Abstract: An optical signal distribution network including a semiconductor substrate including a waveguide formed therein to carry an optical signal; and a plurality of detectors within the waveguide and serially arranged along its length, each of the detectors being capable of detecting the optical signal passing through it and sufficiently transparent to the optical signal to enable the optical signal to reach and be detected by all of the plurality of detectors.

Abstract: An optical signal distribution network including a semiconductor substrate including a waveguide formed therein to carry an optical signal; and a plurality of detectors within the waveguide and serially arranged along its length, each of the detectors being capable of detecting the optical signal passing through it and sufficiently transparent to the optical signal to enable the optical signal to reach and be detected by all of the plurality of detectors.

Abstract: A planarizing process is disclosed for planarizing an integrated circuit structure using a low melting inorganic planarizing material which comprises flowing while depositing a low melting inorganic planarizing layer such as a boron oxide glass over a layer of insulating material such as an oxide of silicon and then dry etching the low melting inorganic planarizing layer to planarize the structure. The method eliminates the need for separate coating, drying, and curing steps associated with the application of organic-based planarizing layers usually carried out outside of a vacuum apparatus. In a preferred embodiment, the deposition steps and the etching step are carried out without removing the integrated circuit structure from the vacuum apparatus. An additional etching step may be carried out after depositing the insulating layer and prior to deposition of the planarizing layer to remove any voids formed in the insulating layer.