Abstract: An inkjet external ink manifold is provided that allows for use of a jet stack that does not internally contain ink manifolds. The external ink manifold has a manifold body that includes one or more ink manifold chambers and includes ports arranged to connect the chambers to one or more ink reservoirs. The external ink manifold further includes an adhesive layer overlying and sealing the ink manifold chambers. The adhesive layer includes a plurality of ports arranged to connect the external ink manifold chambers to the jet stack.

Abstract: A printing system includes a print head to deliver ink to an image receptor and at least one ink reservoir to deliver ink to the print head. Driving circuitry provides signals to the print head to control delivery of the ink and a flexible circuit interposed between the print head and the ink reservoirs connects the driving circuitry to the print head. The flexible circuit may include a heater to provide heat to the ink reservoirs. Alternatively, the flexible circuit may be replaced with a rigid substrate having a heater within its layers.

Abstract: A drop generator including a pressure chamber defined by a chamber wall structure, a diaphragm plate disposed on the chamber wall structure and covering the pressure chamber, a piezoelectric transducer attached to the diaphragm plate, and a recess formed in the diaphragm plate and underlying an associated peripheral portion of the piezoelectric transducer such that the associated peripheral portion overhangs the recess.

Abstract: A printhead assembly that includes a partially-etched port structured to be opened by application of pressure to the port area, one or more leaflets being depressed into an internal chamber communicating with the open port.

Abstract: A connector frame for use in the connection of electrical circuit assemblies having pins integrally connected therewith. The connector frame is a body of electrically non-conductive, thermally conductive material having one or more apertures bored through the body, said apertures being through-plated with an electrically-conductive material having a lower melting point than any of the surrounding materials. Said body also includes at least one separate aperture in which is disposed an electrically-conductive, heat-generating wire, said wire having the capacity to generate sufficient heat to melt the electrically-conductive material disposed in the apertures to form a strong electrical and mechanical bond between the pins of the electrical circuit assemblies.

Abstract: A probe head of substantially rectangular construction for use in the testing of chips. The probe head has a body disposed about the perimeter of a substantially transparent fused silica window, probe points extending in a high-density fixed configuration through the fused silica window, and probe leads at one end of which the probe points are formed. The probe leads are disposed in a plurality of layers, such that interior surface, as well as perimeter, probing and testing of chips is facilitated. The probe head also includes a depth-limit plate extending over the edge of the fused silica window and connecting to the probe head body.