Patents by Inventor Dan Kolides

Dan Kolides has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electromagnetic interference cover for an electronics module, method of manufacture therefore and an electronic equipment chassis employing the same
    Publication number: 20010040797
    Abstract: The present invention provides an electromagnetic interference (EMI) module cover for use in an electronics module that is configured to house electrical components that are capable of generating electromagnetic emissions that cause EMI. In one embodiment a conductive sidepanel has a resilient cantilever member formed therefrom with a fixed end that is integrally formed with the sidepanel and a movable end that is free of a module coupler, thereby allowing the resilient cantilever member to flex as the module is installed in a chassis. The resilient cantilever member has a boss that is formed proximate to the movable free end. The boss extends outward from the sidepanel a distance sufficient to provide a conductive path between the conductive sidepanel and an adjacent conductive surface when the module is installed in the chassis.
    Type: Application
    Filed: February 19, 2001
    Publication date: November 15, 2001
    Inventors: Michael R. Buskmiller, Vincent M. Byrne, Edward C. Fontana, Dan Kolides, Yehoshua Mandelcorn
  • Electromagnetic interference cover for an electronics module and an electronic equipment chassis employing the same
    Patent number: 6284970
    Abstract: The present invention provides an electromagnetic interference (EMI) module cover for use in an electronics module that is configured to house electrical components that are capable of generating electromagnetic emissions that cause EMI. In one embodiment a conductive sidepanel has a resilient cantilever member formed therefrom with a fixed end that is integrally formed with the sidepanel and a movable end that is free of a module coupler, thereby allowing the resilient cantilever member to flex as the module is installed in a chassis. The resilient cantilever member has a boss that is formed proximate to the movable free end. The boss extends outward from the sidepanel a distance sufficient to provide a conductive path between the conductive sidepanel and an adjacent conductive surface when the module is installed in the chassis.
    Type: Grant
    Filed: September 13, 1999
    Date of Patent: September 4, 2001
    Assignee: Lucent Technologies Inc.
    Inventors: Michael R. Buskmiller, Vincent M. Byrne, Edward C. Fontana, Dan Kolides, Yehoshua Mandelcorn