertains to enclosure parts that are electrically bonded together to form a singular integrated conductive member. In one embodiment, conductive paste is used to bond at least two unique parts together. The improved enclosure is particularly useful in portable computing devices such as laptop computers.Type: GrantFiled: March 28, 2001Date of Patent: March 14, 2006Assignee: Apple Computer, Inc.Inventors: Michael Kriege, Dan Hong, John DiFonzo, Stephen Zadesky, David Lynch, David Lundgren, Nick Merz
-
Publication number: 20050023022Abstract: A computing device having an improved enclosure arrangement is disclosed. One aspect of the enclosure pertains to enclosure parts that are structurally bonded together to form a singular composite structure. In one embodiment, structural glue is used to bond at least two unique parts together. Another aspect of the enclosure pertains to enclosure parts that are electrically bonded together to form a singular integrated conductive member. In one embodiment, conductive paste is used to bond at least two unique parts together. The improved enclosure is particularly useful in portable computing devices such as laptop computers.Type: ApplicationFiled: August 27, 2004Publication date: February 3, 2005Inventors: Michael Kriege, Dan Hong, John DiFonzo, Stephen Zadesky, David Lynch, David Lundgren, Nick Merz
-
Publication number: 20020144032Abstract: A computing device having an improved enclosure arrangement is disclosed. One aspect of the enclosure pertains to enclosure parts that are structurally bonded together to form a singular composite structure. In one embodiment, structural glue is used to bond at least two unique parts together. Another aspect of the enclosure pertains to enclosure parts that are electrically bonded together to form a singular integrated conductive member. In one embodiment, conductive paste is used to bond at least two unique parts together. The improved enclosure is particularly useful in portable computing devices such as laptop computers.Type: ApplicationFiled: March 28, 2001Publication date: October 3, 2002Applicant: Apple Computer, Inc.Inventors: Michael Kriege, Dan Hong, John DiFonzo, Stephen Zadesky, David Lynch, David Lundgren, Nick Merz
-
Patent number: D861429Type: GrantFiled: February 19, 2019Date of Patent: October 1, 2019Inventor: Dan Hong Lin