Patents by Inventor Dan Moline

Dan Moline has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • RF power transistor having an encapsulated chip package
    Patent number: 7605451
    Abstract: In various embodiments, semiconductor components and methods to manufacture semiconductor components are disclosed. In one embodiment, a method to manufacture semiconductor components includes attaching multiple heat spreaders to a semiconductor wafer. Other embodiments are described and claimed.
    Type: Grant
    Filed: June 27, 2006
    Date of Patent: October 20, 2009
    Assignee: HVVi Semiconductors, Inc
    Inventor: Dan Moline
  • Semiconductor component and method of manufacture
    Publication number: 20070296077
    Abstract: In various embodiments, semiconductor components and methods to manufacture semiconductor components are disclosed. In one embodiment, a method to manufacture semiconductor components includes attaching multiple heat spreaders to a semiconductor wafer. Other embodiments are described and claimed.
    Type: Application
    Filed: June 27, 2006
    Publication date: December 27, 2007
    Inventor: Dan Moline