Patents by Inventor Dan Kurtz

Dan Kurtz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fiber to wafer interface
    Patent number: 8724937
    Abstract: An interface device includes a body portion having a single-mode waveguide portion including a substantially optically transparent material, a cladding portion defined by channels contacting the waveguide portion, the cladding portion including a substantially optically transparent polymer material, an engagement feature operative to engage a portion of a wafer, and a guide portion operative to engage a portion of an optical fiber ferrule.
    Type: Grant
    Filed: December 20, 2011
    Date of Patent: May 13, 2014
    Assignees: International Business Machines Corporation, US Conec, Ltd.
    Inventors: Tymon Barwicz, Darrell R. Childers, Dan Kurtz
  • Fiber to Wafer Interface
    Publication number: 20130156365
    Abstract: An interface device includes a body portion having a single-mode waveguide portion including a substantially optically transparent material, a cladding portion defined by channels contacting the waveguide portion, the cladding portion including a substantially optically transparent polymer material, an engagement feature operative to engage a portion of a wafer, and a guide portion operative to engage a portion of an optical fiber ferrule.
    Type: Application
    Filed: December 20, 2011
    Publication date: June 20, 2013
    Applicants: US CONEC, LTD., INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Tymon Barwicz, Darrell R. Childers, Dan Kurtz