Patents by Inventor DAN-KYU KANG

DAN-KYU KANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR MODULE
    Publication number: 20240266305
    Abstract: A semiconductor module includes a board including a chip area and a tab area sequentially arranged in a first direction, a semiconductor chip provided on the chip area, a plurality of signal tabs provided on the tab area, and at least one anti-static portion having conductivity, provided in the tab area, and spaced apart from the plurality of signal tabs, where the plurality of signal tabs and the at least one anti-static portion are sequentially arranged in the first direction and the at least one anti-static portion is disposed on a line extending from at least one of the plurality of signal tabs in the first direction.
    Type: Application
    Filed: August 31, 2023
    Publication date: August 8, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jong-Hyun SEOK, Dan-Kyu KANG, Hwanwook PARK, Kang-Gyu LEE, Jeonghyeon CHO
  • Semiconductor module including semiconductor package and semiconductor package
    Patent number: 12025656
    Abstract: A semiconductor module includes a substrate; a plurality of semiconductor packages provided on the substrate; and an environment information indicator configured to display information related to an environment surrounding the plurality of semiconductor packages.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: July 2, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seyoung Won, Dan-Kyu Kang, Sang-Yeol Lee
  • Semiconductor module including semiconductor package and semiconductor package
    Patent number: 11953545
    Abstract: A semiconductor module includes a substrate; a plurality of semiconductor packages provided on the substrate; and an environment information indicator configured to display information related to an environment surrounding the plurality of semiconductor packages.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: April 9, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seyoung Won, Dan-Kyu Kang, Sang-Yeol Lee
  • SEMICONDUCTOR MODULE INCLUDING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE
    Publication number: 20210080501
    Abstract: A semiconductor module includes a substrate; a plurality of semiconductor packages provided on the substrate; and an environment information indicator configured to display information related to an environment surrounding the plurality of semiconductor packages.
    Type: Application
    Filed: November 30, 2020
    Publication date: March 18, 2021
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seyoung WON, Dan-Kyu KANG, Sang-Yeol LEE
  • Semiconductor module including semiconductor package and semiconductor package
    Patent number: 10908209
    Abstract: A semiconductor module includes a substrate; a plurality of semiconductor packages provided on the substrate; and an environment information indicator configured to display information related to an environment surrounding the plurality of semiconductor packages.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: February 2, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seyoung Won, Dan-Kyu Kang, Sang-Yeol Lee
  • SEMICONDUCTOR MODULE INCLUDING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE
    Publication number: 20180088173
    Abstract: A semiconductor module includes a substrate; a plurality of semiconductor packages provided on the substrate; and an environment information indicator configured to display information related to an environment surrounding the plurality of semiconductor packages.
    Type: Application
    Filed: September 26, 2017
    Publication date: March 29, 2018
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seyoung WON, Dan-Kyu KANG, Sang-Yeol LEE
  • Memory device, memory module including the memory device, method of fabricating the memory module, and method of repairing the memory module
    Patent number: 9672891
    Abstract: A memory module is provided. A plurality of DRAMs is mounted on a PCB. At least one DRAM has an operating parameter different from other DRAMs according to a position where the at least one DRAM is mounted on the PCB.
    Type: Grant
    Filed: February 4, 2016
    Date of Patent: June 6, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dan-Kyu Kang, Sang-Seok Kang, Young-Man Ahn
  • MEMORY DEVICE, MEMORY MODULE INCLUDING THE MEMORY DEVICE, METHOD OF FABRICATING THE MEMORY MODULE, AND METHOD OF REPAIRING THE MEMORY MODULE
    Publication number: 20160155487
    Abstract: A memory module is provided. A plurality of DRAMs is mounted on a PCB. At least one DRAM has an operating parameter different from other DRAMs according to a position where the at least one DRAM is mounted on the PCB.
    Type: Application
    Filed: February 4, 2016
    Publication date: June 2, 2016
    Inventors: DAN-KYU KANG, SANG-SEOK KANG, YOUNG-MAN AHN
  • Memory device, memory module including the memory device, method of fabricating the memory module, and method of repairing the memory module
    Patent number: 9286956
    Abstract: A memory module is provided. A plurality of DRAMs is mounted on a PCB. At least one DRAM has an operating parameter different from other DRAMs according to a position where the at least one DRAM is mounted on the PCB.
    Type: Grant
    Filed: July 1, 2014
    Date of Patent: March 15, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dan-Kyu Kang, Sang-Seok Kang, Young-Man Ahn
  • MEMORY DEVICE, MEMORY MODULE INCLUDING THE MEMORY DEVICE, METHOD OF FABRICATING THE MEMORY MODULE, AND METHOD OF REPAIRING THE MEMORY MODULE
    Publication number: 20150062999
    Abstract: A memory module is provided. A plurality of DRAMs is mounted on a PCB. At least one DRAM has an operating parameter different from other DRAMs according to a position where the at least one DRAM is mounted on the PCB.
    Type: Application
    Filed: July 1, 2014
    Publication date: March 5, 2015
    Inventors: DAN-KYU KANG, Sang-Seok Kang, Young-Man Ahn