Patents by Inventor Dan Jiao

Dan Jiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electromagnetic solutions for full-chip analysis
    Patent number: 7509247
    Abstract: A modeling method is provided that includes receiving a computational model of a structure and slicing the computational model into a plurality of circuit prints. The plurality of slices may include essential circuit prints and backfill circuit prints. Various unknowns may be eliminated between essential circuit prints of the computational model. The unknowns to be eliminated may include volume unknowns and backfill circuit-print unknowns. The numerical system formed by circuit-print unknowns may be divided into a plurality of blocks. The blocks may be solved in turn. One block may be solved by projecting the contributions from other blocks to this block. The solution of the one block may be translated to other blocks to solve unknowns therein. The computational model may then be solved to determine electromagnetic and circuit characteristics of the structure.
    Type: Grant
    Filed: April 5, 2005
    Date of Patent: March 24, 2009
    Assignee: Intel Corporation
    Inventors: Dan Jiao, Changhong Dai
  • Analyzing interconnect structures
    Patent number: 7289945
    Abstract: In one embodiment, an interconnect structure may be analyzed to determine electromagnetic characteristics of the structure by identifying structure seeds corresponding to the structure; modeling the structure seeds to obtain field patterns; and processing the field patterns to obtain the electromagnetic characteristics.
    Type: Grant
    Filed: October 28, 2002
    Date of Patent: October 30, 2007
    Assignee: Intel Corporation
    Inventors: Dan Jiao, Mohiuddin Mazumder, Changhong Dai
  • Electromagnetic solutions for full-chip analysis
    Publication number: 20060224373
    Abstract: A modeling method is provided that includes receiving a computational model of a structure and slicing the computational model into a plurality of circuit prints. The plurality of slices may include essential circuit prints and backfill circuit prints. Various unknowns may be eliminated between essential circuit prints of the computational model. The unknowns to be eliminated may include volume unknowns and backfill circuit-print unknowns. The numerical system formed by circuit-print unknowns may be divided into a plurality of blocks. The blocks may be solved in turn. One block may be solved by projecting the contributions from other blocks to this block. The solution of the one block may be translated to other blocks to solve unknowns therein. The computational model may then be solved to determine electromagnetic and circuit characteristics of the structure.
    Type: Application
    Filed: April 5, 2005
    Publication date: October 5, 2006
    Inventors: Dan Jiao, Changhong Dai
  • Analyzing interconnect structures
    Publication number: 20040082230
    Abstract: In one embodiment, an interconnect structure may be analyzed to determine electromagnetic characteristics of the structure by identifying structure seeds corresponding to the structure; modeling the structure seeds to obtain field patterns; and processing the field patterns to obtain the electromagnetic characteristics.
    Type: Application
    Filed: October 28, 2002
    Publication date: April 29, 2004
    Inventors: Dan Jiao, Mohiuddin Mazumder, Changhong Dai