Patents by Inventor Dan Krstyen Benjamin

Dan Krstyen Benjamin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sealed force sensor with etch stop layer
    Patent number: 12332127
    Abstract: An example microelectromechanical system (MEMS) force sensor is described herein. The MEMS force sensor can include a sensor die configured to receive an applied force. The sensor die can include a first substrate and a second substrate, where a cavity is formed in the first substrate and where at least a portion of the second substrate defines a deformable membrane. The MEMS force sensor can also include an etch stop layer arranged between the first substrate and the second substrate, and a sensing element arranged on a surface of the second substrate. The sensing element can be configured to convert a strain on the surface of the membrane substrate to an analog electrical signal that is proportional to the strain.
    Type: Grant
    Filed: March 6, 2024
    Date of Patent: June 17, 2025
    Assignee: NextInput, Inc.
    Inventors: Julius Minglin Tsai, Ryan Diestelhorst, Dan Krstyen Benjamin
  • SEALED FORCE SENSOR WITH ETCH STOP LAYER
    Publication number: 20240247986
    Abstract: An example microelectromechanical system (MEMS) force sensor is described herein. The MEMS force sensor can include a sensor die configured to receive an applied force. The sensor die can include a first substrate and a second substrate, where a cavity is formed in the first substrate and where at least a portion of the second substrate defines a deformable membrane. The MEMS force sensor can also include an etch stop layer arranged between the first substrate and the second substrate, and a sensing element arranged on a surface of the second substrate. The sensing element can be configured to convert a strain on the surface of the membrane substrate to an analog electrical signal that is proportional to the strain.
    Type: Application
    Filed: March 6, 2024
    Publication date: July 25, 2024
    Inventors: Julius Minglin Tsai, Ryan Diestelhorst, Dan Krstyen Benjamin