Abstract: An exposed tube cold plate structure includes a plate body and a water cooling tube. The plate body is formed with a groove. The water cooling tube is pressed and inlaid in the groove. The water cooling tube has a water cooling tube passage for a working medium to flow through. The water cooling tube passage has a passage inner wall. Multiple raised bodies and multiple channels are annularly alternately disposed on the passage inner wall for greatly enlarging the contact area between the passage inner wall and the working medium. In addition, the working medium flows through the water cooling tube passage in a state of turbulent flow so as to enhance the heat exchange amount of the cold plate.

Abstract: A heat sink structure includes a plurality of radiation fins and a base. Each of the radiation fins has a connecting end and a free end, and internally defines a chamber extended between the connecting end and the free end for filling a working fluid therein. The base has an upper connecting surface provided with a plurality of connecting sections and a lower heat receiving surface in contact with a heat source. The connecting ends of the radiation fins are integrally connected to the connecting sections of the base in one-to-one correspondence through overmolding, so as to eliminate thermal resistance between the radiation fins and the base.

Abstract: A heat dissipation unit and a heat dissipation device using same are disclosed. The heat dissipation device includes a base and one or more heat dissipation units. The base has a first side and an opposite second side; and the heat dissipation units respectively include at least one radiation fin correspondingly provided on the first side of the base. The radiation fin is formed by correspondingly closing a first plate member and a second plate member to each other, such that a plurality of independent flow channels is defined between the closed first and second plate member. The independent flow channels communicate with each other. And, the independent flow channels respectively have an amount of working fluid filled therein.

Abstract: A roll bond plate evaporator structure is disclosed. The roll bond plate evaporator structure includes a heat dissipation member, at least one inlet and at least one outlet. The heat dissipation member is composed of a first plate body and a second plate body, which are correspondingly mated with each other. The first and second plate bodies together define a flow way. A working fluid is filled in the flow way. The inlet is formed at one end of the heat dissipation member in communication with the flow way and the outlet is formed at the other end of the heat dissipation member in communication with the flow way.

Abstract: A heat dissipation unit and a heat dissipation device using same are disclosed. The heat dissipation device includes a base and one or more heat dissipation units. The base has a first side and an opposite second side; and the heat dissipation units respectively include at least one radiation fin correspondingly provided on the first side of the base. The radiation fin is formed by correspondingly closing a first plate member and a second plate member to each other, such that a plurality of independent flow channels is defined between the closed first and second plate member. And, the independent flow channels respectively have an amount of working fluid filled therein.

Abstract: A vapor-liquid phase fluid heat transfer module includes: at least one evaporator having a first chamber inside, which containing a first working medium; at least one evaporator tube body having a first end, a second end and a condensation section positioned, the first and second ends communicating with the first chamber of the at least one evaporator to form a loop of the first working medium; at least one heat exchanger having a heat exchange chamber, a first face and a second face for the condensation section of the evaporator tube body to attach to; and at least one heat sink tube body, which communicating with the heat exchange chamber of the at least one heat exchanger and the at least one heat sink to form a loop of the second working medium.

Abstract: A manufacturing method of a roll bond plate evaporator structure is disclosed. The roll bond plate evaporator structure includes a heat dissipation member, at least one inlet and at least one outlet. The heat dissipation member is composed of a first plate body and a second plate body, which are correspondingly mated with each other. The first and second plate bodies together define a flow way. A working fluid is filled in the flow way. The inlet is formed at one end of the heat dissipation member in communication with the flow way and the outlet is formed at the other end of the heat dissipation member in communication with the flow way.

Abstract: A roll bond plate evaporator structure is disclosed. The roll bond plate evaporator structure includes a heat dissipation member, at least one inlet and at least one outlet. The heat dissipation member is composed of a first plate body and a second plate body, which are correspondingly mated with each other. The first and second plate bodies together define a flow way. A working fluid is filled in the flow way. The inlet is formed at one end of the heat dissipation member in communication with the flow way and the outlet is formed at the other end of the heat dissipation member in communication with the flow way.

Abstract: A heat dissipation unit and a heat dissipation device using same are disclosed. The heat dissipation device includes a base and one or more heat dissipation units. The base has a first side and an opposite second side; and the heat dissipation units respectively include at least one radiation fin correspondingly provided on the first side of the base. The radiation fin is formed by correspondingly closing a first plate member and a second plate member to each other, such that a plurality of independent flow channels is defined between the closed first and second plate member. The independent flow channels communicate with each other. And, the independent flow channels respectively have an amount of working fluid filled therein.

Abstract: A heat dissipation unit and a heat dissipation device using same are disclosed. The heat dissipation device includes a base and one or more heat dissipation units. The base has a first side and an opposite second side; and the heat dissipation units respectively include at least one radiation fin correspondingly provided on the first side of the base. The radiation fin is formed by correspondingly closing a first plate member and a second plate member to each other, such that a plurality of independent flow channels is defined between the closed first and second plate member. And, the independent flow channels respectively have an amount of working fluid filled therein.

Abstract: A two-phase fluid heat transfer structure includes: at least one evaporator having an evaporation chamber, which containing a first working medium; at least one evaporator tube body having a first end and a second end, which communicating with the at least one evaporator to form a loop of the first working medium, the at least one evaporator tube body further having a condensation section between the first and second ends; at least one heat sink; at least one heat sink tube body having a heat absorption section, which containing a second working medium, the at least one heat sink tube body being connected to the at least one heat sink; and at least one heat exchanger having a first face and a second face for the condensation section of the evaporator tube body and the heat absorption section of the heat sink tube body to attach to.

Abstract: A vapor-liquid phase fluid heat transfer module includes: at least one evaporator having a first chamber inside, which containing a first working medium; at least one evaporator tube body having a first end, a second end and a condensation section positioned, the first and second ends communicating with the first chamber of the at least one evaporator to form a loop of the first working medium; at least one heat exchanger having a heat exchange chamber, a first face and a second face for the condensation section of the evaporator tube body to attach to; and at least one heat sink tube body, which communicating with the heat exchange chamber of the at least one heat exchanger and the at least one heat sink to form a loop of the second working medium.

Abstract: A two-phase fluid heat transfer structure includes: at least one evaporator having an evaporation chamber, which containing a first working medium; at least one evaporator tube body having a first end and a second end, which communicating with the at least one evaporator to form a loop of the first working medium, the at least one evaporator tube body further having a condensation section between the first and second ends; at least one heat sink; at least one heat sink tube body having a heat absorption section, which containing a second working medium, the at least one heat sink tube body being connected to the at least one heat sink; and at least one heat exchanger having a first face and a second face for the condensation section of the evaporator tube body and the heat absorption section of the heat sink tube body to attach to.

Abstract: A manufacturing method of a cold plate structure comprises a plate body and a pipe. The plate body has a first side and a second side. A groove is formed on the second side. The pipe is embedded in the groove correspondingly. The pipe is filled with a gas. By means of the design of the present invention, the oxidation on the inner wall of the pipe can be avoided. Consequently, the operating efficiency is significantly increased and the manufacturing cost is reduced.

Abstract: A cold plate structure comprises a plate body and a pipe. The plate body has a first side and a second side. A groove is formed on the second side. The pipe is embedded in the groove correspondingly. The pipe is filled with a gas. By means of the design of the present invention, the oxidation on the inner wall of the pipe can be avoided. Consequently, the operating efficiency is significantly increased and the manufacturing cost is reduced.